• 제목/요약/키워드: Electronic Connector

검색결과 62건 처리시간 0.025초

전자처리 스페클 패턴 간섭법(ESPI)을 이용한 3-유닛 고정성 국소의치의 변형특성 분석 (Deformation Characteristics Analysis of 3-Unit Fixed Partial Dentures by Using Electronic Speckle Pattern Interferometry)

  • 강후원;이철민;양승필;김희진
    • 대한치과기공학회지
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    • 제35권1호
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    • pp.49-56
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    • 2013
  • Purpose: The deformation characteristics induced by non-destructive stresses using piezoelectric transducer(PZT) were analyzed for 3-unit fixed partial dentures manufactured PFM, Everest(CAD/CAM) and Zirkonzahn(copy milling, MAD/MAM) by electron speckle pattern interferometery(ESPI). Methods: The ESPI analysis after loading the restoration with PZT by applying electric voltage of 900mV at the points of 10 mm above the base of the prostheses. Results: PFM and All-Ceramic Everest prostheses showed about 0.1 ${\mu}m$ while that of All- Ceramic Zirkonzahn prostheses showed 0.085 ${\mu}m$, demonstrating that Zirkonzahn displaced less. For PFM and All-Ceramic Zirkonzahn prostheses, the displacements were large at just below the loading point, while generalize displacement was shown over the loading point and weak connector areas for All-Ceramic Everest prostheses. Conclusion: We could find that the deformation characteristics induced by non-destructive stresses using PZT analyzed by ESPI were similar to the fracture strengths evaluated using universal testing machine.

계통연계형 에너지저장시스템의 위험우선순위 분석 (Analysis of Risk Priority Number for Grid-connected Energy Storage System)

  • 김두현;김성철;박전수;김은진;김의식
    • 한국안전학회지
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    • 제31권2호
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    • pp.10-17
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    • 2016
  • The purpose of this paper is to deduct components that are in the group of highest risk(top 10%). the group is conducted for classification into groups by values according to risk priority through risk priority number(RPN) of FMEA(Failure modes and effects analysis) sheet. Top 10% of failure mode among total potential failure modes(72 failure modes) of ESS included 5 BMS(battery included) failure modes, 1 invert failure mode, and 1 cable connectors failure mode in which BMS was highest. This is because ESS is connected to module, try, and lack in the battery part as an assembly of electronic information communication and is managed. BMS is mainly composed of the battery module and communication module. There is a junction box and numerous connectors that connect these two in which failure occurs most in the connector part and module itself. Finally, this paper proposes RPN by each step from the starting step of ESS design to installation and operation. Blackouts and electrical disasters can be prevented beforehand by managing and removing the deducted risk factors in prior.

안전모에 부착하는 MOB용 패치 안테나 (Patch Antenna for MOB Attached on Safety Helmet)

  • 김재원;양규식
    • 한국항행학회논문지
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    • 제20권1호
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    • pp.93-98
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    • 2016
  • 본 연구의 목적은 안전모에 장착하는 MOB용 마이크로스트립 패치 안테나를 설계하는 것이다. 패치 안테나는 $64{\times}64mm$ 크기의 기판 두께 0.2 mm FR-4기판에 제작되었으며, Inmarsat (1.52 ~ 1.65 GHz)과 GPS (1.575 GHz) 주파수 대역을 커버하도록 슬롯링 형태로 설계되었다. 안테나는 HFSS 프로그램을 사용하여 최적화된 파라미터를 도출하고, 이를 바탕으로 시뮬레이션 측정 결과 분석을 통해 설계되었다. 안테나는 식각 및 마이크로스트립 급전 방식으로 SMA 커넥터를 부착하여 제작되었고, 안테나의 설계치와 측정치를 비교 분석하였다. 제안된 안테나는 1.53 ~ 1.65 GHz 밴드를 커버함과 동시에 -10 dB 대역폭 조건도 만족하였다.

로봇을 위한 위치 인식 및 경로 안내 시스템에 관한 연구 (A Study on Location Recognition and Route Guide System for Service Robots)

  • 김용민;최인찬
    • 전자공학회논문지 IE
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    • 제47권1호
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    • pp.12-21
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    • 2010
  • 본 논문에서는 센서 네트워크를 이용하여 로봇 자신의 위치를 인식할 수 있는 위치인식 시스템을 제안하였다. 그리고 센서 네트워크에서 얻은 정보와 사용자의 운행 정보를 이용하여 사용자의 선호도 및 성향과 주변의 환경 상태를 판단하여 사용자에게 적합한 경로를 추천하는 지능형 네비게이션 시스템을 제안하였다. 이 시스템은 소프트 컴퓨팅 기법을 사용하여 인간의 선호도와 성향을 학습 및 추론하였다. 그리고 사용자와 모바일 로봇을 중계자 역할을 담당하고 휴대가 가능한 지능형 보조 모듈(IAM)을 정의하고 제안하였다. 마지막으로 제안한 알고리즘을 시뮬레이션을 통해 검증하였다.

스마트폰을 위한 미러링 및 효율적인 사용자 인터페이스 시스템 구현 (Implementation of Mirroring and Efficient User Interface System for Smart Phone)

  • 김정훈;고도영
    • 한국통신학회논문지
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    • 제40권2호
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    • pp.363-365
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    • 2015
  • 최근 스마트폰의 보급 확대와 더불어 스마트폰이 컴퓨터의 업무를 대체하는 환경에서 스마트폰의 작은 화면을 대형 TV나 컴퓨터용 모니터로 확대 미러링(mirroring)하는 방법들이 연구되고 있다. 본 논문에서는 스마트폰이나 스마트기기의 표준 5핀(MHL지원) 출력을 HDMI 포트의 모니터로 연결하여 화면 미러링과 동시에 블루투스 통신과 USB 호스트 기능을 이용하여 마우스와 키보드를 효율적으로 제어하여 스마트폰을 컴퓨터처럼 사용할 수 있는 시스템을 구현하였다. 본 연구의 결과는 독(dock) 형태와 모니터 일체형 시스템으로 각각 구현하였다.

에틸렌디아민을 착화제로 사용하는 팔라듐-니켈 합금도금 (Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent)

  • 최병하;손호상;김경태;손인준
    • 한국표면공학회지
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    • 제47권5호
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    • pp.215-220
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    • 2014
  • Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{\cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.

MOCVD 법에 의한 Bi-Te계 열전소재 제조 및 박막형 열전소자 제작 (Growth of Bi-Te Based Materials by MOCVD and Fabrication of Thermoelectric Thin Film Devices)

  • 권성도;주병권;윤석진;김진상
    • 한국전기전자재료학회논문지
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    • 제21권12호
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    • pp.1135-1140
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    • 2008
  • Bismuth-telluride based thin film materials are grown by Metal Organic Chemical Vapor Deposition(MOCVD). A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the sample was heated by heating block and the voltage output measured. As expected for a thermoelectric generator, the voltage decreases linearly, while the power output rises to a maximum. The highest estimated power of $1.3{\mu}W$ is obtained for the temperature difference of 45 K. we provide a promising procedure for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which may have nanostructure with high thermoelectric properties.

지지애자의 표면오염 모니터링 기술 및 장치 (Monitoring Technique and Device of Surface Contamination for Line-Post Insulator)

  • 길경석;박대원;정광석;김선재;서동환
    • 한국전기전자재료학회논문지
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    • 제23권5호
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    • pp.413-417
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    • 2010
  • Line to ground faults by deterioration of insulators has frequently occurred in power system, and the main cause is surface contamination of the insulators. The contamination of insulator is analyzed by monitoring the surface leakage current flowing them. The suspension insulator is monitored by installation of a zero-phase current sensor(ZCT), but the line-post insulator is impossible to apply the same method because of its large diameter structure. This paper proposed a detection method of surface leakage current for a line-post insulator, and it can easily be applied to new and/or built insulators. The leakage current is indirectly calculated from the potential difference between the metal electrode attached on the surface of insulator and the ground connector. To evaluate the performance of the proposed method, the leakage current is compared as a function of contamination condition controlled by the density of NaCl solution. The leakage current is proportioned to the density of NaCl solution, and the voltage detected by the electrode showed the same trend. From the experimental results, we designed and fabricated a monitoring device which is composed of a detection electrode, signal converter, microprocessor, and ZigBee, and its measurement range is $10{\mu}A{\sim}5mA$.

MOCVD를 이용한 $BiSbTe_3$ 박막성장 및 열전소자 제작

  • 권성도;윤석진;주병권;김진상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.425-425
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    • 2008
  • Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_2Te_3$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $4{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_2Te_3$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_2Te_3$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3mW is obtained at the temperature difference of 45K. We provide a promising approach for fabricating thin film thermoelectric generators by using MOCVD grown thermoelectric materials which can employ nanostructures for high thermoelectric properties.

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Optical MEMS 응용을 위한 광학 설계 (Characterization of Optical Design for Optical MEMS)

  • 엄용성;박흥우;박준희;최병석;이종현;윤호경;최광성;문종태
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
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    • pp.193-197
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    • 2003
  • As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

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