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http://dx.doi.org/10.5695/JKISE.2014.47.5.215

Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent  

Choi, Byungha (Department of Materials Science and Metallurgy, Kyungpook National University)
Sohn, Ho-Sang (Department of Materials Science and Metallurgy, Kyungpook National University)
Kim, Kyung Tae (Powder & Ceramic Materials Division, Korea Institute of Materials Science)
Son, Injoon (Department of Materials Science and Metallurgy, Kyungpook National University)
Publication Information
Journal of the Korean institute of surface engineering / v.47, no.5, 2014 , pp. 215-220 More about this Journal
Abstract
Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to $5000A{\cdot}m^{-2}$ because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEM observation.
Keywords
Palladium-Nickel Alloy; Electronic Connector; Ethylenediamine; Polarization Curve; Complexing Agent;
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Times Cited By KSCI : 1  (Citation Analysis)
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