• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.967_968
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• 2009

For lighting application, high-power LED nowadays is driven at 350mA and a sensing resistor is used to provide feedback for LED-current regulation. This method adds an IR drop at the output branch, and limits power efficiency as LED current is large and keeps increasing. In this paper, a power efficient LED-current sensing circuit is proposed. The circuit does not use any sensing resistor but extracts LED-current information from the output capacitor of the driver. Controlling the brightness of LEDs requires a driver that provides a constant, regulated current. In one case, the converter may need to step down the input voltage, and, in another, it may need to boost up the output voltage. These situations often arise in applications with wide-ranging ""dirty"" input power sources, such as automotive systems. And, the driver topology must be able to generate a large enough output voltage to forward bias the LEDs. So, to provide this requirements, 13W prototype Buck-Boost Converter is used.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1078-1080
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• 1995

The pulsed electro-acoustic method was used as a nondestructive measurement technique of spare charge distribution in dielectric materials. In our work presented here, we measured simultaneously the space charge distribution and conduction current in the low-density polyethylene samples with elevated temperatures up to $80^{\circ}C$ and electric field up to 20kV/mm. In the temperature less than $50^{\circ}C$, homocharges are mainly accumulated close to the electrodes under DC bias and after grounding. At the temperature exeeds $50^{\circ}C$, heterocharges are accumulated near the opposite electrode under DC bias. However after grounding the upper electrode, this charges immediately disappeared. The conduction current in LDPE at $20^{\circ}C$ and $30^{\circ}C$ was reduced slowly with increasing interval of applied voltage. But as temperature increased, the conduction current tended to increase slowly with the time and the degree of increase is enlarged.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.74-77
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• 2002

Ferroelectric Random Access Memory(FRAM) and MEMS applications require noble metal or refractory metal oxide electrodes. In this study, Ru thin films were etched using $O_2$+10% $CF_4$ plasma in an inductively coupled plasma(ICP) etching system. The etch rate of Ru thin films was examined as function of rf power, DC bias applied to the substrate. The enhanced etch rate can be obtained not only with increasing rf power and DC bias voltage, but also with small addition $CF_4$ gas. The selectivity of $SiO_2$ over Ru are 1.3. Radical densities of oxygen and fluorine in $CF_4/O_2$ plasma have been investigated by optical emission spectroscopy(OES). The etching profiles of Ru films with an photoresist pattern were measured by a field emission scanning electron microscope (FE-SEM). The additive gas increases the concentration of oxygen radicals, therefore increases the etch rate of the Ru thin films and enhances the etch slope. In $O_2$+10% $CF_4$ plasma, the etch rate of Ru thin films increases up to 10% $CF_4$ but decreases with increasing $CF_4$ mixing ratio.

• Analytical Science and Technology
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• v.7 no.2
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• pp.155-164
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• 1994

A conventional Grimm-type glow discharge source was constructed and applied to radio-frequency(13.56MHz) discharge for metal and ceramic analysis. We investigated the emission spectrum for aluminium and aluminium oxide and the influence of discharge operating paramaters including argon pressure, rf-power and DC-bias voltages at the sample-side electrode. Scanning Electron Microscope(SEM) also was used to investigate the effect of rf-sputtering on the microstructure formation of the aluminium oxide. Linear analytical calibration curves were constructed for Manganese and zinc element in samples of low alloy steel(BAS 401-405) and brass(NIST 1108-1117).

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.106-109
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• 2011

We investigated the etching characteristics of titanium nitride (TiN) thin film in $BCl_3$/Ar inductively coupled plasma. The etching parameters were the gas mixing ratio, radio frequency (RF) power, direct current (DC)-bias voltages and process pressures. The standard conditions were as follows: total flow rate = 20 sccm, RF power = 500 W, DC-bias voltage = -100 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate of TiN thin film and the selectivity of TiN to $Al_2O_3$ thin film were 54 nm/min and 0.79. The results of X-ray photoelectron spectroscopy showed no accumulation of etch byproducts from the etched surface of TiN thin film. The TiN film etch was dominated by the chemical etching with assistance by Ar sputtering in reactive ion etching mechanism, based on the experimental results.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.144-147
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• 2011

In this work, we present a study regarding the etching characteristics on titanium nitride (TiN) thin films using an inductively coupled plasma system. The TiN thin film was etched using a $N_2/BCl_3$/Ar plasma. The studied etching parameters were the gas mixing ratio, the radio frequency (RF) power, the direct current (DC)-bias voltages, and the process pressures. The baseline conditions were as follows: RF power = 500 W, DC-bias voltage = -150 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate and the selectivity of the TiN to the $SiO_2$ thin film were 62.38 nm/min and 5.7, respectively. The X-ray photoelectron spectroscopy results showed no accumulation of etching byproducts from the etched surface of the TiN thin film. Based on the experimental results, the etched TiN thin film was obtained by the chemical etching found in the reactive ion etching mechanism.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2395-2397
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• 2005

A low voltage operated piezoelectric RF MEMS in-line switch has been realized by using silicon bulk micromachining technologies for advanced mobile/wireless applications. The developed RF MEMS in-line switches were comprised of four piezoelectric cantilever actuators with an Au contact metal electrode and a suspended Au signal transmission line above the silicon substrate. The measured operation dc bias voltages were ranged from 2.5 to 4 volts by varying the thickness and the length of the piezoelectric cantilever actuators, which are well agreed with the simulation results. The measured isolation and insertion loss of the switch with series configuration were -43dB and -0.21dB (including parasitic effects of the silicon substrate) at a frequency of 2GHz and an actuation voltage of 3 volts.

• Proceedings of the KIEE Conference
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• 1994.11a
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• pp.199-201
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• 1994

The switching characteristics of $As_{10}Ge_{15}Te_{75}$ thin film were investigated under dc bias. It was found that the threshold voltage depends on thickness, electrode distance, annealing time and temperature, respectively. The threshold voltage is increased as the thickness and the electrode distance is increased, while the threshold voltage is decreased in proportion to the increased annealing time and temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.84-87
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• 2003

Carbon nitride ($CN_x$) films were prepared by reactive RF magnetron sputtering system with DC bias at various deposition conditions and the electrical properties were investigated. The films were characterized by fourier transform infrared (FTIR) spectroscopy, and X-ray photoelectron spectroscopy (XPS). The metal-insulator-semiconductor (MIS) capacitor which has $Al/CN_x/Si$ structure was designed and fabricated to investigate the capacitance-voltage (C-V) characteristics. Dielectric constant of carbon nitride films is very small.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.467-471
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• 1999

BN films were grown on silicon (l00) substrate by magnetically enhanced activated reactive evaporation (ME-ARE) with pulsed DC power instead of r.f. for substrate biasing. The deposited films were analyzed using Fourier transform infrared spectroscopy (FTIR) and transmission electron microscopy (TEM). FTIR results show that the intensity of absorption band of $sp^2$ bond of BN decreased and that of $sp^3$ bond of c-BN increased with increasing pulsed DC bias voltage applied to substrate. The initially grown layer at the interface was observed by TEM and considered to be of$ sp^2$-bonded BN. The cross-sectional and planar TEM micrographs show that the upper layer on the initial layer was the single phase c-BN. It is concluded that cubic boron nitride films could be synthesized by ME-ARE process with pulsed DC biasing.