• Journal of the Korean Magnetics Society
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• v.3 no.2
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• pp.87-93
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• 1993

Iron nitride (Fe-N) magnetic thin films were deposited using a DC magnetron sputtering system. Microstructures and magnetic properties were examined as a function of deposition power and nitrogen gas input ratio. The nitrogen content in the film was found to be the major factor determining the microstructure and the magnetic properties. The films deposited at low nitrogen input ratios have an $\alpha$-Fe structure of which the lattice is expanded due to the nitrogen atoms incorporated at the interstitial sites. As the nitrogen content in the film increases, the degree of lat-tice expansion increases and the value of saturation magnetization decreases linearly. The films with a high degree of lattice expansion give very low values of coercivity, which is attributed to the disturbance of colunmar growth and the decrease of surface roughness. Further increase in the nitrogen input ratio causes the phase transfonnation from $\alpha$-Fe to $Fe_{2-3}N$, resulting in the marked reduction in the saturation magnetization. The phase transformation occurs when, regardless of deposition conditions, the nitrogen content reaches at 15 at.% and the lattice is expanded by 5%.

• Journal of the Korean institute of surface engineering
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• v.35 no.6
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• pp.415-421
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• 2002

Ti-Si-N coating layers were codeposited on silicon wafer substrates by a DC reactive magnetron sputtering technique using separate titanium and silicon targets in $N_2$/Ar gas mixtures. The oxidation behavior of Ti-Si-N coating layers containing 4.0 at.%, 10.0 at.%, and 27.3 at.% Si was investigated at temperatures ranging from 600 to $960^{\circ}C$. The coating layers containing 4.0 at.% Si became fast oxidized from $600^{\circ}C$ while the coating layers containing 10.0 at.% Si had oxidation resistance up to $800^{\circ}C$. It was concluded that an increase in Si content to a level of 10.0 at.% led to the formation of finer TiN grains and a uniformly distributed amorphous Si3N4 phase along grain boundaries, which acted as efficient diffusion barriers against oxidation. However, the coating layers containing 27.3 at.% Si showed relatively low oxidation resistance compared with those containing 10.0 at.% Si. This phenomenon would be explained by the existence of free Si which was not nitrified in the coating layers containing 27.3 at.% Si.

• Korean Journal of Materials Research
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• v.20 no.1
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• pp.47-50
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• 2010

Various thicknesses of Al-doped ZnO (AZO) films were deposited on glass substrate using pulsed dc magnetron sputtering with a cylindrical target designed for large-area high-speed deposition. The structural, electrical, and optical properties of the films of various thicknesses were characterized. All deposited AZO films have (0002) preferred orientation with the c-axis perpendicular to the substrate. Crystal quality and surface morphology of the films changed according to the film thickness. The samples with higher surface roughness exhibited lower Hall mobility. Analysis of the measured data of the optical band gap and the carrier concentration revealed that there were no changes for all the film thicknesses. The optical transmittances were more than 85% regardless of film thickness within the visible wavelength region. The lowest resistivity, $4.13\times10^{-4}\Omega{\cdot}cm^{-1}$ was found in 750 nm films with an electron mobility $(\mu)$ of $10.6 cm^2V^{-1} s^{-1}$ and a carrier concentration (n) of $1.42\times10^{21} cm^{-3}$.

• Journal of the Korean institute of surface engineering
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• v.41 no.3
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• pp.88-93
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• 2008

Ir-Re thin films with Ti interlayer were deposited onto the tungsten carbide substrate by ion beam assisted DC magnetron sputtering. The Ir-Re films were prepared with targets of having two atomic percent of 7:3 and 5:5. The microstructure and surface analysis of the specimen were conducted by using SEM, XRD and AFM. Mechanical properties such as hardness and adhesion strength of Ir-Re thin film also were examined. The interlayer of pure titanium was formed with 100 nm thickness. The film growth of Ir-30at.%Re was faster than that of Ir-50at.%Re in the same deposition conditions. Ir-Re thin films consisted of dense and columnar structure irrespective of the different target compositions. The values of hardness and adhesion strength of Ir-30at.%Re thin film coated on WC substrate were higher than those of Ir-50at.%Re thin film.

• Journal of the Korean Applied Science and Technology
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• v.34 no.4
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• pp.1017-1024
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• 2017

Carbon thin films were deposited by HiPIMS(High Power Impulse Magnetron Sputtering). The properties and microstructures of carbon thin film were investigated with power, pressure, bias voltage and duty cycle. As the HiPIMS power increased, the deposition thickness increased and the surface tended to be rough. The increase in pressure also tended to make the surface rough, but the deposition thickness was not proportional to the pressure. As the bias voltage increased, the surface roughness became worse, the deposition thickness increased and then decreased from the critical bias voltage. Changes in the duty cycle have caused problems such as arcing, which is affected by the chamber structure and the size of the target. The $sp^2/sp^3$ fractions of thin films were estimated by XPS and it was confirmed that the fraction of thin films made by HiPIMS were larger than the fraction of thin films made by DC sputtering.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.10
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• pp.9-12
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• 2016

The process parameters of DC pulsed sputtering to produce a multi-layer thin film with light reflectance at a specific wavelength region were studied. The optical simulation of multi-layer thin films of the silicon dioxide ($SiO_2$) films with a low refractive index and the titanium dioxide ($TiO_2$) films with a high refractive index was done. Under a DC pulsed sputtering power of 2kW and 200 sccm(standard cubic centimeter per minute) argon gas, the silicon dioxide films with a refractive index of 1.46 in the range of oxygen gas ratios of 12% and a titanium dioxide film with a refractive index of 2.27 in the range of oxygen gas ratios of 1% were produced. The multi-layer structure of high refractive index/low refractive index/high refractive index was designed and fabricated. The characteristics of the fabricated multi-layer thin film structure showed a reflectance of more than 45% in the range, 780 to 1200nm. This multi-layer structure is expected to be used to block the near infrared wavelength light.

• Journal of the Korean Magnetics Society
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• v.21 no.6
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• pp.214-218
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• 2011

In this study, we have systematically investigated the effect of sputtering conditions on the microstructural properties of Ag/CoFeB thin film on MgO substrate. It was found that the crystallinity and surface roughness of the Ag film strongly depends on the Ar sputtering pressure and sputtering power. Epitaxial growth of Ag(100) film on MgO(100) substrate was achieved under the sputtering conditions of high sputtering power and elevated temperature. XRR (X-ray reflectivity) and high-resolution TEM (transmission electron microscopy) measurements also revealed the interfacial roughening in the Ag/CoFeB interface due to the island structure formation and intermixing between Ag and CoFeB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.2-64.2
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• 2011

Recently, Silicon Germanium (SiGe) alloys have been received considerable attention for their great potentials in advanced electronic and optoelectronic devices. Especially, microcrystalline SiGe is a good channel material for thin film transistor due to its advantages such as narrow and variable band gap and process compatibility with Si based integrated circuits. In this work, microcrystalline silicon-germanium films (${\mu}c$-SiGe) were deposited by DC/RF magnetron co-sputtering method using Si and Ge target on Corning glass substrates. The film composition was controlled by changing DC and RF powers applied to each target. The substrate temperatures were changed from $100^{\circ}C$ to $450^{\circ}C$. The microstructure of the thin films was analyzed by x-ray diffraction (XRD) and Raman spectroscopy. The analysis results showed that the crystallinity of the films enhances with increasing Ge mole fraction. Also, crystallization temperature was reduced to $300^{\circ}C$ with $H_2$ dilution. Hall measurements indicated that the electrical properties were improved by Ge alloying.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.254-257
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• 2008

We have investigated the effect of source/drain electrode deposition method on a performance of top gate structured ZnO TFT performance. TFT using S/D of ITO film, consisted of bi-layer which deposited by ion beam assisted sputtering at the initial stage then deposited by DC magnetron sputtering, showed better performance compared to that using S/D of ITO deposited by just DC magnetron sputtering. Two ITO films exhibited different grain shapes and these resulted in different etching properties. We also suspect that charge trapping on the glass substrate (back channel) during the ITO film deposition may influence the characteristics of top gate structured ZnO TFT.