• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.2
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• pp.430-439
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• 2004

This paper describes a design of 8192/2048-point FFT/IFFT processor (CFFT8k2k), which performs multi-carrier modulation/demodulation in OFDM-based DVB-T receiver. Since a large size FFT requires a large buffer memory, two design techniques are considered to achieve memory-efficient implementation of 8192-point FFT/IFFT. A hybrid structure, which is composed of radix-4 single-path delay feedback (R4SDF) and radix-4 single-path delay commutator (R4SDC), reduces its memory by 20% compared to R4SDC structure. In addition, a memory reduction of about 24% is achieved by a novel two-step convergent block floating-point scaling. As a result, it requires only 57% of memory used in conventional design, reducing chip area and power consumption. The CFFT8k2k core is designed in Verilog-HDL, and has about 102,000 Bates, RAM of 292k bits, and ROM of 39k bits. Using gate-level netlist with SDF which is synthesized using a $0.25-{\um}m$ CMOS library, timing simulation show that it can safely operate with 50-MHz clock at 2.5-V supply, resulting that a 8192-point FFT/IFFT can be computed every 164-${\mu}\textrm{s}$. The functionality of the core is fully verified by FPGA implementation, and the average SQNR of 60-㏈ is achieved.

• The Journal of the Acoustical Society of Korea
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• v.16 no.4
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• pp.76-84
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• 1997

In this paper, one of the core components of a mobile communication system, VCO(Voltage Controlled Oscillator) IC is designed. The VCO IC was designed, have realized as LC turned oscillator using varicap. LC sinusoidal tuned oscillator generally requires external inductors and thus remainding circuit is implemneted in monolithic IC. The circuit is fabricated using an 15 mask IC process and has a die size of 1150um${\times}$780um. The tests showed that VCO was operated at frequencies in the regions between 880MHz-915MHz in the control voltage range of 1V to 3V at 5V supply voltage and as the power supply was varied from 4.5V to 5.5V, the frequency varied 425KHz/V. The VCO IC has frequency shift of 1.97MHz/T, carrier level of -7dBm and power consumption of 16.7mA. Also it has phase noise of -80dBc/Hz, offset at 50KHz and harmonic response of center frequency is -41dBm. For the future development of the transceiver 1 chip, the previously mentioned external devices need to be incorporated into Si MMIC.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.747-749
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• 2012

This paper is analyzing the SoC policy of major nations as the U.S, Japan, Europe, Taiwan, China and draw the suggestions for the development of semiconductor industry in Korea. SoC is the non-memory semiconductor to support and put into action the function of system. SoC is big market over the 200billion dollars and have a huge potential for new IT convergence market. Developed countries as the US, Japan, and Europe have enforced the industrial competitiveness by company investment and Taiwan supported the SoC Industry by government fund. Korea is No.1 superpower in DRAM semiconductor, but very weak in SoC Industry. We should secure the competitiveness of SoC Industry by the development of core technology, planning the growth policy, and building the cooperative model to leap the SoC power nation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.5 s.335
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• pp.15-22
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• 2005

This paper proposes an efficient structure which is able to perform self-detection and self-repair for faults in a digital system by imitating the structure of living beings. The self-repair system is composed of artificial cells, which have homogeneous structures in the two-dimension, and spare cells. An artificial cell is composed of a logic block based on multiplexers, and a genome block, which controls the logic block. The cell is designed using DCVSL (differential cascode voltage switch logic) structure to self-detect faults. If a fault occurs in an artificial cell, it is self-detected by the DCVSL. Then the artificial cells which belong to the column are disabled and reconfigured using both neighbour cells and spare cells to be repaired. A self-repairable 2-bit up/down counter has been fabricated using Hynix $0.35{\mu}m$ technology with $1.14{\times}0.99mm^2$ core area and verified through the circuit simulation and chip test.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.12
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• pp.44-55
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• 2001

MAC(Multiply and ACcumulate) is the core operation of multimedia data processing. Because MAC units implemented on traditional DSP units or embedded processors have latency of three cycles and cannot operate on multiple data simultaneously, then, performances are seriously limited. Many high end general purpose microprocessors have SIMD MAC unit as a functional unit. But these high end MAC units must support pipeline structure for various operation modes and high clock frequency, which makes control logic complex and increases chip area. In this paper, a 64bit SIMD MAC unit for embedded processors is designed. It is implemented to have a latency of one clock cycle to remove pipeline control logics and a minimal area overhead for SIMD support is added to existing Booth multipliers.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.211-214
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• 2003

Current VOD embodiment way is embodied using PC base. However, achieved research that embody this by Embedded System that PC base is not. OS of this system used WindowsCE.net and x86core used having built-ined SC1200(National company's Geode's familys) by CPU and memory used 128MByte SDRAM. Used Mpeg Decoder for processing of video data, and used Enthernet Controller for Internet. Composite, component, S-Video of video output section of this system is and select one of these and connect on TV and did so that get into action. Actuality implementation manufactured necessary BIOS, WinodwsCE.NET Porting, DeviceDriver in system development and necessary simple Application in action confirmation, and Video Player used Window Media Player had included to WindowsCE.net. Therefore, treatise that see to supplement shortcomings of VOD service been embodying in current PC in Embedded System's form embody that there is sense do can.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.7
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• pp.1543-1551
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• 2011

Dithering scheme has been widely used to improve the resolution of DCO(Digitally Controlled Oscillator) in conventional ADPLLs(All Digital Phase Locked Loop). In this paper a new resolution improvement scheme is proposed where a simple DAC(Digital-to-Analog Converter) is employed to overcome the problems of dithering scheme. The frequencies are controled by varactors in coarse, fine, and DAC bank. The DAC bank consists of an inversion mode NMOS varactor. The other varactor banks consist of PMOS varactors. Each varactor bank is controlled by 8bit digital signal. The proposed DCO has been designed in a $0.13{\mu}m$ CMOS process. Measurement results shows that the designed DCO oscillates in 2.8GHz~3.5GHz and has a frequency tuning range of 660MHz and a resolution of 73Hz at 2.8GHz band. The designed DCO exhibits a phase noise of -119dBc/Hz at lMHz frequency offset. The DCO core consumes 4.2mA from l.2V supply. The chip area is $1.3mm{\times}1.3mm$ including pads.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.3C
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• pp.102-111
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• 2005

In this paper, we propose an advanced hardware architecture for the fast inter prediction engine of the video coding standard MPEG-4 AVC. We describe the algorithm and derive the hardware architecture emphasizing and real time operation of the quarter_pel based motion estimation. The fast inter prediction engine is composed of block segmentation, motion estimation, motion compensation, and the fast quarter_pel calculator. The proposed architecture has been verified by ARM-interfaced emulation board using Excalibur & Virtex2 FPGA, and also by synthesis on Samsung 0.18 um CMOS technology. The synthesis result shows that the proposed hardware can operate at 62.5MHz. In this case, it can process about 88 QCIF video frames per second. The hardware is being used as a core module when implementing a complete MPEG-4 AVC video encoder chip for real-time multimedia application.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.5
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Journal of Powder Materials
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• v.20 no.5
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• pp.355-358
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• 2013

Micro trench structures are applied in gratings, security films, wave guides, and micro fluidics. These micro trench structures have commonly been fabricated by micro electro mechanical system (MEMS) process. However, if the micro trench structures are machined using a diamond tool on large area plate, the resulting process is the most effective manufacturing method for products with high quality surfaces and outstanding optical characteristics. A nonferrous metal has been used as a workpiece; recently, and hybrid materials, including polymer materials, have been applied to mold for display fields. Thus, the machining characteristics of polymer materials should be analyzed. In this study, machining characteristics were compared between nonferrous metals and polymer materials using single crystal diamond (SCD) tools; the use of such materials is increasing in machining applications. The experiment was conducted using a square type diamond tool and a shaper machine tool with cutting depths of 2, 4, 6 and 10 ${\mu}m$ and a cutting speed of 200 mm/s. The machined surfaces, chip, and cutting force were compared through the experiment.