• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2005.10a
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• pp.173-177
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• 2005

리튬이온 2차전지(Lithium ion battery, LIB)는 기존에 사용되던 전지에 비해 에너지 밀도가 높고 충방전 사이클이 우수하다. 이 때문에 휴대전화와 노트북 등에 수요가 급속하게 증가하고 있으며 1995년 LIB의 생산량은 4천만 개에서 2004년에는 약 8억 개로 20배 이상 증가하였다. 이에 따라 폐LIB도 급속하게 증가하게 되어 전국적인 재활용 시스템의 확보가 필요한 실정이다. 본 연구에서는 폐LIB에 함유되어 있는 유가금속 중에서 리튬코발트옥사이드(이하 $LiCoO_2$)를 회수하기 위하여 분쇄기(orient vertical cutting mill)와 진동 Screen을 사용하여 유기분리막, 금속류(Aluminium foil, Copper foil, case 등) 그리고 전극물질(lithium cobalt oxide와 graphite 등의 혼합 분말)로 분리하였다. 전극물질에서 $LiCoO_2$와 graphite 분리를 위한 전처리 단계로서 $500^{\circ}C$ 정도의 열처리를 하여 $LiCoO_2$의 표면 성질을 변화시켜 부유선별에 의해 $LiCoO_2$와 graphite의 분리가 가능하도록 하였다. 부유선별 실험 결과 93% 이상의 순도를 가지는 $LiCoO_2$를 92% 이상 회수할 수 있었다.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.421-424
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• 2007

Thermal behavior of $Li_{1-x}CoO_2$ has been investigated employing DSC (Differential Scanning calorimetry) and TGA (Thermogravimetry Analyzer), and the crystal parameters were calculated from XRD (X-ray diffraction).for the commercial rectangular pouch cell(1000 mAh).The cathode materials coated over aluminium foil current collector is made up of a blend consisting of active material $LiCoO_2$(size $20\;{\mu}m$, 94 wt%), conducting material super p black (SPB, 3 wt%) and binder polyvinylidene fluoride (PVDF, 3 wt%). The anode is a mix consisting of carbon (92 wt%) and PVDF(8 wt%) coated over copper foil. The cells for the experiments were first preconditioned by cycling three times and stabilized at OCV=3.0, 3.5, 4.2, 4.35 and 4.5 V. The stabilized cathode material was used for thermal and crystal parameter investigations.

• Korean Journal of Optics and Photonics
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• v.32 no.3
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• pp.114-119
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• 2021

A large-area graphene sheet has been successfully grown on a copper-foil substrate by chemical vapor deposition (CVD) for industrial use. To screen out unsatisfactory graphene films as quickly as possible, noninvasive optical characterization in reflection geometry is necessary. Based on the optical conductivity of graphene, developed by the single-electron tight-binding method, we have investigated the optical-reflectance contrast. Depending on the four independent control parameters of layer number, chemical potential, hopping energy, and temperature, the optical-reflectance contrast can change dramatically enough to reveal the quality of the grown graphene sheet.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.192-200
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• 2023

Graphene, a two-dimensional material, has shown great potential in a variety of applications including microelectronics, optoelectronics, and graphene-based batteries due to its excellent electronic conductivity. However, the production of large-area, high-quality graphene remains a challenge. In this study, we investigated graphene growth on electrolytic copper foil using thermochemical vapor deposition (TCVD) to achieve a similar level of quality to the cold-rolled copper substrate at a lower cost. The combined effects of pre-annealing time, graphenized temperature, and partial pressure of hydrogen on graphene coverage and domain size were analyzed and correlated with the roughness and crystallographic texture of the copper substrate. Our results show that controlling the crystallographic texture of copper substrates through annealing is an effective way to improve graphene growth properties, which will potentially lead to more efficient and cost-effective graphene production. At a hydrogen partial pressure that is disadvantageous in graphene growth, electrolytic copper had an average size of 8.039 ㎛², whereas rolled copper had a size of 19.092 ㎛², which was a large difference of 42.1% compared to rolled copper. However, at the proper hydrogen partial pressure, electrolytic copper had an average size of 30.279 ㎛² and rolled copper had a size of 32.378 ㎛², showing a much smaller difference of 93.5% than before. This observation suggests this potentially leads the way for more efficient and cost-effective graphene production.

• Polymer(Korea)
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• v.35 no.4
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• pp.302-307
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• 2011

The parameters of silanol formation reaction of organosilane including solvent type, solution concentration, pH and hydrolysis time influence the adhesion property of 2 layer flexible copper clad laminate (FCCL). Especially, the hydrolysis reaction time of silane coupling agent affects the formation of the silanol groups and their self-condensation to generate oilgomeric structure to enhance the surface treatment as an adhesive promoter. In our study, we prepared the binary silane coupling agents to control hydrolysis reaction rate and surface energy after treatment of silane coupling agents for increasing the adhesive property between a copper layer and a polyimide layer. The surface morphology of rolled copper foil, as a function of the contents of the coated binary silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by hydrolysis rate and surface energy.

• Korean Journal of Metals and Materials
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• v.50 no.3
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• pp.237-242
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• 2012

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.586-590
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• 2009

The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.

• Journal of Korean Academy of Oral and Maxillofacial Radiology
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• v.29 no.1
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• pp.33-42
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• 1999

Geometrically standardized dental radiographs were taken. We prepared Digital Cu-Equivalent Image Analyzing System for quantitative assessment of mandible bone. Images of radiographs were digitized by means of Quick scanner and personal Mcquintosh computer. NIH image as software was used for analyzing images. A stepwedge composed of 10 steps of 0.1mm copper foil in thickness was used for reference material. This study evaluated the effects of step numbers of copper wedge adopted for calculating equation. kVp and exposure time on the coefficient of determination(r²)of the equation for conversion to Cu-equivalent image and the coefficient of variation and Cu-Eq value(mm) measured at each copper step and alveolar bone of the mandible. The results were as follows: 1. The coefficients of determination(r²) of 10 conversion equations ranged from 0.9996 to 0.9973(mean=0.9988) under 70kVp and 0.16 sec. exposure. The equation showed the highest r was Y=4.75614612-0.06300524x +0.00032367x² -0.00000060x³. 2. The value of r² became lower when the equation was calculated from the copper stepwedge including 1.0mm step. In case of including 0mm step for calculation. the value of r showed variability. 3. The coefficient of variation showed 0.11, 0.20 respectively at each copper step of 0.2, 0.1mm in thickness. Those of the other steps to 0.9 mm ranged from 0.06 to 0.09 in mean value. 4. The mean Cu-Eq value of alveolar bone was 0.14±0.02mm under optimal exposure. The values were lower than the mean under the exposures over 0.20sec. in 60kVp and over 0.16sec. in 70kVp. 5. Under the exposure condition of 60kVp 0.16sec.. the coefficient of variation showed 0.03. 0.05 respectively at each copper-step of 0.3, 0.2mm in thickness. The value of r² showed over 0.9991 from both 9 and 10 steps of copper. The Cu-Eq value and the coefficient of variation was 0.14±0.01mm and 0.07 at alveolar bone respectively. In summary. A clinical application of this system seemed to be useful for assessment of quantitative assessment of alveolar provided high coefficient of determination is obtained by the modified adoption of copper step numbers and the low coefficient of variation for the range of Cu-Equivalent value of alveolar bone from optimal kVp and exposure time for each x-ray machine.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.5
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.