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http://dx.doi.org/10.3365/KJMM.2012.50.3.237

The Influence of Additives on the Mechanical Properties of Electrodeposited Copper Foils  

Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Son, Kyu-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Song, Ram (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Hwang, Young-Kyu (Calix Electronic chemical Co., Ltd.)
Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Publication Information
Korean Journal of Metals and Materials / v.50, no.3, 2012 , pp. 237-242 More about this Journal
Abstract
The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.
Keywords
electrodeposite; copper foil; additive; elongation; surface morphology;
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Times Cited By KSCI : 1  (Citation Analysis)
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