Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Fabrication of Ultra Small Size Hole Array on Thin Metal Foil

초미세 금속 박판 홀 어레이 가공

  • 임성한 (한국기술교육대학교 기계정보공학부) ;
  • 손영기 (서울대학교 기계항공공학부) ;
  • 오수익 (서울대학교 기계항공공학부)
  • Published : 2006.02.01
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Abstract

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

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References

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