Browse > Article

Effect of Functionalized Binary Silane Coupling Agents by Hydrolysis Reaction Rate on the Adhesion Properties of 2-Layer Flexible Copper Clad Laminate  

Park, U-Joo (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Park, Jin-Young (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Kim, Jin-Young (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Kim, Yong-Seok (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Ryu, Jong-Ho (ILJIN Materials. Jochiwon Factory Wolsan Industrial Complex)
Won, Jong-Chan (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Publication Information
Polymer(Korea) / v.35, no.4, 2011 , pp. 302-307 More about this Journal
Abstract
The parameters of silanol formation reaction of organosilane including solvent type, solution concentration, pH and hydrolysis time influence the adhesion property of 2 layer flexible copper clad laminate (FCCL). Especially, the hydrolysis reaction time of silane coupling agent affects the formation of the silanol groups and their self-condensation to generate oilgomeric structure to enhance the surface treatment as an adhesive promoter. In our study, we prepared the binary silane coupling agents to control hydrolysis reaction rate and surface energy after treatment of silane coupling agents for increasing the adhesive property between a copper layer and a polyimide layer. The surface morphology of rolled copper foil, as a function of the contents of the coated binary silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by hydrolysis rate and surface energy.
Keywords
2-layer FCCL; adhesion; polyimide; binary silane coupling agent; hydrolysis rate;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By Web Of Science : 0  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
연도 인용수 순위
1 S. M. Yuen, C.-C. M. Ma, C.-L. Chiang, and C.-C. Teng, J. Nanomater., 786405 (2008).
2 C. Park, S. E. Lowther, J. G. Smith, Jr., J. W. Connell, P. M. Hergenrother, and T. L. St. Clair, Int. J. Adhes. Adhes., 20, 457 (2000).   DOI   ScienceOn
3 P. Walker, J. Adhesion Sci. Technol., 5, 279(1991).   DOI
4 J. Y. Park, J.-P. Lim, Y. S. Kim, H. M. Jung, J. H. Lee, J. H. Ryu, and J. C. Won, Polymer(Korea), 33, 525 (2009).
5 T. M. Alam, R. A. Assink, and D. A. Loy, Chem. Mater., 8, 2366 (1996).   DOI   ScienceOn
6 M. W. Daniels and L. F. Francis, J. Colloid Interface Sci., 205, 191 (1998).   DOI   ScienceOn
7 F. Beari, M. Brand, P. Jenkner, R. Lehnert, H. J. Metternich, J. Monkiewicz, and H. W. Siesler, J. Organomet. Chem., 625, 208 (2001).   DOI   ScienceOn
8 S. Naviroj, S. R. Culler, J. L. Koenig, and H. Ishida, J. Colloid Interface Sci., 97, 308 (1984).   DOI   ScienceOn
9 M.-C. B. Salon, M. Abdelmouleh, S. Boufi, M. N. Belgacem, and A. Gandini, J. Colloid Interface Sci., 289, 249 (2005).   DOI   ScienceOn
10 N. Inagaki, S. Tasaka, and A. Onodera, J. Appl. Polym. Sci., 73, 1645 (1999).   DOI   ScienceOn
11 J. Jang and T. Earmme, Polymer, 42, 2871 (2001).   DOI   ScienceOn
12 M. Tanoglu, S. H. Mcknight, G. R. Palmese, and J. W. Gillespie, Jr., Int. J. Adhes. Adhes., 18, 431 (1998).   DOI   ScienceOn
13 F. Barlow, A. Lostetter, and A. Elshabini, Microelectron. Reliab., 42, 1091(2002).   DOI   ScienceOn
14 J. Jang, J. Lee, and B.-H. Ahn, Polymer(Korea), 21, 582 (1997).