• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.18-23
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• 2012

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.1
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• pp.64-69
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• 2005

In this paper, we analyzed the nonlinear performance on the DS/CDMA Communication System. At the $BER=10^{-4}$, uniform chip waveforms have similar performance in the linear channel. However, non-uniform chip waveforms have about more 0.5[dB] power gain than the conventional raised-cosine chip waveforms. In the nonlinear HPA, non-uniform chip waveforms have worse BER performance than the uniform chip waveforms because of the high PAPR. In other words, non-uniform chip waveforms show similar performance as uniform chip waveforms if IBO (input back on) of 15[dB] is given.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.9
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• pp.259-269
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• 2012

With the lower supply voltage and the higher operating frequency in integrated circuits, the analysis of the power distribution network (PDN) including on-chip inductances becomes more important. In this paper, an effective inductance extraction method for a regular on-chip power grid structure is proposed. The loop inductance model applicable to chip layout is proposed and the inductance extraction tool using the proposed inductance model based on post layout RC circuits is developed. The accuracy of the proposed loop model and the developed tool is verified by comparing the test circuit simulation results with those from the partial element equivalent circuit (PEEC) model. The voltage fluctuation from the RLC circuits extracted by the developed tool was examined for the analysis of on-chip inductance effects. The significance of on-chip power grid inductance was investigated by the co-simulation of chip-package-PCB.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.83-93
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• 2014

It is a widespread concern that electrical interconnection based network-on-chip (NoC) will ultimately face the limitation in communication bandwidth, transmission latency and power consumption in the near future. With the development of silicon photonics technology, a hybrid optical network-on-chip (HONoC) which embraces both electrical- and optical interconnect, is emerging as a promising solution to overcome these problems. Today's leading edge systems-on-chips (SoCs) comprise heterogeneous many-cores for higher energy efficiency, therefore, extended study beyond regular topology based NoC is required. This paper proposes an energy and latency optimization topology design technique for HONoC taking into account the traffic characteristics of target applications. The proposed technique is implemented with genetic algorithm and simulation results show the reduction by 13.84% in power loss and 28.14% in average latency, respectively.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.4
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• pp.833-838
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• 2011

RFID system in manufacturing industry is used to collect, categorize, and process the data of products. To install RFID system for a large factory, a large amount of wired data communication network is necessary for RS232 communication. If the installed location of RFID system in the factory is changed or extended, a reinstallment is required for the already installed wired data network. A large amount of time/financial reinvestment is necessary for such reinstallation. By using wireless data communication network, however, the initial installation and reinstallation are very simple. In this paper, we implemented a wireless communication system and RFID system. We used the CC1020 chip for wireless communication system and EM4095 chip for RFID system. CC1020 chip enables highly-reliable data communication, and by setting a simple status register, it can switch between transmitting/receiving status and it can choose the desired frequency of either 400 MHz or 900 MHz. Also, Communication range is 50 m, if external antenna is used. EM4095 is a chip for RFID reader system with the carrier frequency of 125 KHz. This chip can implement the reader system by connecting a small number of components. And EM4100 was used for RFID system. EM4100 is read-only type. Atmega128 is used to control a wireless communication system and RFID system. We confirm that the system can communicate without error up to 50 m from sender. In the paper, the circuit diagram and operation program for CC1020 and RFID system are presented. The system used in the experiment is shown in pictures, and the data movement pattern of CC1020 is shown in the diagram, and the performance of each transmission method is presented.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.8
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• pp.22-30
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• 2009

Due to high levels of integration and complexity, the Network-on-Chip (NoC) approach has emerged as a new design paradigm to overcome on-chip communication issues and data bandwidth limits in conventional SoC(System-on-Chip) design. In particular, exponentially growing of energy consumption caused by high frequency, synchronization and distributing a single global clock signal throughout the chip have become major design bottlenecks. To deal with these issues, a globally asynchronous, locally synchronous (GALS) design combined with low power techniques is considered. Such a design style fits nicely with the concept of voltage-frequency-islands (VFI) which has been recently introduced for achieving fine-grain system-level power management. In this paper, we propose an efficient design methodology that minimizes energy consumption by VFI partitioning on an NoC architecture as well as assigning supply and threshold voltage levels to each VFI. The proposed algorithm which find VFI and appropriate core (or processing element) supply voltage consists of traffic-aware core graph partitioning, communication contention delay-aware tile mapping, power variation-aware core dynamic voltage scaling (DVS), power efficient VFI merging and voltage update on the VFIs Simulation results show that average 10.3% improvement in energy consumption compared to other existing works.

• Journal of information and communication convergence engineering
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• v.6 no.2
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• pp.122-128
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• 2008

Multiprocessor architectures and platforms, such as, a multiprocessor system on chip (MPSoC) recently introduced to extend the applicability of the Moore's law, depend upon concurrency and synchronization in both software and hardware to enhance design productivity and system performance. With the rapidly approaching billion transistors era, some of the main problem in deep sub-micron technologies characterized by gate lengths in the range of 60-90 nm will arise from non scalable wire delays, errors in signal integrity and non-synchronized communication. These problems may be addressed by the use of Network on Chip (NOC) architecture for future System-on-Chip (SoC). We have modeled a concurrent architecture for a customizable and scalable NOC in a system level modeling environment using MLDesigner (from MLD Inc.). Varying network loads under various traffic scenarios were applied to obtain realistic performance metrics. We provide the simulation results for latency as a function of the buffer size. We have abstracted the area results for NOC components from its FPGA implementation. Modeled NOC architecture supports three different levels of quality-of-service (QoS).

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.19-24
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• 1999

The multilayer chip band pass filter for mobile communication is fabricated and designed. The size, insertion loss, center frequency and band width of multilayer chip filter are 4.5$\times$4.4$\times$1.8[mm], 3.0[dB] and 700[MHz]$\pm$15[MHz] respectively. The chip filter using $BiNbO_4$with CuO 0.06wt% +$V_2O_5$.lwt% was fabricated by screen printing with Ag electrode after tape casting. Insertion loss and center frequency of the fabricated chip filter are 2.58[dB] and 692.5$\pm$15[MHz] respectively. The center frequency was lower 7.5[MHz] than design result, but other characteristics of chip filter were similar to the ruts ultras of design result.

• Journal of electromagnetic engineering and science
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• v.14 no.1
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• pp.43-45
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• 2014

We propose a printed circuit board (PCB)-embedded antenna for millimeter-wave chip-to-chip communication. The antenna is 0.18 mm in height which is 1/20 wavelength at 80 GHz. In order to realize such a low profile, a zeroth-order resonator antenna with a periodic array of four unit cells is employed, and its geometry is optimized to cover an 8-GHz bandwidth from 76 to 84 GHz. With this;the antenna is capable of radiating in a direction parallel to the board length despite the short distance between the ground and the radiator. Simulation and measurement results show that the optimized design has low reflection coefficients and consistent radiation patterns throughout the target bandwidth.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.1
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• pp.46-54
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• 2002

The world was opened by communication network because of fast improvement and diffusion of information communication. And information was effected in important factor that control economy improvement of the country. The country should improve the information security system because of necessity to maintain its information security independently. Therefore we have used the SEED cipher algorithm and designed the cipher chip of the voice band signal using the Xilinx Co. XCV300PQ240 chip. At the result we designed the voice signal cipher chip of the maximum frequency 47.895MHz and the total equivalent gate 27,285.