[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.5573/JSTS.2012.12.1.18

Implementation of Single-Wire Communication Protocol for 3D IC Thermal Management Systems using a Thin Film Thermoelectric Cooler

Kim, Nam-Jae (Department of Electrical Engineering, Chungbuk National Univ.)
Lee, Hyun-Ju (Department of Electrical Engineering, Chungbuk National Univ.)
Kim, Shi-Ho (School of Integrated Technology and Yonsei Institute of Convergence Technology, Yonsei Univ.)

Publication Information

JSTS:Journal of Semiconductor Technology and Science / v.12, no.1, 2012 , pp. 18-23 More about this Journal

Abstract

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

Keywords

3D IC cooling; thermoelectric cooler; single wire; communication; protocol; hot spot;

Citations & Related Records

Times Cited By KSCI : 1 (Citation Analysis)

Reference
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