• Bulletin of the Korean Chemical Society
• /
• v.22 no.7
• /
• pp.748-752
• /
• 2001

Alkanethiols (CH3(CH2)n-1SH) based self-assembled monolayers (SAMs) on the clean copper surfaces have been examined for n = 4, 8, and 16. Using X-ray photoelectron spectroscopy (XPS) and contact angle analysis, it is found that alkanethiolate monolayers similar to those on gold are formed on clean copper surfaces. The monolayers are stable in air up to about 140 $^{\circ}C.$ Above 160 $^{\circ}C$ the monolayers begin to desorb through the oxidation reaction of the thiolate to sulfonate, with the alkyl chains remaining intact. Following this desorption step, the copper surface has begun to oxidize to CuO at about 180 $^{\circ}C$.

• Carbon letters
• /
• v.1 no.3_4
• /
• pp.170-177
• /
• 2001

Lithium intercalated carbon (LIC) are basically employed as an anode for currently commercialized lithium secondary batteries. However, there are still strong interests in modifying carbon surface of active materials of the anode because the amount of irreversible capacity, charge-discharge capacity and high rate capability are largely determined by the surface conditions of the carbon. In this study, the carbonaceous materials were coated with tin oxide and copper by fluidized-bed chemical vapor deposition (CVD) method and their coating effects on electrochemical characteristics were investigated. The electrode which coated with tin oxides gave the higher capacity than that of raw material. Their capacity decreased with the progress of cycling possibly due to severe volume changes. However, the cyclability was improved by coating with copper on the surface of the tin oxides coated carbonaceous materials, which plays an important role as an inactive matrix buffering volume changes. An impedance on passivation film was decreased as tin oxides contents and it resulted in the higher capacity.

• Journal of the Korean Applied Science and Technology
• /
• v.32 no.3
• /
• pp.512-521
• /
• 2015

In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
• /
• 1999.10a
• /
• pp.34-38
• /
• 1999

This paper investigated remediation options for contaminated sediments with heavy metals. Twenty three sediment samples were taken from three different depths of 0.5m, 1.5m and 2.5m. The concentration of Heavy metals Cu, Pb, and Hg were measured. The concentration of copper far exceeded the Sediment Quality Guideline in U.S.A and Interim Sediment Quality Guidelines in Canada. Therefore, remediation of the sediments is requried to protect the benthos. Two remediation options were suggested : dredging of the organic sediments as deep as about 85cm followed by surface covers with clean soil, and in-situ stabilization of tile sediments using lime or cement followed by surface cover with clean soil.

• Clean Technology
• /
• v.27 no.3
• /
• pp.240-246
• /
• 2021

The waste etching solution for chip on film (COF) contained about 3.5% copper, and it was recovered through cementation using iron samples. The effect of cementation with plate, chip, and powder iron samples was investigated. The molar ratio (m/r) of iron to copper was used as a variable in order to increase the recovery rate of copper. As the molar ratio increased, the copper content in the solution rapidly decreased at the beginning of the cementation reaction. Before and after the reaction, the copper content of the solution was determined by Inductively Coupled Plasma (ICP) using copper concentration according to time. After cementation at room temperature for 1 hour, the recovery rate of copper had increased the most in the iron powder sample, having the largest specific surface area of the samples, followed by the chip and plate samples. The recovered copper powder was characterized for its crystalline phase, morphology, and elemental composition by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Energy-dispersive X-ray spectroscopy (EDS), respectively. Copper and unreacted iron were present together in the iron powder samples. The optimum condition for recovering copper was obtained using iron chips with a molar ratio of iron to copper of 4 giving a recovery rate of about 98.4%.

• Journal of the Korean Electrochemical Society
• /
• v.3 no.3
• /
• pp.173-177
• /
• 2000

The synthetic carbon was coated with tin oxide and copper by fluidized-bed chemical vapor deposition method. $(CH_3)_4Sn\;and\;Cu(hfac)_{2s}$ were employed as the metallic organic precursor, respectively. The modified synthetic carbons were used for lithium secondary battery anode to investigate their coating effects on electrochemical characteristics as alternative anode materials for lithium secondary batteries. The electrode which prepared by the synthetic carbons(MCMB) coated with tin oxide gave the higher capacity than that of raw material. Their capacity decreased with the progress of cycling possibly due to severe volume changes. But the cyclability was improved by coating with copper on the surface of the tin oxide coated carbon, which plays an important role as an inactive matrix buffering volume changes.

• Clean Technology
• /
• v.17 no.2
• /
• pp.103-109
• /
• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Environmental Engineering Research
• /
• v.15 no.1
• /
• pp.35-40
• /
• 2010

Bung Boraphet is the largest freshwater reservoir in Thailand. This study examined the accumulation of copper (Cu) and lead (Pb) in water, sediment and tissues of Asian clams (Corbicula sp.) within Bung Boraphet to assess the possible polluting effect of soil erosion and the dissolution of water soluble salts from the Nan River. Samples were collected from 12 study sites within Bung Boraphet between February and December 2008. The physicochemical parameters of the water including temperature, pH, turbidity, ammonia nitrogen, nitrate nitrogen, orthophosphates, biochemical oxygen demand, dissolved oxygen, Cu, and Pb were measured. The water in Bung Boraphet was found to be medium clean according to the surface water quality standard of Thailand. The levels of Cu and Pb in the water were low but heavy metals were detected at higher levels in the sediment and tissues of Corbicula sp. In the near future, management practices and regulator approaches for Cu and Pb contamination will be needed to protect the water in Bung Boraphet.

• Journal of the Korean Vacuum Society
• /
• v.15 no.1
• /
• pp.45-49
• /
• 2006

The changes in the optical anisotropy of the clean Cu(110) and the oxygen covered Cu(110) surfaces due to Cu growth have been studied by reflectance difference spectroscopy(RDS). We have monitored the growth mode of Cu atoms on Cu(110) and Cu(110)-(2XlO surfaces at 250K and checked the surfactant effect of oxygen during the Cu growth. For Cu grow on Cu(110) and Cu(110)-(2Xl)O surface at low temperature, we observed evidence for the layer-by-layer growth mode with change of 4.25eV peak intensity.

• Laser Solutions
• /
• v.4 no.3
• /
• pp.22-29
• /
• 2001

A development of new surface clwaning technol ogies such as laser and aerosol in paeallel with the improvement of conventional wet mwthods becomes more essential in semiconductor industry due the confrontation of new challenges such as significant device shrink, environmental foralum inum do not work for copper as a new interconnection material, and more effective cleaning tools are required with decreasing the feature size less than 0.13 ㎛ as well as increasing the wafer size from 200 ㎜ to 300 ㎜. In this article, various cleaning techniques increasing laser cleaning are compared methodolgically hi order to understand their unique characteristics such as advantages and disadvantages according to the current clean ing issues. In particular, the current state of art of laser technique for semiconductors md prospects as a try cleaning method are described.