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http://dx.doi.org/10.7464/ksct.2021.27.3.240

A Study on the Cementation Reaction of Copper-containing Waste Etching Solution to the Shape of Iron Samples  

Kim, Bo-Ram (Advanced Materials and Processing Center, Institute for Advanced Engineering (IAE))
Jang, Dae-Hwan (Advanced Materials and Processing Center, Institute for Advanced Engineering (IAE))
Kim, Dae-Weon (Advanced Materials and Processing Center, Institute for Advanced Engineering (IAE))
Publication Information
Clean Technology / v.27, no.3, 2021 , pp. 240-246 More about this Journal
Abstract
The waste etching solution for chip on film (COF) contained about 3.5% copper, and it was recovered through cementation using iron samples. The effect of cementation with plate, chip, and powder iron samples was investigated. The molar ratio (m/r) of iron to copper was used as a variable in order to increase the recovery rate of copper. As the molar ratio increased, the copper content in the solution rapidly decreased at the beginning of the cementation reaction. Before and after the reaction, the copper content of the solution was determined by Inductively Coupled Plasma (ICP) using copper concentration according to time. After cementation at room temperature for 1 hour, the recovery rate of copper had increased the most in the iron powder sample, having the largest specific surface area of the samples, followed by the chip and plate samples. The recovered copper powder was characterized for its crystalline phase, morphology, and elemental composition by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Energy-dispersive X-ray spectroscopy (EDS), respectively. Copper and unreacted iron were present together in the iron powder samples. The optimum condition for recovering copper was obtained using iron chips with a molar ratio of iron to copper of 4 giving a recovery rate of about 98.4%.
Keywords
Waste etching solution; Iron samples; Copper recovery; Cementation;
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1 El-Nasr, R. S., Abdelbasir, S. M., Kamel, A. H., and Hassan, S. S., "Environmentally Friendly Synthesis of Copper Nanoparticles from Waste Printed Circuit Boards," Sep. Purif. Technol., 230, 115860 (2020).   DOI
2 Lee, S. H., Yoo, K., and Lee, J. C., "Preparation of Cu2O Powder in NaOH solution Using CuCl Obtained from Spent Printed Circuit Boards Etchant," JKSMER, 55(3), 194-199 (2018).
3 Stefanowicz, T., Osinska, M., and Napieralska-Zagozda, S., "Copper Recovery by the Cementation Method," Hydrometallurgy, 47(1), 69-90 (1997).   DOI
4 Nam, S. W., Jang, K. S., and Youm, K. H., "Recycling of Acidic Etching Waste Solution Containing Heavy Metals by Nanofiltration (II): Dead-end Nanofiltration of PCB Etching Waste Solution Containing Copper Ion," Membr. J., 23(1), 92-99 (2013).
5 Eltaweel, Y. A., Nassef, E. M., and Hazza, R. A., "Recovery of Copper from Wastewater by Cementation Technique," World Environment, 4(5), 199-205 (2014).
6 Jhajharia, R., Jain, D., Sengar, A., Goyal, A., and Soni, P. R., "Synthesis of copper powder by mechanically activated cementation," Powder Technol., 301, 10-15 (2016).   DOI
7 Murr, L. E., and Annamalai, V., "An Electron Microscopic Study of Nucleation and Growth in Electrochemical Displacement Reactions: A Comparison of the Cu/Fe and Cu/AI Cementation Systems," Metallurgical Transactions B, 9(4), 515-525 (1978).   DOI
8 Kim, J. H., Lee, C. H., and Lee, C. H., "A Study on The Coagulation Characteristics of The Aluminium Etching Waste," Clean Technol., 10(1), 1-7 (2004).
9 Yang, S. H., and Kim, Y., "Application of Ferrate (VI) for Selective Removal of Cyanide from Plated Wastewater," Clean Technol., 27(2), 168-173 (2021).   DOI
10 Chun, H. D., Roh, Y. M., Park, S. K., Kim, J. H., Shin, C. H., Kim, J. Y., and Ahn, J. W., "Separation of Nitric Acid and Acetic Acid from the Waste Acid in LCD Etching Process," Clean Technol., 14(2), 123-128 (2008).
11 Xie, F., and Wang, W., "Recovery of Copper and Cyanide from Waste Cyanide Solutions Using Emulsion Liquid Membrane with LIX 7950 as the Carrier," Environ. Technol., 38(15), 1961-1968 (2017).   DOI
12 Park, S. H., "Phosphoric Acid Recycling Technology of Waste Etchant Using Crystallization Process," Plant J., 5(2), 6-13 (2009).
13 Mdlovu, N. V., Chiang, C. L., Lin, K. S., and Jeng, R. C., "Recycling Copper Nanoparticles from Printed Circuit Board Waste Etchants Via a Microemulsion Process," J. Clean Prod., 185, 781-796 (2018).   DOI
14 Cakir, O., "Copper Etching with Cupric Chloride and Regeneration of Waste Etchant," J. Mater. Process. Technol., 175(1-3), 63-68 (2006).   DOI