• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.4
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• pp.445-453
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• 2015

A fully integrated cost-effective and low-power single chip Lithium-Ion (Li-Ion) battery protection IC (BPIC) for portable devices is presented. The control unit of the battery protection system and the MOSFET switches are integrated in a single package to protect the battery from over-charge, over-discharge, and over-current. The proposed BPIC enters into low-power standby mode when the battery becomes over-discharged. A new auto release function (ARF) is adopted to release the BPIC from standby mode and safely return it to normal operation mode. A new delay shorten mode (DSM) is also proposed to reduce the test time without increasing pin counts. The BPIC implemented in a $0.18-{\mu}m$ CMOS process occupies an area of $750{\mu}m{\times}610{\mu}m$. With DSM enabled, the measured test time is dramatically reduced from 56.82 s to 0.15 s. The BPIC chip consumes $3{\mu}A$ under normal operating conditions and $0.45{\mu}A$ under standby mode.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.10
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• pp.21-31
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• 1994

This paper describes the multichannel combined R2MFC/DTMF/CCT reciver which provides a signaling service functions for call processing control in digital switching system. Using the TMS320C25 DSP chip, we have implemented multi-function receriver shich processes 8 channels of R2MFC, DTMF, and CCT signals simultaneously. In order to increase the channel multiplicity of the combined receiver. R2MFC and CCT receiver were employed by discrete Fourier transform(DFT) method using Goertzel algorithm, and DTMFreceiver was employ by infinite impulse reponse(IIR) filtering method using 4KHz subsampling technique. The combined receiver has 4 function modes for each channel such as R2MFC, DTMF, CCT, and Idle modes. The function mode of each channel may be selected at any time by single-chip micro-controller(.mu.C). Hence, the number of channels assigned for each function mode can be adjusted dynamically according to the signaling traffic variations. From the experimental test results using the test-bed, it has been proved that the combined receiver statisfies all receiver satisfies all receiver specifications, and provides good channel multiplicity and performance, Therefore, it may give a great improvement than existing receiver in cost, reliability, availability, and serviceability.

• Proceedings of the Microbiological Society of Korea Conference
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• 2002.10a
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• pp.22-26
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• 2002

There are a number of ways in which environmental microbiology and microbial ecology will benefit from DNA micro array technology. These include community genome arrays, SSU rDNA arrays, environmental functional gene arrays, population biology arrays, and there are clearly more different applications of microarray technology that can be applied to relevant problems in environmental microbiology. Two types of the applications, bacterial identification chip and functional gene detection chip, will be presented. For the bacterial identification chip, a new approach employing random genome fragments that eliminates the disadvantages of traditional DNA-DNA hybridization is proposed to identify and type bacteria based on genomic DNA-DNA similarity. Bacterial genomes are fragmented randomly, and representative fragments are spotted on a glass slide and then hybridized to test genomes. Resulting hybridization profiles are used in statistical procedures to identify test strains. Second, the direct binding version of microarray with a different array design and hybridization scheme is proposed to quantify target genes in environmental samples. Reference DNA was employed to normalize variations in spot size and hybridization. The approach for designing quantitative microarrays and the inferred equation from this study provide a simple and convenient way to estimate the target gene concentration from the hybridization signal ratio.

• Journal of Conservation Science
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• v.5 no.1 s.5
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• pp.94-104
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• 1996

This study was carried on paper mulberry bast fibers, which were cut in the length of it's chip by three kinds. And they cooked by sodium hydroxide (NaOH) and ammonium oxalate (AMOX), and pulping process was studied to inquire some properties of hand made papers. The results were as follows. AMOX pulps had $10\~17\%$ higher than NaOH, but amounts of the residual lignin of it's pulps and residual ash were high, and it surely can't be superior. In the freeness of pulps, AMOX pulps were higher than that of NaOH, but they showed tendency to opposite in view of relation of chip's length kinds. For the AMOX pulps, the physical characteristics test results were higher long fiber pulps than short fiber pulps. Specially, in folding endurance long fiber pulps were a very strong. NaOH pulp's physical characteristics test had shown results that were opposite of there of the AMOX pulps, if the length of the fiber is longer, the strengthts generally decreased. To get the optimum fiber's length according to use of paper and pulping method, they must be fractionate chip's length. The long fibers in NaOH pulps affected the paper quality greatly to length of chips.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.193-201
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• 2011

Recently, mechanical reliabilities including a drop test have been a hot issue. In this paper, solder balls with new components which are Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-0.05N are introduced, and board level drop test for them are conducted under JEDEC standard in which the board with 15 flip chips is dropped as 1,500g acceleration during 0.5ms. The drop simulations are studied by using a implicit method in the ANSYS LS-DYNA, and modal analysis is made. Through both analyses, the solder balls with new components are evaluated under the drop. It is found that the maximum stress of each chip is occurred between the solder ball and the PCB, and the highest value among the maximum stresses in the chips is occurred on the chip nearest to fixed holes on the board in the drop tests and simulations.

• Design & Manufacturing
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• v.10 no.2
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.63-66
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• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.310-314
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• 2008

Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

• Proceedings of the KIEE Conference
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• 2005.07a
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• pp.365-367
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• 2005

This paper proposes a hardware of IED for power transformer protection that is well constructed using DSP chip and MPU chip. The performance of the adaptive relaying algorithm, by real-time testing in a prototype of it, has been verified. And test results indicate the proposed relaying of the IED was proven to be faster and more reliable.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.1137-1140
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• 1999

In this thesis, we research about Communication System Construction and Test-Bed Realization Method and Software’s Design with written program into Embedded Micro Controller’s restricted memory region using a DSP Chip to deal with mainly high speed communication. Tools used for modern communication network control use TI or AMD general chip class, but nevertheless responsibility for the point at issue, Analog Device is architecture design model moderated for small communication system. In this thesis, we present extended model, and realize basic case.