Electromigration and Thermomigration Characteristics in Flip Chip Sn-3.5Ag Solder Bump |
Lee, Jang-Hee
(Andong National University, School of Materials Science and Engineering)
Lim, Gi-Tae (Andong National University, School of Materials Science and Engineering) Yang, Seung-Taek (Package R&D Division, Hynix Semiconductor Inc.) Suh, Min-Suk (Package R&D Division, Hynix Semiconductor Inc.) Chung, Qwan-Ho (Package R&D Division, Hynix Semiconductor Inc) Byun, Kwang-Yoo (Package R&D Division, Hynix Semiconductor Inc.) Park, Young-Bae (Andong National University, School of Materials Science and Engineering) |
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