Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Highly Productive Process Technologies of Cantilever-type Microprobe Arrays for Wafer Level Chip Testing

  • Lim, Jae-Hwan (Department of Information and Communication Engineering, Pukyong National University) ;
  • Ryu, Jee-Youl (Department of Information and Communication Engineering, Pukyong National University) ;
  • Choi, Woo-Chang (MEMS/NANO Fabrication Center)
  • Received : 2012.12.27
  • Accepted : 2013.01.23
  • Published : 2013.04.25
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Abstract

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

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