1 |
M. Beiley, J. Leung and S. S. Wong, IEEE T Compon. Pack. T. B 18, 184 (1995) [DOI: http://dx.doi.org/10.1109/96.365507].
DOI
ScienceOn
|
2 |
M. D. Cooke, and D. Wood, Microsyst. Technol. 12, 1037 (2006) [DOI: http://dx.doi.org/10.1007/s00542-006-0118-y].
DOI
|
3 |
M. Zargari, J. Leung, S. S. Wong, and B. A. Wooley, IEEE. J. Solid-St. Circ. 34, 1118 (1999) [DOI: http://dx.doi. org/10.1109/4.777110].
DOI
ScienceOn
|
4 |
T. Hauck, W. H. Müller, and I. Schmadlak, Microsyst. Technol. 16, 1909 (2010) [DOI: http://dx.doi.org/10.1007/s00542-010- 1115-8].
DOI
|
5 |
T. H. Lin, H. Yang, C. K. Chao, and M. S. Yeh, Microsyst. Technol. 16, 1215 (2010) [DOI: http://dx.doi.org/10.1007/s00542-009- 0964-5].
DOI
|
6 |
F. Wang, X. Li, and S. Feng, J. Micromech. Microeng. 18, 1 (2008) [DOI: http://dx.doi.org/10.1088/0960-1317/18/5/055008].
DOI
ScienceOn
|
7 |
F. Wang, X. Li, N. Guo, Y. Wang, and S. Feng, J. Micromech. Microeng. 16, 1215 (2006) [DOI: http://dx.doi.org/10.1088/0960- 1317/16/7/014].
DOI
ScienceOn
|
8 |
W. C. Choi and J. Y. Ryu, Microsyst. Technol. 17, 143 (2011) [DOI: http://dx.doi.org/10.1007/s00542-010-1159-9].
DOI
|
9 |
W. C. Choi and J. Y. Ryu, Microsyst. Technol. 18, 333 (2012) [DOI: http://dx.doi.org/10.1007/s00542-012-1445-9].
DOI
|
10 |
B. H. Kim and J. B. Kim, J. Micromech. Microeng. 18, 1 (2008) [DOI: http://dx.doi.org/10.1088/0960-1317/18/7/075031].
DOI
ScienceOn
|
11 |
B. H. Kim, H. C. Kim, S. D. Choi, K. Chun, J. B. Kim, and J. H. Kim, J. Micromech. Microeng. 17, 1350 (2007) [DOI: http:// dx.doi.org/10.1088/0960-1317/17/7/018].
DOI
ScienceOn
|
12 |
S. Park, B. Kim, J. Kim, S. Paik, B. D. Choi, I. Jung, K. Chun, and D. I. Cho, J. Micromech. Microeng. 12, 650 (2002) [DOI: http:// dx.doi.org/10.1088/0960-1317/12/5/321].
DOI
ScienceOn
|
13 |
B. H. Kim, H. C. Kim, K. Chun, J. Ki, and Y. Tak, Jpn. J. Appl. Phys. 43, 3877 (2004) [DOI: http://dx.doi.org/10.1143/ JJAP.43.3877].
DOI
|
14 |
Y. Zhang and R. B. Marcus, IEEE J. Microelectromech. S. 8, 43 (1999) [DOI: http://dx.doi.org/10.1109/84.749401].
DOI
ScienceOn
|
15 |
L. S. Stephens, K. W. Kelly, S. Simhadri, A. B. McCandless, and E. I. Meletis, IEEE J. Microelectromech. S. 10, 347 (2001) [DOI: http://dx.doi.org/10.1109/84.946780]
DOI
ScienceOn
|
16 |
E. Mazza, S. Abel, and J. Dual, Microsyst. Technol. 2, 197 (1996) [DOI: http://dx.doi.org/10.1007/BF02739559].
DOI
|
17 |
Y. M. Kim, H. C. Yoon, and J. H. Lee, ETRI J. 27, 433 (2005) [DOI: http://dx.doi.org/10.4218/etrij.05.0104.0080].
DOI
ScienceOn
|