• Applied Microscopy
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• 제45권1호
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• pp.32-36
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• 2015

The microstructural features of FeCoCrNi, FeCoCrNiAl and FeCoCrNiSix (x=0, 5, 10, 15, 20) alloys have been investigated in the present study. The microstructure of FeCoCrNi alloy changes dramatically with equiatomic addition of Al. The fcc irregular shaped grain structure in the as-cast FeCoCrNi alloy changes into the bcc interconnected structure with phase separation of Al-Ni rich and Cr-Fe rich phases in the as-cast FeCoCrNiAl alloy. The microstructure of FeCoCrNi alloy changes with the addition of Si. With increasing the amount of Si, the fcc structure of the grains is maintained, but new phase containing higher amount of Si forms at the grain boundary. As the amount of Si increases, the fraction the Si-rich grain boundary phase increases.

• 한국진공학회지
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• 제20권3호
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• pp.189-194
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• 2011

실리콘 태양전지는 KOH 에칭 용액을 이용하여 texturing 시간을 다르게 하는 방법으로 표면의 texturing 상태를 다양하게 제작하였다. 그리고 $POCl_3$ 공정을 이용하여 n형 불순물을 도핑하여 pn접합을 만들었으며, 알루미늄 후면전극과 은 전면전극을 이용하여 Si-cell을 제작하였다. 피라미드 구조가 가장 크고 표면에 고르게 형성된 태양전지 셀에서 F.F. 계수가 높게 나타났으며, 효율도 높게 나타났다. texturing 형성이 잘 이루어진 셀인 경우 빛을 많이 흡수할 수 있고 회로 내부적으로는 직렬저항성분이 감소하여 단락전류성분이 현저히 증가하게 되어 최종적으로 효율이 증가되는 것을 확인하였다.

• 한국농공학회:학술대회논문집
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• 한국농공학회 2003년도 학술발표논문집
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• pp.131-134
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• 2003

The purpose of this study is for classification to do a short distance rural area with the object to the center to Cheongju area. This study used principal component analysis and geography information system, and it was disciplined oneself. It was done a study object region to Cheongju-si, Cheongwon-gun Goesan-gun, Eumseong-gun, and we divided an index by of 22 large class and 104 small class, and the SPSS analyzed the Principal Component Analysis. We used a Geography Information System, and it was made graphical data by the results that have finished Principal Component Analysis.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.104-108
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• 2015

Al thin films were deposited on TiN/Si(100) via metal-organic chemical vapor deposition using N-methylpyrrolidine alane as a precursor. Characterization of the deposited films were investigated with SEM, XRD, ${\alpha}$-step, AFM, 4-point probe. The early stage of Al thin film deposition was analyzed by in-situ surface reflectance measurement with laser and photometer apparatus. The surface reflectance were changed greatly during the initial 30~40 seconds. There were two increases and two decreases in the surface reflectance, thus the sequence of Al films were deposited at 8 significant points of the surface reflectance change. Surface topograph and cross-sectional view of each film were analyzed with SEM. Al films were grown in the complex mechanism of Volmer-Weber and Stranski-Krastanov process.

• Transactions on Electrical and Electronic Materials
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• 제14권5호
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• pp.246-249
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• 2013

Graphene was obtained on Cu foil by thermal decomposition method. A gas mixture of $H_2$ and $CH_4$ and an ambient annealing temperature of $1,000^{\circ}C$ were used during the deposition for 30 Min., and for the transfer onto $SiO_2/Si$ and Si substrates. The physical properties of graphene were investigated with regard to the effect ofnitrogen atom doping and the various substrates used. The G/2D ratio decreased when the graphene became monolayer graphene. The graphene grown on $SiO_2/Si$ substrate showed a low intensity of the G/2D ratio, because the polarity of the $SiO_2$ layer improved the quality of graphene. The intensity of the G/2D ratio of graphene doped with nitrogen atoms increased with the doping time. The quality of graphene depended on the concentration of the nitrogen doping and chemical properties of substrates. High-quality monolayer graphene was obtained with a low G/2D ratio. The increase in the intensity of the G/2D ratios corresponded to a blue shift in the 2D peaks.

• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.329-333
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• 2013

SiOC films were prepared by capacitively coupled plasma chemical vapor deposition, and the correlation between the binding energy by X-ray photoelectron spectroscopy and Arrhenius equation for ionization energy was studied. The ionization energy decreased with increase of the potential barrier, and then the dielectric constant also decreased. The binding energy decreased with increase of the potential barrier. The dielectric constant and electrical characteristic of SiOC film was obtained by Arrhenius equation. The dielectric constant of SiOC film was decreased by lowering the polarization, which was made from the recombination between opposite polar sites, and the dissociation energy during the deposition. The SiOC film with the lowest dielectric constant had a flat surface, which depended on how carbocations recombined with other broken bonds of precursor molecules, and it became a fine cross-linked structure with low ionization energy, which contributed to decreasing the binding energy by Si 2p, C 1s electron orbital spectra and O 1s electron orbital spectra. The dielectric constant after annealing decreased, owing to the extraction of the $H_2O$ group, and lowering of the polarity.

• 대한전자공학회논문지SD
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• 제44권3호
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• pp.1-5
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• 2007

SiOC 박막은 산소와 bistrimethylsilylmethane 전구체를 사용하여 CVD방법을 이용하여 만들었다. 유량비에 따라서 유기물, 하이브리드 그리고 무기물 특성의 3가지 특성으로 분류되어지는데 유기물의 특성을 지니는 박막에서 기공이 생성되었다 기공의 생성은 유전상수가 낮아지는 효과가 있으며, 본 연구에서는 기공이 형성되는 유기물 특성의 SiOC 박막내의 기공율을 Maxwell-Garnett 등식을 이용하여 계산하였다. 박막의 기공율은 IR분포에서 blue shift특성을 가지며, 기공율이 증가할수록 유전상수는 감소하였다.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2010년도 추계학술발표논문집 1부
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• pp.73-75
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• 2010

층간 절연막으로 사용 가능한 SiOC 박막에 대하여 유전상수가 낮아지는 원인을 이온에 의한 분극과 전자에 의한 분극에 대하여 측정하였다. MIS 구조를 이용하여 전형적인 C-V 측적법에 의하여 유전상수를 구하였으며, 굴절률을 측정하여 전자에 의한 분극의 효과에 의한 유전상수를 측정하고 서로 비교하였다. SiOC 박막의 화학적인 특성은 FTIR 분석을 이용하였으며, FTIR 분석에서 디컨벌류션한 데이터는 탄소의 함량에 대한 변화를 구하였다. 탄소의 함량변화는 굴절률의 변화와 비슷한 경향성을 나타내었으나, 유전상수와는 반비례하였다. 전자에 의한 분극의 효과는 유전상수가 떨어지는 것에 큰 영향을 주지는 않았으며, 이온에 의한 분극의 효과가 SiOC 박막의유전상수를 낮게 하는 효과가 더욱 크게 나타났다.

• 한국전기전자재료학회논문지
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• 제26권4호
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• pp.275-277
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• 2013

Thin-film transistors(TFTs) with silicon zinc tin oxide(SZTO) channel layer are fabricated by solution-process. The threshold voltage ($V_{th}$) shifted toward positive directly with increasing Si contents in SZTO system. Because the Si has a lower standard electrode potential (SEP) than Sn, Zn, thus degenerate the oxygen vacancy (VO). As a result, the Si act as carrier suppressor and oxygen binder in the SZTO as well as a $V_{th}$ controller.

• Transactions on Electrical and Electronic Materials
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• 제18권5호
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• pp.250-252
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• 2017

High-performance full swing logic inverters were fabricated using amorphous 1 wt% Si doped indium-zinc-oxide (a-SIZO) thin films with different channel layer thicknesses. In the inverter configuration, the threshold voltage was adjusted by varying the thickness of the channel layer. The depletion mode (D-mode) device used a TFT with a channel layer thickness of 60 nm as it exhibited the most negative threshold voltage (-1.67 V). Inverters using enhancement mode (E-mode) devices were fabricated using TFTs with channel layer thicknesses of 20 or 40 nm with excellent subthreshold slope (S.S). Both the inverters exhibited high voltage gain values of 30.74 and 28.56, respectively at $V_{DD}=15V$. It was confirmed that the voltage gain can be improved by increasing the S.S value.