• 제목/요약/키워드: Channel thickness

검색결과 555건 처리시간 0.03초

무접합 원통형 게이트 MOSFET에서 문턱전압이동 분석을 위한 문턱전압이하 전류 모델 (Subthreshold Current Model for Threshold Voltage Shift Analysis in Junctionless Cylindrical Surrounding Gate(CSG) MOSFET)

  • 정학기
    • 한국정보통신학회논문지
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    • 제21권4호
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    • pp.789-794
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    • 2017
  • 본 논문에서는 무접합 원통형 MOSFET의 해석학적 전위분포를 이용하여 문턱전압이하 전류모델을 제시하고 이를 이용하여 문턱전압이동을 해석하였다. 무접합 원통형 MOSFET는 채널을 게이트 단자가 감싸고 있기 때문에 캐리어 흐름을 제어하는 게이트 단자의 능력이 매우 우수하다. 본 연구에서는 쌍곡선 전위분포모델을 이용하여 포아송방정식을 풀고 이 때 얻어진 중심 전위분포를 이용하여 문턱전압이하 전류 모델을 제시하였다. 제시된 전류모델을 이용하여 $0.1{\mu}A$의 전류가 흐를 때 게이트 전압을 문턱전압으로 정의하고 2차원 시뮬레이션 값과 비교하였다. 비교결과 잘 일치하였으므로 이 전류모델을 이용하여 채널크기 및 도핑농도에 따라 문턱전압이동을 고찰하였다. 결과적으로 채널 반지름이 증가할수록 문턱전압이동은 매우 크게 나타났으며 산화막 두께가 증가할 경우도 문턱전압이동은 증가하였다. 채널 도핑농도에 따라 문턱전압을 관찰한 결과, 소스/드레인과 채널 간 도핑농도의 차이가 클수록 문턱전압은 크게 증가하는 것을 관찰하였다.

Si CMOS Extension and Ge Technology Perspectives Forecast Through Metal-oxide-semiconductor Junctionless Field-effect Transistor

  • Kim, Youngmin;Lee, Junsoo;Cho, Seongjae
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권6호
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    • pp.847-853
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    • 2016
  • Applications of Si have been increasingly exploited and extended to More-Moore, More-than-Moore, and beyond-CMOS approaches. Ge is regarded as one of the supplements for Si owing to its higher carrier mobilities and peculiar band structure, facilitating both advanced and optical applications. As an emerging metal-oxide device, the junctionless field-effect transistor (JLFET) has drawn considerable attention because of its simple process, less performance fluctuation, and stronger immunity against short-channel effects due to the absence of anisotype junctions. In this study, we investigated lateral field scalability, which is equivalent to channel-length scaling, in Si and Ge JLFETs. Through this, we can determine the usability of Si CMOS and hypothesize its replacement by Ge. For simulations with high accuracy, we performed rigorous modeling for ${\mu}_n$ and ${\mu}_p$ of Ge, which has seldom been reported. Although Ge has much higher ${\mu}_n$ and ${\mu}_p$ than Si, its saturation velocity ($v_{sat}$) is a more determining factor for maximum $I_{on}$. Thus, there is still room for pushing More-Moore technology because Si and Ge have a slight difference in $v_{sat}$. We compared both p- and n-type JLFETs in terms of $I_{on}$, $I_{off}$, $I_{on}/I_{off}$, and swing with the same channel doping and channel length/thickness. $I_{on}/I_{off}$ is inherently low for Ge but is invariant with $V_{DS}$. It is estimated that More-Moore approach can be further driven if Si is mounted on a JLFET until Ge has a strong possibility to replace Si for both p- and n-type devices for ultra-low-power applications.

DGMOSFET의 문턱전압과 스켈링 이론의 관계 (Relation of Threshold Voltage and Scaling Theory for Double Gate MOSFET)

  • 정학기
    • 한국정보통신학회논문지
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    • 제16권5호
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    • pp.982-988
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    • 2012
  • 본 연구에서는 이중게이트(Double Gate; DG) MOSFET에서 문턱전압과 스켈링 이론의 관계를 관찰하였다. 기존 MOSFET의 경우 채널크기에 스켈링 이론을 적용하여 전류 및 스위칭주파수를 해석하였다. 이에 본 연구에서는 이중게이트 MOSFET에서 문턱전압의 경우 스켈링 이론의 적용가능성을 관찰하기 위하여 문턱전압의 변화를 스켈링 인자에 따라 관찰하고 분석하였다. 이를 위하여 이미 검증된 포아송방정식의 해석학적 전위분포를 이용하였으며 이때 가우스함수의 전하분포를 사용하였다. 분석결과 문턱전압이 스켈링 인자에 따라 크게 변화하였으며 변화정도는 도핑농도의 스켈링에 따라 변화한다는 것을 관찰하였다. 특히 이중게이트의 특성상 채널두께 및 채널길이에 스켈링 이론을 적용할 때 가중치를 이용한 변형된 스켈링 이론을 적용함으로써 이중게이트 MOSFET에 가장 타당한 스켈링 이론에 대하여 설명할 것이다.

20nm이하 이중게이트 FinFET의 크기변화에 따른 서브문턱스윙분석 (Analysis of Dimension Dependent Subthreshold Swing for Double Gate FinFET Under 20nm)

  • 정학기;이종인;정동수
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2006년도 춘계종합학술대회
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    • pp.865-868
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    • 2006
  • 본 연구에서는 20nm이하 채널길이를 가진 이중게이트 FinFET에 대하여 문턱전압이하에서 서브문턱스윙을 분석하였다. 분석을 위하여 분석학적 전류모델을 개발하였으며 열방사 전류 및 터널링 전류를 포함하였다. 열방사전류는 포아슨방정식에 의하여 구한 포텐셜분포 및 맥스월-볼쯔만통계를 이용한 캐리어분포를 이용하여 구하였으며 터널링전류는 WKB(Wentzel-framers-Brillouin)근사를 이용하였다. 이 두 모델은 상호 독립적이므로 각각 전류를 구해 더함으로써 차단전류를 구하였다. 본 연구에서 제시한 모델을 이용하여 구한 서브문턱스윙값이 이차원시뮬레이션값과 비교되었으며 잘 일치함을 알 수 있었다. 분석 결과 10nm이하에서 특히 터널링의 영향이 증가하여 서브문턱스윙특성이 매우 저하됨을 알 수 있었다 이러한 단채널현상을 감소시키기 위하여 채널두께 및 게이트산화막의 두께를 가능한한 않게 제작하여야함을 알았으며 이를 위한 산화공정개발이 중요하다고 사료된다.

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A study on the structural performance of new shape built-up square column under concentric axial load

  • Kim, Sun-Hee;Yom, Kyong-Soo;Choi, Sung-Mo
    • Steel and Composite Structures
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    • 제18권6호
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    • pp.1451-1464
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    • 2015
  • Recently, in recognition of their outstanding structural performance, the use of Concrete Filled Steel Tube (CFT) columns has been increased. New shape welded built-up square tube was developed by the authors for broader usability using thin steel plates which were bent to be L-shaped (Channel) and each unit members were welded to form square steel tube as an cost-efficient use of expensive steel. In addition, since the rib placed at the center of the tube width acts as an anchor; higher load capacity of buckling is achievable. In order to apply the new shape built-up square columns, the structural behavior and stress distribution with parameter width of thickness (b/t), with and without rib were predicted. The New shape welded built-up square tube effectively delayed the local buckling of the steel tube, which led to a greater strength and ductility than regular HSS.

스트레스에 의한 핫-전자가 유기된 p-MOSFET의 게이트 산화막 두께 변화의 열화의 특성 분석 (Degradation Characteristics of Hot-Electron-Induced p-MOSFET's GateOxide Thickness Variations by Stress)

  • Yong Jae Lee
    • 전자공학회논문지A
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    • 제31A권1호
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    • pp.77-83
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    • 1994
  • Characteristics of hot-electron-induced degradation by AC, DC was investigated for p-MOSFET's(W/L=25/l$\mu$m) with sub-10nm RTP-CVD gate oxides. It was confirmed that the surface channel p-MOSFET of a thinner gate oxide shows less degradation. Mechanisms for this effect were analyzed using a simple MOS Device degradation model. It was found that the number of generated electron traps(fixed charge) is determined by the amount of peak gate current, dependent of the gate oxide thickness, and the major cause of the smaller degradation in the thinner gate oxide devices is the lower hot electron trapping carriers.

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Effect of Channel Scaling on Zinc Oxide Thin-Film Transistor Prepared by Atomic Layer Deposition

  • Choi, Woon-Seop
    • Transactions on Electrical and Electronic Materials
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    • 제11권6호
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    • pp.253-256
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    • 2010
  • Different active layer thicknesses for zinc oxide (ZnO) bottom-contact thin-film transistors (TFTs) were fabricated with a poly-4-vinyphenol polymeric dielectric using injector type atomic layer deposition. The properties of the ZnO TFTs were influenced by the active thickness and width-to-length (W/L) ratio of the device. The threshold voltage of ZnO TFTs shifted positively as the active layer thickness decreased, while the subthreshold slope decreased. The W/L ratio of ZnO TFTs also affected the mobility and subthreshold slope. An optimized TFT structure exhibited an on-tooff current ratio of above 106 with solid saturation.

Ti:LiNbO$_{3}$ 광도파로 제작 및 특성분석 (Fabrication and Characteristics Analysis of Ti:LiNbO$_{3}$ Optical Waveguide)

  • 윤형도;김성구;이한영;윤대원
    • 전자공학회논문지D
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    • 제35D권7호
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    • pp.109-116
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    • 1998
  • In this work was produced and analyzed a z-cut Ti:LiNbO$_{3}$ optical waveguide which applies for various optical devices.A waveguide channel with a thickness 8 .mu.m and a length 66,000.mu.m and a mach-zehnder interferometer type waveguide were fabricated at a diffusion temperature 1050.deg. C for 6-8hours in a wet $O_{2}$ environment. The resulting Ti:LiNbO$_{3}$ optical waveguide was measured to have a Ti-strip thickness of 950.angs. and low loss. Surfaces and cross-sections of a fabricated waveguide were analysed. The mode pattern anaysis revealed that the waveguide showed a single mode at a 1550nm wavelength. The effective dimension of the waveguide was calculated by measuring a gaussian profile; Wx=10.95.mu. and Wy=9.14.mu.m. a propagation loss, of 0.50dB/cm for a TM mode and 0.45dB/cm for a TE mode, was low enough to be accepatable for optical devices.

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비정질 실리콘 박막 트랜지스터에서 전계효과 이동도의 Chebyshev 근사 (Chebyshev Approximation of Field-Effect Mobility in a-Si:H TFT)

  • 박재홍;김철주
    • 전자공학회논문지A
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    • 제31A권4호
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    • pp.77-83
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    • 1994
  • In this paper we numerically approximated the field-effect mobility of a-Si:H TFT. Field-effect mobility, based on the charge-trapping model and new effective capacitance model in our study, used Chebyshev approximation was approximated as the function of gate potential(gate-to-channel voltage). Even though various external factors are changed, this formula can be applied by choosing the characteristic coefficients without any change of the approximation formula corresponding to each operation region. Using new approximated field-effect mobility formula, the dependences of field-effect mobility on materials and thickness of gate insulator, thickness of a-Si bulk, and operation temperature in inverted staggered-electrode a-Si:H TFT were estimated. By this was the usefulness of new approximated mobility formula proved.

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전자빔 리소그래피와 열처리를 이용한 탄소 나노구조물의 제작 및 바이오센싱 응용연구 (Fabrication of carbon nanostructures using electron beam lithography and pyrolysis for biosensing applications)

  • 이정아;이광철;박세일;이승섭
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1727-1732
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    • 2008
  • We present a facile, yet versatile carbon nanofabrication method using electron beam lithography and resist pyrolysis. Various resist nanopatterns were fabricated using a negative electron beam resist, SAL-601, and were then subjected to heat treatment in an inert atmosphere to obtain carbon nanopatterns. Suspended carbon nanostructures were fabricated by wet-etching of an underlying sacrificial oxide layer. Free-standing carbon nanostructures, which contain 122 nm-wide, 15 nm-thick, and 2 ${\mu}m$-long nanobridges, were fabricated by resist pyrolysis and nanomachining processes. Electron beam exposure dose effects on resist thickness and pattern widening were studied. The thickness of the carbon nanostructures was thinned down by etching with oxygen plasma. An electrical biosensor utilizing carbon nanostructures as a conducting channel was studied. Conductance modulations of the carbon device due to streptavidin-biotin binding and pH variations were observed.

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