• Ceramist
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• v.21 no.2
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2002-2008
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• 2012

In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Korean Journal of Materials Research
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• v.13 no.12
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• pp.769-774
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• 2003

In this paper, we report on the DC characteristics of the AlGaN/GaN HFETs using physical models on piezoelectric and thermal effects. Employing the models was found to be essential for a realistic prediction of the DC current-voltage characteristics of the AlGaN/GaN HFETs. Though use of the implementation of the physical models, peak drain current, transconductance, pinch-off voltage, and most importantly, the negative slope in the current were accurately predicted. The importance of the heat sink effect was demonstrated by the comparison of the DC characteristics of AlGaN/GaN HFETs fabricated from different substrates including sapphire, Si and SiC. Highest peak current was achieved from the device with SiC by an effective suppression of heat sink effect.

• Design & Manufacturing
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• v.10 no.3
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• pp.14-19
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• 2016

Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.8
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• pp.1172-1182
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• 2002

In the present study a general criterion for local thermal equilibrium is presented in terms of parameters of engineering importance which include the Darcy number, the effective Prandtl number of fluid, and the Reynolds number. For this, an order of magnitude analysis is performed for the case when the effect of convection heat transfer is dominant in a porous structure. The criterion proposed in this study is more general than the previous criterion suggested by Carbonell and Whitaker, because the latter is applicable only when conduction is the dominant heat transfer mode in a porous medium while the former can be applied even when convection heat transfer prevails. In order to check the validity of the proposed criterion for local thermal equilibrium, the forced convection phenomena in a porous medium with a microchanneled structure subject to an impinging jet are studied using a similarity transformation. The proposed criterion is also validated with the existing experimental and numerical results for convection heat transfer in various porous materials that include some of the parameters used in the criterion such as a microchannel heat sink with a parallel flow, a packed bed, a cellular ceramic, and a sintered metal. It is shown that the criterion presented in this work well-predicts the validity of the assumption of local thermal equilibrium in a porous medium.

• Journal of the Korean Ceramic Society
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• v.44 no.11
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• pp.622-626
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• 2007

Graphite is widely used in electronic industry due to its excellent electrical and thermal properties. However, graphite starts to oxidize around $400^{\circ}C$ that seriously degrades its properties. SiC coating can be applied to graphite foam to improve its high temperature oxidation resistance. In this research, SiC coating on graphite foam was made via preceramic polymer using a polyphenylcarbosilane. 20% of polyphenylcarbosilane in hexane solution was coated onto graphite by dip coating method. Thermal oxidation was carried out at $200^{\circ}C$ for crosslink of the preceramic polymer and the sample were pyrolysized at $800^{\circ}C{\sim}1200^{\circ}C$ under nitrogen to convert the preceramic polymer to SiC film. The microstructure of the SiC coating after pyrolysis was investigated using FESEM and oxidation resistance up to $800^{\circ}C$ was evaluated.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.7
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• pp.17-25
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• 2017

To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.

• Proceedings of the KAIS Fall Conference
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• 2012.05b
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• pp.762-764
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• 2012

본 연구에서는 잉곳을 절삭하여 웨이퍼를 만들 때 발생하는 슬러리로부터 SiC를 분리하고, 이를 재생시켜 다공성 SiC 세라믹 히트싱크를 제작하였다. 또한 제작 된 다공성 SiC 세라믹 히트싱크의 열적물성치를 레이저 플래쉬 방법으로 측정하였고 알루미늄 히트싱크와의 비교실험을 통해 다공성 SiC 세라믹 히트싱크의 방열성능을 검증하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.11
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• pp.1016-1021
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• 2008

The development of the first wall whose major function is to withstand high neutron and heat fluxes is a critical path to fusion power. The materials database and the fabrication technology are being developed for design, construction and safety operation of the fusion reactor. The first wall was designed to consist of the plasma facing armor, the heat sink layer and the supporting plates. and Porous materials are of significant interest due to their wide applications in catalysis, separation, lightweight structural materials. In this study, the characteristics of the sintering process of SiC ceramic, $SiC_f$/SiC composite and porous $C_f$/SiC composite have been introduced order to study of the fusion blanket materials and heat-exchange pannel.