Browse > Article
http://dx.doi.org/10.5762/KAIS.2012.13.5.2002

A Study on Development of Porous SiC Ceramic Heat Sink from Solar Wafering Slurry  

An, Il-Yong (Dept. of Mechanical Engineering, Graduate School of Kongju National University)
Lee, Young-Lim (Dept. of Mechanical and Automotive Engineering, Kongju National University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.13, no.5, 2012 , pp. 2002-2008 More about this Journal
Abstract
In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.
Keywords
SiC; Ceramic Heat Sink; Solar Wafering Slurry;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 M. L. Hunt and C. L. Tien, "Effects of Thermal Dispersion on Forced Convection in Fibrous Media", Int. J. Heat Mass Transfer, Vol. 31, pp.301-309, 1988   DOI   ScienceOn
2 K. Ichimiya, "A New Method for Evaluation of Heat Transfer between Solid Material and Fluid in a Porous Medium", ASME J. Heat Transfer, Vol. 121, pp. 978-983, 1999   DOI
3 V. V. Calmidi and R. L. Mahajan, "Forced Convection in High Porosity Metal Foams", ASME J. Heat Transfer, Vol. 122, pp. 557-565, 2000   DOI
4 S. J. Park and Y. L. Lee, "A Study on Optimization of Thermal Performance of a LED Head Light for Passenger Cars", Journal of the Korea Academia-Industrial cooperation Society, Vol. 13, No. 1, pp. 27-32, 2012   DOI
5 H. K. Noh and J. H. Lee, "Cooling Performance of an Electronic System Including Electronic Components Mounted with Heat Sink", The Korean Sosiety Mechanical Engineers, Vol. B, No. 22, Issue 2, pp. 253-266, 1998
6 J. H. Lee, J. M. Kim, J. H. Chun, C. H. Bea and M. W. Suh, "Development of Thermal Design Program for an Electronic Telecommunication System Using Heat Sink", The Korean Society Mechanical Engineers, Vol. 31, Issue 3, pp. 256-263, 2007   DOI
7 K. S. Lau and R. L. Mahajan, "Convective Heat Transfer from Longitudinal Fin Arrays in the Entry Region of Turbulent Flow", Int. J. of Electronic Packaging, Vol. 111, pp. 213-219, 1989   DOI
8 G. L. Lehmann and S. J. Kosteva, "A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sink", Transactions of the ASME, Vol. 112, pp. 234-240, 1990
9 Y. L. Lee, "Study of Laser Chemical Vapor Deposition of Silicon Carbide from Tetramethylsilane", The Korean Society Mechanical Engineers, Vol.26, Issue 9, pp. 1226-1233, 2002   DOI
10 V. Casalegno, P. Vavassori, M. Valle, M. Ferraris, M. Salvo and G. Pintsuk, "Measurement of Thermal Properties of a Ceramic/Metal Joint by Laser Flash Method", Journal of Nuclear Materials, Vol. 407, Issue 2, pp. 83-87, 2010   DOI