Journal of the Korea Academia-Industrial cooperation Society (한국산학기술학회논문지)

The Korea Academia-Industrial cooperation Society (한국산학기술학회)
권호 표지
DOI QR코드

DOI QR Code

The development of ultra high-speed metal film deposition system and process technology for a heat sink in digital devices

디지털 소자용 방열판 제작을 위한 초고속 금속필름 증착장치 및 공정기술 개발

  • Yoon, Hyo Eun (Department of Physics & Nano Science, Sun Moon University) ;
  • Ahn, Seong Joon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University) ;
  • Han, Dong Hwan (Department of BT-Convergent Pharmaceutical Engineering, Sun Moon University) ;
  • Ahn, Seungjoon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University)
  • 윤효은 (선문대학교 나노과학과) ;
  • 안성준 (선문대학교 기계ICT융합공학부) ;
  • 한동환 (선문대학교 BT융합제약공학과) ;
  • 안승준 (선문대학교 기계ICT융합공학부)
  • Received : 2017.04.06
  • Accepted : 2017.07.07
  • Published : 2017.07.31
Download PDF
⟨ Previous Next ⟩

Abstract

To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.

최근에 LED나 OLED와 같은 조명용 소자의 온도 상승에 따른 문제점을 개선하기 위하여 전기 도금 방법을 사용하여 제작한 두께가 두꺼운 금속 필름을 heat sink로 사용하고 있다. Cu 필름과 같은 두꺼운 금속 필름은 습식 방법인 전기 도금으로 제작하여 주로 소자의 방열판으로 사용되어 왔으나 건식의 증착 방법을 이용한 수 백 ${\mu}m$의 Cu 금속 필름에 대한 필요성이 요구되고 있다. 본 연구에서 설계 제작된 유도 가열 방식의 Cu 필름 증착 장비는 가열부가 세라믹 도가니 히터 부분과 세라믹 도가니 부분으로 분리된 이중 구조의 heating 방식을 채택하여 열 손실을 최소화 하고 보온 효과를 극대화시켰다. 또한 유도 가열 방식으로 초고속의 필름 증착 속도를 구현하였다. 그리고 열전도도가 높고 안정적인 두꺼운 Cu 필름 증착기술을 확보하고 최적화 하여 $1000{\AA}/s$의 증착율로 $100{\mu}m$의 필름을 증착 하였으며 ~2.0% 이내의 두께 균일도를 얻었다.

Keywords

References

  1. S. J. Chung, J. H. Lee, J. W. Jeong, J. J. Kim, & Y. T. Hong, "Substrate thermal conductivity effect on heat dissipation and lifetime improvement of organic light-emitting diodes," Applied Physics Letters, vol. 94, 25330, 2009. DOI: https://doi.org/10.1063/1.3154557
  2. G. Vamvounis, H. Aziz, N. X. Hu, & Z. D. Popovic, "Temperature dependence of operational stability of organic light emitting diodes based on mixed emitter layers," Synthetic Metals, vol. 143, no. 1, pp. 69-73, 2004. DOI: https://doi.org/10.1016/j.synthmet.203.10.014
  3. C. Garditz, A. Winnacker, F. Schindler, & R. Paetzold, "Impact of Joule heating on the brightness homogeneity of organic light emitting devices," Applied Physics Letters, vol. 90, no. 10, 103506, 2007. DOI: https://doi.org/10.1063/1.2711708
  4. D. B. Tuckerman, & R. F. W. Pease, "High-performance heat sinking for VLSI," IEEE Electron device letters, vol. 2, no. 5, pp. 126-129, 1981. DOI: https://doi.org/10.1109/EDL.1981.25367
  5. X. Zhou, J. He, L. S. Liao, M. Lu, X. M. Ding, X. Y. Hou, & S. T. Lee, "Real-time Observation of Temperature Rise and Thermal Breakdown Processes in Organic LEDs Using an IR Imaging and Analysis System," Advanced Materials, vol. 12, no.4, pp. 265-269, 2000. DOI: https://doi.org/10.1002/(SICI)1521-4095(200002)12:4<265::AID-ADMA265>3.0.CO;2-L
  6. J. R. Sheats, H. Antoniadis, M. Hueschen, & W. Leonard, "Organic electroluminescent devices," Science, vol. 273(5277), 884, 1996. DOI: https://doi.org/10.1126/science.273.5277.884
  7. Bing Dai, Jiwen Zhao, Victor Ralchenko, Andrey Khomich, Alexey Popovich, Kang Liu, Guoyang Shu, Ge Gao, Sun Mingqi, Lei Yang, Pei Lei, Jiecai Han, & Jiaqi Zhu, "Thermal conductivity of free-standing CVD diamond films by growing on both nuclear and sides," Diamond and Related Materials, vol. S0925-9635, no. 16, 30274-6, 2017.
  8. C. Zweben, "Revolutionary new thermal management materials," Electronics Cooling, vol. 11, no.2, pp. 36-37, 2005.
  9. J. Kong, A. M. Cassell, & H. Dai, "Chemical vapor deposition of methane for single-walled carbon nanotubes," Chemical Physics Letters, vol. 292, no.4, pp. 567-574, 1998. DOI: https://doi.org/10.1016/S0009-2614(98)00745-3
  10. H. Yabuta, M. Sano, K. Abe, T. Aiba, T. Den, H. Kumomi, & H. Hosono, "High-mobility thin-film transistor with amorphous $InGaZnO_4$ channel fabricated by room temperature rf-magnetron sputtering," Applied Physics Letters, vol. 89, no. 11, 112123, 2006. DOI: https://doi.org/10.1063/1.2353811
  11. S. E. Lee, & J. H. Lee, "Copper Via Filling Using Organic Additives and Wave Current Electroplating," Journal of the Microelectronics and Packaging Society, vol. 14, no. 3, pp. 37-42, 2007.
  12. B. Hwang, Y. J. Choi, H. B. Kim, & Y. R. Cho, "Evaluation of Moisture Penetration Characteristics of Metal-Coated PET Film," Korean Institute of Science and Technology Conference abstract, vol. 1, pp. 351-351, 2010.
  13. J. M. Seo, K. Y. Park, S. R. Lee, & C. Y. Lee, "Quality Management of ITO Thin Film for OLED Based on Relationship of Fabrication and Characteristics," Journal of Control Robot System Society, vol. 14, no.4, pp. 336-341, 2008.
  14. J. I. Jeong, & J. H. Yang, "Trend and Prospect of Thin Film Processing Technology," Journal of the Korean Magnetics Society, vol. 21, no. 5, pp. 185-192, 2011. DOI: https://doi.org/10.4283/JKMS.2011.21.5.185
  15. S. Y. Lee, S. Y. Kuack, M. J. Park, W. S. Kim, J. K. Lee, K. D. Choi, & H. K. Jung, "Eddy Current Loss of the Cooling Plate According to its Shape for 600 kJ SMES," The Korean Institute of Electrical Engineers Conference Proceedings, vol. 1 pp. 132-133, 2007.
  16. S. C. Hong, W. J. Kim, & J. P. Jung, "High-speed Cu filling into TSV and non-PR bumping for 3D chip packaging," Journal of the Microelectronics and Packaging Society, vol. 18, no. 4, pp. 49-53, 2011.
  17. J. B. Kim, H. S. Bae, K. H. Kim, S. W. Moon, G. J. Nam, & N. E. Kwon, "Analysis of a processed sample surface using SCM and AFM," Korean Society of Precision Engineering, vol. 23, no. 4, pp. 52-59, 2006.
  18. S. H. Lee, J. K. Kim, & D. G. Kim, "Diamond-like Carbon Coatings Prepared by Linear Ion Source with 20 kHz Discharge," Korean Society of Surface Engineering Conference abstract, vol. 1, pp. 262-262, 2012.
  19. K. W. Kim, S. G. Baek, B. J. Park, H. W. Kim, & I. J. Rhyu, "Applications of Focused Ion Beam for Biomedical Research," Applied Microscopy, vol. 40, no. 4, pp. 177-183, 2010.