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http://dx.doi.org/10.6117/kmeps.2016.23.4.035

Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package  

Heo, Yu Jin (SK-Hynix Inc.)
Kim, Hyo Tae (Nano Materials and Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.4, 2016 , pp. 35-41 More about this Journal
Abstract
Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.
Keywords
Thick film; ceramic-metal; camber-free; LED package; thermal property;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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