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http://dx.doi.org/10.5762/KAIS.2017.18.7.17

The development of ultra high-speed metal film deposition system and process technology for a heat sink in digital devices  

Yoon, Hyo Eun (Department of Physics & Nano Science, Sun Moon University)
Ahn, Seong Joon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University)
Han, Dong Hwan (Department of BT-Convergent Pharmaceutical Engineering, Sun Moon University)
Ahn, Seungjoon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.18, no.7, 2017 , pp. 17-25 More about this Journal
Abstract
To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.
Keywords
Heat sink; IVD; LED; Metal film; OLED; Ultra-high speed metal deposition;
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Times Cited By KSCI : 5  (Citation Analysis)
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