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방열기판 전극형성 기술 동향  

Kim, Dan-Bi (한국기계연구원 부설 재료연구소)
Kim, Ji-Won (한국기계연구원 부설 재료연구소)
Eom, Nu-Si-A (한국기계연구원 부설 재료연구소)
Im, Jae-Hong (한국기계연구원 부설 재료연구소)
Publication Information
Ceramist / v.21, no.2, 2018 , pp. 83-88 More about this Journal
Abstract
There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.
Keywords
Heat sink; PVD; Electroless plating; SAM;
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1 Caro, A. M., Armini, S., Richard, O., Maes, G., Borghs, G., Whelan, C. M., & Travaly, Y, "Bottom-Up engineering of subnanometer copper diffusion barriers using NH2-Derived Self-Assembled monolayers," Advanced Functional Materials, 20 [7] 1125-1131 (2010).   DOI
2 Kudr, J., Skalickova, S., Nejdl, L., Moulick, A., Ruttkay-Nedecky, B., Adam, V., & Kizek, R, "Fabrication of solid-state nanopores and its perspectives, Electrophoresis," 36 [19] 2367-2379 (2015).   DOI
3 Heo, Y. J., Kim, H. T., Kim, K. J., Nahm, S., Yoon, Y. J., & Kim, J, "Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package," Applied Thermal Engineering, 50 [1] 799-804 (2013).   DOI
4 Yin, L., Yang, L., Yang, W., Guo, Y., Ma, K., Li, S., & Zhang, J, "Thermal design and analysis of multichip LED module with ceramic substrate," Solid-State Electronics, 54 [12] 1520-1524 (2010).   DOI
5 Reynell, M, "Thermal analysis using computational fluid dynamics," Electronic Packaging and Production, 30 [10] 82-88 (1990).
6 Akram, S., & Wark, J. M, "Packaged Die on PCB with Heat Sink Encapsulant," (1999).
7 Devin, W. "Method of Forming Conductive Traces on Insulated Substrate, (2014).
8 Gandhi, D. D., Lane, M., Zhou, Y., Singh, A. P., Nayak, S., Tisch, U., ... & Ramanath, G, "Annealinginduced interfacial toughening using a molecular nanolayer," Nature, 447 [7142] 299-302 (2007).   DOI
9 Foster, H. A., Sheel, D. W., Sheel, P., Evans, P., Varghese, S., Rutschke, N., & Yates, H. M, "Antimicrobial activity of titania/silver and titania/copper films prepared by CVD," Journal of Photochemistry and Photobiology A: Chemistry, 216 [2] 283-289 (2010).   DOI
10 Chang, C., & Jean, J, "Effects of Silver-Paste formulation on camber development during the cofiring of a Silver-Based, Low-Temperature-Cofired ceramic package," Journal of the American Ceramic Society, 81 [11] 2805-2814 (1998).   DOI
11 Xinwei, W., Xiaoyan, Z., Beidi, Z., & Kun, C, "Technique of laser cladding ceramic-metal composite coatings [J]," Heat Treatment of Metals, 4 40-44 (1996).
12 Zhao, Y., Bao, C., Feng, R., & Chen, Z, "Electroless coating of copper on ceramic in an ultrasonic field," Ultrasonics Sonochemistry, 2 [2] S99-S103 (1995).   DOI
13 Osaka, T., Nagata, H., Nakajima, E., Koiwa, I., & Utsumi, K, "Metalization of AlN ceramics by electroless Ni-P plating," Journal of the Electrochemical Society, 133 [11] 2345-2349 (1986).   DOI
14 Nakamura, Y., Suzuki, Y., & Watanabe, Y, "Effect of oxygen plasma etching on adhesion between polyimide films and metal," Thin Solid Films, 290 367-369 (1996).
15 Ruoff, A. L., Kramer, E. J., & Li, C, "Improvement of adhesion of copper on polyimide by reactive ion-beam etching," IBM Journal of Research and Development, 32 [5] 626-630 (1988).   DOI