• Journal of Sensor Science and Technology
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• v.19 no.3
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• pp.191-196
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• 2010

In this paper, modeling of the non-ideal frequency response, especially "notch-and-spike" magnitude phenomenon and phase lag distortion, are discussed. To characterize the non-ideal frequency response, a new electro-mechanical simulation model based on SPICE is proposed using the driving loop of the capacitive vibratory gyroscope. The parasitic components of the driving loop are found to be the major factors of non-ideal frequency response, and it is verified with the measurement results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.976-981
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• 2009

MEMS capacitive gap sensor is developed for measuring abrasion depth of gun barrel rifling. Measuring abrasion depth of gun barrel rifling is very important because it is related with exactness of firing and life of arms. The method using a gap sensor is not to hurt rifling. And it can measure abrasion depth through minimum shooting, because the developed gap sensor can measure from $1{\mu}m{\sim}12{\mu}m$ using Polydimethylsiloxane(PDMS) material and making a stretchable electrode on PDMS. And it's resolution is 1 ${\mu}m$ using capacitive method and MEMS technology.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.5
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• pp.1038-1043
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• 2003

A capacitive-coupled configuration MEMS switch is designed and fabricated, and its characteristics are measured. Low actuation voltage has been achieved by means of small distance between signal line and membrane. Minimum actuation voltage is about 11V. Isolation is around 40dB and insertion loss is about 0.2dB at 2GHz.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1896-1898
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• 2001

An offset problem caused by the static parasitic capacitors is analyzed and then some techniques to reduce their effect on the capacitive position sensor are presented. Also new offset compensation technique is proposed that by adjusting the magnitudes of the modulating signals independently, the charge imbalance between electrodes caused by the parasitic capacitors is eliminated without sensor gain variation. Simulation results are given to validate the proposed compensation technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.317-322
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• 2010

This paper reports the fabrication and characterization of surface micromachined poly 3C-SiC capacitive pressure sensors on silicon wafer operable in touch mode and normal mode for high temperature applications. FEM(finite elements method) simulation has been performed to verify the analytical mode. The sensing capacitor of the capacitive pressure sensor is composed of the upper metal and the poly 3C-SiC layer. Measurements have been performed in a temperature range from $25^{\circ}C$ to $500^{\circ}C$. Fabrication process of designed poly 3C-SiC touch mode capacitive pressure sensor was optimized and would be applicable to capacitive pressure sensors that are required high precision and sensitivity at high pressure and temperature.

• Transactions on Electrical and Electronic Materials
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• v.17 no.3
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• pp.129-133
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• 2016

Theoretical and graphical analysis of pull-in-voltage and figure of merit for a fixed-fixed capacitive Micro Electromechanical Systems (MEMS) switch is presented in this paper. MEMS switch consists of a thin electrode called bridge suspended over a central line and both ends of the bridge are fixed at the ground planes of a coplanar waveguide (CPW) structure. A thin layer of dielectric material is deposited between the bridge and centre conductor to avoid stiction and provide low impedance path between the electrodes. When an actuation voltage is applied between the electrodes, the metal bridge acquires pull in effect as it crosses one third of distance between them. In this study, we describe behavior of pull-in voltage and figure of merit (or capacitance ratio) of capacitive MEMS switch for five different dielectric materials. The effects of dielectric thicknesses are also considered to calculate the values of pull-in-voltage and capacitance ratio. This work shows that a reduced pull-in-voltage with increase in capacitance ratio can be achieved by using dielectric material of high dielectric constant above the central line of CPW.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.287-290
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• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• Journal of electromagnetic engineering and science
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• v.6 no.2
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• pp.135-145
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• 2006

This paper presents the theory, design, fabrication and characterization of the novel low actuation voltage capacitive shunt RF-MEMS switch using a corrugated membrane with HRS MEMS packaging. Analytical analyses and experimental results have been carried out to derive algebraic expressions for the mechanical actuation mechanics of corrugated membrane for a low residual stress. It is shown that the residual stress of both types of corrugated and flat membranes can be modeled with the help of a mechanics theory. The residual stress in corrugated membranes is calculated using a geometrical model and is confirmed by finite element method(FEM) analysis and experimental results. The corrugated electrostatic actuated bridge is suspended over a concave structure of CPW, with sputtered nickel(Ni) as the structural material for the bridge and gold for CPW line, fabricated on high-resistivity silicon(HRS) substrate. The corrugated switch on concave structure requires lower actuation voltage than the flat switch on planar structure in various thickness bridges. The residual stress is very low by corrugating both ends of the bridge on concave structure. The residual stress of the bridge material and structure is critical to lower the actuation voltage. The Self-alignment HRS MEMS package of the RF-MEMS switch with a $15{\Omega}{\cdot}cm$ lightly-doped Si chip carrier also shows no parasitic leakage resonances and is verified as an effective packaging solution for the low cost and high performance coplanar MMICs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.553-554
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• 2010