References
- Y. Lee and K. Wise, "A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity", IEEE Trans. Electron Devices ED-29, p. 42, 1982.
- J. Summinto, G. Yeh, T. Spera, and W. Ko, "Silicon diaphragm capacitive sensor for pressure, flow, acceleration, altitude measurements", Proc. 5th Int. Conf. On Solid-State Sensors and Actuators, 1987.
- S. Guo, J. Guo, and W. H. Ko, "A monolithically integrated surface micromachined touch mode capacitive pressure sensor", Sensors and Actuators A, Vol. 80, p. 224, 2000. https://doi.org/10.1016/S0924-4247(99)00344-1
- M.-X. Zhou, Q.-A. Huang, and M. Qin, "Modeling, design and fabrication of a triple-layered capacitive pressure sensor", Sensors and Actuators A, Vol. 117, p. 71, 2005. https://doi.org/10.1016/j.sna.2004.05.036
- K. Kasten, J. Amelung, and W. Mokwa, "CMOS-compatible capacitive high temperature pressure sensors", Sensors and Actuators A, Vol. 85, p. 147, 2000. https://doi.org/10.1016/S0924-4247(00)00385-X
- T. Schary, M. Meiners, W. Lang, and W. Benecke, "Surface micromachined capacitive absolute pressure sensors on fused silica substrates operable in touch-mode", Sensors IEEE, p. 4, 2005.
- V. Tsouti, G. Bikakis, S. Chatzandroulis, D. Goustouridis, P. Normand, and D. Tsoukalas, "Impact of structural parameters on the performance of silicon micromachined capacitive pressure sensors", Sensors and Actuators A, Vol. 137, p. 20, 2007. https://doi.org/10.1016/j.sna.2007.02.015
- Q. Wang and W. H. Ko, "Modeling of touch mode capacitive sensors and diaphragms", Sensors and Actuators A, Vol. 75, p. 230, 1999. https://doi.org/10.1016/S0924-4247(99)00068-0
- M. Meheregany, C. A. Zorman, N. Rajan, and C. H. Wu, "Silicon carbide MEMS for harsh environments", Proceeding of the IEEE, Vol. 8, p. 1594, 1998.
- C. H. Wu, C. A. Zorman, and M. Mehregany, "Fabrication and testing of bulk micromachined silicon carbide piezoresistive pressure sensors for high temperature applications", IEEE Sensors J., Vol. 6, No. 2, p. 316, 2006. https://doi.org/10.1109/JSEN.2006.870145