Browse > Article
http://dx.doi.org/10.5369/JSST.2005.14.4.265

The development of a variable capacitive pressure sensor for TPMS(tire pressure monitoring system)  

Choi, Bum-Koo (Dept. of Mechanical Engineering, Sogang University)
Kim, Do-Hyung (Dept. of Mechanical Engineering, Sogang University)
Oh, Jae-Geun (Dept. of Mechanical Engineering, Sogang University)
Publication Information
Journal of Sensor Science and Technology / v.14, no.4, 2005 , pp. 265-271 More about this Journal
Abstract
In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.
Keywords
TPMS; MEMS; capacitive pressure sensor; FEA;
Citations & Related Records
연도 인용수 순위
  • Reference
1 이윤영, 'SAW sensor를 이용한 Tire Pressure MoniToring System 설계에 관한 연구', 서강대학교 공학석사 학위 논문, 2003
2 M. Hill and J. D. Turner, 'Automotive tyre pressure sensing', Automotive Sensors, lEE Colloquium, pp. 5/1-5/6 , 1992
3 W. H. Ko and Q. Wang, 'Touch mode capacitive pressure sensors for industrial applications', MEMS '97, Proceedings, IEEE., Tenth Annu al International Workshop, pp. 284-289 , 1997
4 S. Yamamoto, H. Nakamura, H. Nishimura, T. Suzuki, T. Takizawa, and O. Nakao, 'Touch mode capacitive pressure sensors', Fujikura Technical Review, pp. 45-49, 2003
5 S. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells 2nd edition, McGRAW-HILL, 1981
6 D. M. Achneider et al., 'A new analytical solution for the load-deflection of square membranes', Journal of icorelectromechanical Systems, pp. 23824 1, 1995
7 W. H. Ko and Q. Wang, 'Touch mode capacitive pressure sensors', Sensors and Actuators A, vol. 75, pp. 242-25 1, 1999   DOI   ScienceOn
8 Q. Wang and W. H. Ko, 'Modeling of touch mode Capacitive pressure sensors and diaphragms', Sensors and Actuators A, vol. 75, pp. 230-241, 1999   DOI   ScienceOn
9 B. K. Choi and G. B. Lee, 'Modeling of stretching effects on the contacted diaphragm of pressure transducers by LIGA process', Sensors and Actuators A, vol. 69, pp. 192- 198, 1998   DOI   ScienceOn
10 C.Y. Wang and c.c. Lee, 'An eutectic bonding technology at a temperature below the eutectic point', Electronic Components and Technology Conference, Proceedings., 42nd, pp. 502-507, 1992
11 C.H. Tsau, S.M. Spearing, and M.A. Schmidt, 'Fabrication of wafer-level thermocompression bonds', Journal of Microelectromechanical Systems, vol. 11 , pp. 64 1-647, 2002   DOI   ScienceOn
12 W. B. Kim, Q. Wang, K. D. Jung, J. S. Hwang, and C. Y. Moon, 'Application of au-sn eutectic bond ing in hermetic RF MEMS wafer level packaging', Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium, pp. 2 15-2 19, 2004