• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.431.1-431.1
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• 2014

최근, 높은 캐리어 이동도와 유연성, 투명성의 우수한 전기적 기계적 특성을 갖는 그래핀에 관한 연구가 활발해지고 있으며 이를 기반으로 한 그래핀 field effect transistor (FET) 센서 응용 또한 관심이 커지고 있다. 작은 소자 크기, 견고한 구조, 빠른 응답속도와 CMOS 공정과의 호환성이 좋은 FET 기반의 센서의 감지 특성은 주로 전해질과 직접 접촉하는 게이트 절연체의 고유 특성에 의해 결정된다. 이러한 게이트 절연체는 일반적으로 스퍼터링, atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD) 등의 진공 방법에 의해 형성되며, 이 공정 기술은 고가의 장비, 긴 공정 시간과 높은 제조비용이 요구된다. 더욱이, 위의 방식들은 소자 제작 동안에 플라즈마 발생 또는 열처리를 필요로 하게 되며 이는 그래핀 기반의 소자의 제작에 있어 큰 손상을 발생시키게 된다. 이러한 이유로 인해, 그래핀 FET 센서의 게이트 절연체의 형성에 있어 진공 증착 기술은 적절하지 않다. 본 연구에서는, 진공 증착 기술의 문제점을 극복하기 위해 sol-gel 방식을 통한 Al2O3 게이트 절연체를 갖는 그래핀 FET 센서를 제작하였다. Sol-gel 방식은 적은 비용, 공정의 단순화, 높은 처리량 뿐 아니라 소자의 대면적화 제작에 유리하다는 장점을 가지며, 또한 게이트 절연체를 증착함에 있어서 플라즈마가 발생하지 않기 때문에 그래핀 FET 제작에 쉽게 적용될 수 있다. 특히, 게이트 절연체 중 Al2O3은 우수한 화학적 안정성과 감지 특성으로 인해 본 실험에 사용하였다. 결론적으로, sol-gel 방식을 통한 Al2O3 게이트 절연체를 갖는 그래핀 FET 센서는 우수한 전기적 특성과 감지 특성 측면에서 매우 전망적이다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.152-153
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• 2012

Ion sensitive field effect transistor (ISFET)는 전해질 속 각종 이온농도를 측정하는 반도체 이온 센서이다. 이 소자의 기본 구조는 metal oxide semiconductor field effect transistor (MOSFET)에서 고안되었으며 게이트 컨택 부분이 기준전극과 전해질로 대체되어진 구조를 가지고 있다 [1]. ISFET는 기존의 반도체 CMOS 공정과 호환이 가능하고 제작이 용이할 뿐만 아니라, pH용액에 대한 빠른 반응 속도, 비표지 방식의 생체물질 감지능력, 낮은 단가 및 소자의 집적이 용이하다는 장점을 가지고 있다. ISFET pH센서의 감지특성에 결정하는 요소 중 가장 중요한 것은 소자의 감지막이라고 할 수 있다. 감지막은 감지 대상 물질과 물리적으로 직접 접촉되는 부분으로서 일반적으로 기계적/화학적 강도가 우수한 실리콘 산화막(SiO2)이 많이 사용되어져 왔다. 최근에는 기존의 SiO2 보다 성능이 향상된 감지막을 개발하기 위하여 Al2O3, HfO2, ZrO2, 그리고 Ta2O5와 같은 고유전 상수(high-k)를 가지는 물질들을 EIS 센서의 감지막으로 이용하는 연구가 활발하게 진행되고 있다. 하지만 지속적인 high-k 물질들에 대한 연구에도 불구하고 각각의 물질이 갖는 한계점이 드러났다. 본 연구에서는 SOI기판에서 SiO2 /HfO2 (OH), SiO2/Al2O3 (OA) 이단 적층 그리고 SiO2/HfO2/Al2O3 (OHA) 삼단적층 감지막을 갖는 ISFET을 제작하고 각 감지막의 특성을 평가하였다. 평가된 특성의 결과가 아래의 표1에 요약되었다. 그 결과, 각 high-k 물질이 갖는 한계점을 극복하기 위하여 제안된 OHA감지막은 기존에 OH, OA가 갖는 장점을 취하면서 단점을 최소화 시키는 최적화된 감지막의 감지특성을 보였다.

• Journal of Radiation Industry
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• v.9 no.1
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• pp.1-7
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• 2015

The trend of x-ray image sensor has been evolved from an amorphous silicon sensor to a crystal silicon sensor. A crystal silicon X-ray sensor, meaning a X-ray CIS (CMOS image sensor), is consisted of three transistors (Trs), i.e., a Reset Transistor, a Source Follower and a Select Transistor, and a photodiode. They are highly sensitive to radiation exposure. As the frequency of exposure to radiation increases, the quality of the imaging device dramatically decreases. The most well known effects of a X-ray CIS due to the radiation damage are increments in the reset voltage and dark currents. In this study, a pixel array of a X-ray CIS was made of $20{\times}20pixels$ and this pixel array was exposed to a high radiation dose. The radiation source was Co-60 and the total radiation dose was increased from 1 to 9 kGy with a step of 1 kGy. We irradiated the small pixel array to get the increments data of the reset voltage and the dark currents. Also, we simulated the radiation effects of the pixel by MCNP (Monte Carlo N-Particle) simulation. From the comparison of actual data and simulation data, the most affected location could be determined and the cause of the increments of the reset voltage and dark current could be found.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.114-118
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• 2021

In this study, the sensitivity of an active pixel sensor (APS) was adjusted by employing a gate/body-tied (GBT) p-channel metal-oxide semiconductor field-effect transistor (PMOSFET)-type photodetector with a transfer gate. A GBT PMOSFET-type photodetector can amplify the photocurrent generated by light. Consequently, APSs that incorporate GBT PMOSFET-type photodetectors are more sensitive than those APSs that are based on p-n junctions. In this study, a transfer gate was added to the conventional GBT PMOSFET-type photodetector. Such a photodetector can adjust the sensitivity of the APS by controlling the amount of charge transmitted from the drain to the floating diffusion node according to the voltage of the transfer gate. The results obtained from conducted simulations and measurements corroborate that, the sensitivity of an APS, which incorporates a GBT PMOSFET-type photodetector with a built-in transfer gate, can be adjusted according to the voltage of the transfer gate. Furthermore, the chip was fabricated by employing the standard 0.35 ㎛ complementary metal-oxide semiconductor (CMOS) technology, and the variable sensitivity of the APS was thereby experimentally verified.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.21-26
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• 2016

This paper presents a step-down DC-DC buck converter with a CCM/DCM dual-mode function for the internal power stage of portable electronic device. The proposed converter that is operated with a high frequency of 1 MHz consists of a power stage and a control block. The power stage has a power MOS transistor, inductor, capacitor, and feedback resistors for the control loop. The control part has a pulse width modulation (PWM) block, error amplifier, ramp generator, and oscillator. In this paper, an external capacitor for compensation has been replaced with a multiplier equivalent CMOS circuit for area reduction of integrated circuits. In addition, the circuit includes protection block, such as over voltage protection (OVP), under voltage lock out (UVLO), and thermal shutdown (TSD) block. The proposed circuit was designed and verified using a $0.18{\mu}m$ CMOS process parameter by Cadence Spectra circuit design program. The SPICE simulation results showed a peak efficiency of 94.8 %, a ripple voltage of 3.29 mV ripple, and a 1.8 V output voltage with supply voltages ranging from 2.7 to 3.3 V.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.174-179
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• 2017

We designed the CMOS analog integrate and fire (I&F) neuron circuit for driving memristor based on resistive-switching random access memory (RRAM). And we fabricated the RRAM device that have $HfO_2$ switching layer using atomic layer deposition (ALD). The RRAM device has gradual set and reset characteristics. By spice modeling of the synaptic device, we performed circuit simulation of synaptic device and CMOS neuron circuit. The neuron circuit consists of a current mirror for spatial integration, a capacitor for temporal integration, two inverters for pulse generation, a refractory part, and finally a feedback part for learning of the RRAM. We emulated the spike-timing-dependent-plasticity (STDP) characteristic that is performed automatically by pre-synaptic pulse and feedback signal of the neuron circuit. By STDP characteristics, the synaptic weight, conductance of the RRAM, is changed without additional control circuit.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.3
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• pp.283-291
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• 2015

In this paper, a negative impedance converter, the key element of non-Foster matching to enhance the bandwidth of matching high Q-factor passive element, is presented. Proposed negative impedance converter is implemented by the topology of Linvill's transistor negative impedance converter circuit. It is hard to forecast the operation of negative impedance circuit, because it is composed of gain element and positive feedback. Therefore the negative impedance circuit is implemented by hybrid type beforehand to check out the feasibility and it is designed by integrated circuit. The integrated circuit is fabricated by commercial $0.18{\mu}m$ SiGe BiCMOS process, and non-Foster matching is observed at 700~960 MHz band by cancelling the target reactance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.2 s.93
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• pp.189-193
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• 2005

In this paper, we propose a direct conversion double-balanced down-converter fer MB-OFDM W system, which is implemented using $0.18\;{\mu}m$ CMOS technology and its measurement results are shown. The proposed down-converter adopts a resistive current-source instead of general transconductance stage using MOS transistor to achieve wideband characteristics over RF input frequency band $3\~5\;GHz$ with good gain flatness. The measured conversion gain is more than +3 dB, and gain flatness is less than 3 dB for three UWB channels. The dc consumption of this work is only 0.89 mA from 1.8 V power supply, leading to the low-power W application.

• Journal of IKEEE
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• v.14 no.4
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• pp.257-262
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• 2010

We design a CMOS front-end with wide variable gain and low power consumption for 5.25 GHz band. To obtain wide variable gain range, a p-type metal-oxide-semiconductor field-effect transistor (PMOS FET) in the low noise amplifier (LNA) section is connected in parallel. For a mixer, single balanced and folded structure is employed for low power consumption. Using this structure, the bias currents of the transconductance and switching stages in the mixer can be separated without using current bleeding path. The proposed front-end has a maximum gain of 33.2 dB with a variable gain range of 17 dB. The noise figure and third-order input intercept point (IIP3) are 4.8 dB and -8.5 dBm, respectively. For this operation, the proposed front-end consumes 7.1 mW at high gain mode, and 2.6 mW at low gain mode. The simulation results are performed using Cadence RF spectre with the Taiwan Semiconductor Manufacturing Company (TSMC) $0.18\;{\mu}m$ CMOS technology.)

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.1
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• pp.29-36
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• 2009

In this paper, the design and implementation of LNA and down-mixer using 90 nm CMOS process are presented for 60 GHz band WPAN receiver. In order to extract characteristics of the transistor used to design each elements under the optimum bias conditions, the S-parameter of the manufactured cascode topology was measured and the effect of the RF pad was removed. Measured results of 3-stages cascode type LNA the gain of 25 dB and noise figure of 7 dB. Balanced type down-mixer with a balun at LO input port shows the conversion gain of 12.5 dB within IF frequency($8.5{\sim}11.5\;GHz$) and input PldB of -7 dBm. The size and power consumption of LNA and down-mixer are $0.8{\times}0.6\;mm^2$, 43 mW and $0.85{\times}0.85\;mm^2$, 1.2 mW, respectively.