• Title/Summary/Keyword: CMOS Process

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Electrical Characteristic of Power MOSFET with Zener Diode for Battery Protection IC

  • Kim, Ju-Yeon;Park, Seung-Uk;Kim, Nam-Soo;Park, Jung-Woong;Lee, Kie-Yong;Lee, Hyung-Gyoo
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.1
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    • pp.47-51
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    • 2013
  • A high power MOSFET switch based on a 0.35 ${\mu}m$ CMOS process has been developed for the protection IC of a rechargeable battery. In this process, a vertical double diffused MOS (VDMOS) using 3 ${\mu}m$-thick epi-taxy layer is integrated with a Zener diode. The p-n+Zener diode is fabricated on top of the VDMOS and used to protect the VDMOS from high voltage switching and electrostatic discharge voltage. A fully integrated digital circuit with power devices has also been developed for a rechargeable battery. The experiment indicates that both breakdown voltage and leakage current depend on the doping concentration of the Zener diode. The dependency of the breakdown voltage on doping concentration is in a trade-off relationship with that of the leakage current. The breakdown voltage is obtained to exceed 14 V and the leakage current is controlled under 0.5 ${\mu}A$. The proposed integrated module with the application of the power MOSFET indicates the high performance of the protection IC, where the overcharge delay time and detection voltage are controlled within 1.1 s and 4.2 V, respectively.

A Materials Approach to Resistive Switching Memory Oxides

  • Hasan, M.;Dong, R.;Lee, D.S.;Seong, D.J.;Choi, H.J.;Pyun, M.B.;Hwang, H.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.8 no.1
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    • pp.66-79
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    • 2008
  • Several oxides have recently been reported to have resistance-switching characteristics for nonvolatile memory (NVM) applications. Both binary and ternary oxides demonstrated great potential as resistive-switching memory elements. However, the switching mechanisms have not yet been clearly understood, and the uniformity and reproducibility of devices have not been sufficient for gigabit-NVM applications. The primary requirements for oxides in memory applications are scalability, fast switching speed, good memory retention, a reasonable resistive window, and constant working voltage. In this paper, we discuss several materials that are resistive-switching elements and also focus on their switching mechanisms. We evaluated non-stoichiometric polycrystalline oxides ($Nb_2O_5$, and $ZrO_x$) and subsequently the resistive switching of $Cu_xO$ and heavily Cu-doped $MoO_x$ film for their compatibility with modem transistor-process cycles. Single-crystalline Nb-doped $SrTiO_3$ (NbSTO) was also investigated, and we found a Pt/single-crystal NbSTO Schottky junction had excellent memory characteristics. Epitaxial NbSTO film was grown on an Si substrate using conducting TiN as a buffer layer to introduce single-crystal NbSTO into the CMOS process and preserve its excellent electrical characteristics.

RFID Tag Antenna on Si Substrate by Thin-film Deposition Process (박막 증착공정으로 Si 기판위에 구현된 RFID 태그 안테나)

  • Jung, Tae-Hwan;Kim, Jung-Yeon;Park, Seong-Beom;Lee, Seok-Jin;Ahn, Sang-Ki;Woo, Deok-Hyun;Kwon, Soon-Yong;Lim, Dong-Gun;Park, Jae-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.04b
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    • pp.55-56
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    • 2009
  • Small RFID tag antenna were fabricated on Si substrate and their physical and electrical properties were evaluated. With decreasing the size of tag antenna on Si substrate, small SMD-type RFID tags could be fabricated, which is very useful for PCB tracking. Firstly, tag antenna pattern and the electromagnetic properties were simulated with HFSS. The frequency was 13.56MHz, the line-width and line-gap were modeled in the range of $50{\sim}200{\mu}m$. S parameters, SRF, and Q value were calculated from geometry. When the line-width and line-gap were 100um and the loop-turn was 10, the SRF was 80MHZ and the Q value was ca. 9. When the microstrip antenna pattern of aluminum was fabricated by using DC sputtering, Vpp of ca. 1.6V was obtained when the reader-tag distance was 40mm.

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Design of Low Power Sigma-delta ADC for USN/RFID Reader (USN/RFID Reader용 저전력 시그마 델타 ADC 변환기 설계에 관한 연구)

  • Kang, Ey-Goo;Hyun, Deuk-Chang;Hong, Seung-Woo;Lee, Jong-Seok;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.9
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    • pp.800-807
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    • 2006
  • To enhance the conversion speed more fast, we separate the determination process of MSB and LSB with the two independent ADC circuits of the Incremental Sigma Delta ADC. After the 1st Incremental Sigma Delta ADC conversion finished, the 2nd Incremental Sigma Delta ADC conversion start while the 1st Incremental Sigma Delta ADC work on the next input. By determining the MSB and the LSB independently, the ADC conversion speed is improved by two times better than the conventional Extended Counting Incremental Sigma Delta ADC. In processing the 2nd Incremental Sigma Delta ADC, the inverting sample/hold circuit inverts the input the 2nd Incremental Sigma Delta ADC, which is the output of switched capacitor integrator within the 1st Incremental Sigma Delta ADC block. The increased active area is relatively small by the added analog circuit, because the digital circuit area is more large than analog. In this paper, a 14 bit Extended Counting Incremental Sigma-Delta ADC is implemented in $0.25{\mu}m$ CMOS process with a single 2.5 V supply voltage. The conversion speed is about 150 Ksamples/sec at a clock rate of 25 MHz. The 1 MSB is 0.02 V. The active area is $0.50\;x\;0.35mm^{2}$. The averaged power consumption is 1.7 mW.

Pipelined Wake-Up Scheme to Reduce Power-Line Noise of MTCMOS Megablock Shutdown for Low-Power VLSI Systems (저전력 VLSI 시스템에서 MTCMOS 블록 전원 차단 시의 전원신 잡음을 줄인 파이프라인 전원 복귀 기법)

  • 이성주;연규성;전치훈;장용주;조지연;위재경
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.10
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    • pp.77-83
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    • 2004
  • In low-power VLSI systems, it is effective to suppress leakage current by shutting down megablocks in idle states. Recently, multi-threshold voltage CMOS (MTCMOS) is widely accepted to shutdown power supply. However, it requires short wake-up time as operating frequency increases. This causes large current surge during wake-up process, and it often leads to system malfunction due to severe Power line noise. In this paper, a novel wake-up scheme is proposed to solve this problem. It exploits pipelined wake-up strategy in several stages that reduces maximum current on the power line and its corresponding power line noise. To evaluate its efficiency, the proposed scheme was applied to a multiplier block in the Compact Flash memory controller chip. Power line noise in shutdown and wake-up process was simulated and analyzed. From the simulation results, the proposed scheme was proven to greatly reduce the power line noise compared with conventional schemes.

A PVT-compensated 2.2 to 3.0 GHz Digitally Controlled Oscillator for All-Digital PLL

  • Kavala, Anil;Bae, Woorham;Kim, Sungwoo;Hong, Gi-Moon;Chi, Hankyu;Kim, Suhwan;Jeong, Deog-Kyoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.484-494
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    • 2014
  • We describe a digitally controlled oscillator (DCO) which compensates the frequency variations for process, voltage, and temperature (PVT) variations with an accuracy of ${\pm}2.6%$ at 2.5 GHz. The DCO includes an 8 phase current-controlled ring oscillator, a digitally controlled current source (DCCS), a process and temperature (PT)-counteracting voltage regulator, and a bias current generator. The DCO operates at a center frequency of 2.5 GHz with a wide tuning range of 2.2 GHz to 3.0 GHz. At 2.8 GHz, the DCO achieves a phase noise of -112 dBc/Hz at 10 MHz offset. When it is implemented in an all-digital phase-locked loop (ADPLL), the ADPLL exhibits an RMS jitter of 8.9 ps and a peak to peak jitter of 77.5 ps. The proposed DCO and ADPLL are fabricated in 65 nm CMOS technology with supply voltages of 2.5 V and 1.0 V, respectively.

Physical principles of digital radiographic imaging system (디지털 방사선영상 시스템의 기본적 원리)

  • Choi, Jin-Woo;Yi, Won-Jin
    • Imaging Science in Dentistry
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    • v.40 no.4
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    • pp.155-158
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    • 2010
  • Digital radiographic systems allow the implementation of a fully digital picture archiving and communication system (PACS), and provide the greater dynamic range of digital detectors with possible reduction of X-ray exposure to the patient. This article reviewed the basic physical principles of digital radiographic imaging system in dental clinics generally. Digital radiography can be divided into computed radiography (CR) and direct radiography (DR). CR systems acquire digital images using phosphor storage plates (PSP) with a separate image readout process. On the other hand, DR systems convert X-rays into electrical charges by means of a direct readout process. DR systems can be further divided into direct and indirect conversion systems depending on the type of X-ray conversion. While a direct conversion requires a photoconductor that converts X-ray photons into electrical charges directly, in an indirect conversion, lightsensitive sensors such as CCD or a flat-panel detector convert visible light, proportional to the incident X-ray energy by a scintillator, into electrical charges. Indirect conversion sensors using CCD or CMOS without lens-coupling are used in intraoral radiography. CR system using PSP is mainly used in extraoral radiographic system and a linear array CCD or CR sensors, in panoramic system. Currently, the digital radiographic system is an important subject in the dental field. Most studies reported that no significant difference in diagnostic performance was found between the digital and conventional systems. To accept advances in technology and utilize benefits provided by the systems, the continuous feedback between doctors and manufacturers is essential.

On the Performance Enhancements of VC Merging-capable Scheduler for MPLS Routers by Sequence Skipping Method (Sequence Skipping 방법을 이용한 MPLS 라우터의 VC 통합기능 스케쥴러의 성능 향상에 관한 연구)

  • Baek, Seung-Chan;Park, Do-Yong;Kim, Young-Beom
    • Journal of IKEEE
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    • v.5 no.1 s.8
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    • pp.111-120
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    • 2001
  • VC merging involves distinguishing cells from an identical merged VC label. Various approaches have been proposed to help this identification process. However, most of them incur additional buffering, protocol overhead and/or variable delay. They make the provision of QoS difficult to achieve. So it was proposed a merge capable scheduler to support VC-merging (VCMS). However, in situations where all VCs are to be merged or the incoming traffic load is very low, it could happen that there are not enough non-merging cells to snoop. In this situation the scheduler uses special control cells to fill the empty time slots out. Too many control cells can cause high cell loss ratio and an additional packet transfer delay. To overcome the drawbacks, we propose a Sequence Skipping(SS) method where the sequencers skip the empty queues and insert SS cells. We show SS method is suitable for VC-merging and can reduce the cell loss ratio and the mean packet transfer delay through simulations.

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A Self-Powered RFID Sensor Tag for Long-Term Temperature Monitoring in Substation

  • Chen, Zhongbin;Deng, Fangming;He, Yigang;Liang, Zhen;Fu, Zhihui;Zhang, Chaolong
    • Journal of Electrical Engineering and Technology
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    • v.13 no.1
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    • pp.501-512
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    • 2018
  • Radio frequency identification (RFID) sensor tag provides several advantages including battery-less operation and low cost, which are suitable for long-term monitoring. This paper presents a self-powered RFID temperature sensor tag for online temperature monitoring in substation. The proposed sensor tag is used to measure and process the temperature of high voltage equipments in substation, and then wireless deliver the data. The proposed temperature sensor employs a novel phased-locked loop (PLL)-based architecture and can convert the temperature sensor in frequency domain without a reference clock, which can significantly improve the temperature accuracy. A two-stage rectifier adopts a series of auxiliary floating rectifier to boost its gate voltage for higher power conversion efficiency. The sensor tag chip was fabricated in TSMC $0.18{\mu}m$ 1P6M CMOS process. The measurement results show that the proposed temperature sensor tag achieve a resolution of $0.15^{\circ}C$/LSB and a temperature error of $-0.6/0.7^{\circ}C$ within the range from $-30^{\circ}C$ to $70^{\circ}C$. The proposed sensor tag achieves maximum communication distance of 11.8 m.

Active-RC Channel Selection Filter with 40MHz Bandwidth and Improved Linearity (40MHz의 대역폭과 개선된 선형성을 가지는 Active-RC Channel Selection Filter)

  • Lee, Han-Yeol;Hwang, Yu-Jeong;Jang, Young-Chan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.10
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    • pp.2395-2402
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    • 2013
  • An active-RC channel selection filter (CSF) with the bandwidth of 40MHz and the improved linearity is proposed in this paper. The proposed CSF is the fifth butterworth filter which consists of a first order low pass filter, two second order low pass filters of a biquad architecture, and DC feedback circuit for cancellation of DC offset. To improve the linearity of the CSF, a body node of a MOSFET for a switch is connected to its source node. The bandwidth of the designed CSF is selected to be 10MHz, 20MHz and 40MHz and its voltage gain is controlled by 6 dB from 0 dB to 24 dB. The proposed CSF is designed by using 40nm 1-poly 8-metal CMOS process with a 1.2V. When the designed CSF operates at the bandwidth of 40 MHz and voltage gain of 0 dB, the simulation results of OIP3, in-band ripple, and IRN are 31.33dBm, 1.046dB, and 39.81nV/sqrt(Hz), respectively. The power consumption and layout area are $450{\times}210{\mu}m^2$ and 6.71mW.