• 디지털융복합연구
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• 제14권5호
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• pp.325-331
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• 2016

야간에 가로등이 없는 지방 국도 또는 우천시에 과속 방지턱이 보이질 않아 과속방지턱에 거의 근접하여 급 브레이크를 밟는 경우가 종종 발생하여 사고가 발생한다. 또한, 논 또는 밭과 인접한 지방 국도의 경우 농작물의 피해를 줄이고자 가로등 설치를 못하는 실정이다. 이 경우 야간에 사람들이 길을 다니는 경우 특히 검은색 계열의 옷을 입고 다니는 경우 사람의 존재를 운전자가 인식하지 못해 잦은 사고가 발생한다. 이 경우, 파장이 긴 색깔의 LED 가로등을 설치하면 농작물의 피해를 주지 않고 사람의 존재만 구별할 수 있어 교통사고를 줄일 수 있다. 따라서, 본 논문에서는 이를 위하여 과속방지턱에 LED를 부착하여 점등함로써 사전의 속도를 줄여 사고를 줄일 수 있고 또한 농작물에 피해를 주지 않으면서 인사 교통사고를 줄일 수 있는 태양광 및 압전소자를 이용한 절전형 LED 자동점등 지방국도(논로) 교통사고 방지 및 과속방지턱 겸용 가로등을 개발하였다. 태양광 및 압전소자를 이용 전력을 축척하여 LED를 점등하는 방식으로 조도센서를 사용하지 않고 태양광 소자의 에너지 축적 여부를 이용하여 LED를 ON/OFF한다. 또한 압전소자도 이용함으로써 여름철 장마에 태양광에 의한 축적이 부족한 경우를 대비할 수 있고, 또한 저전력 설계를 구현하여 최소 3일 이상 무충전시에도 정상 작동하도록 구현하였다.

• Korean Journal of Mathematics
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• 제25권3호
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• pp.405-435
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• 2017

We deal with a sensitivity analysis of an optimal shape control problem for the stationary Navier-Stokes system. A two-dimensional channel flow of an incompressible, viscous fluid is examined to determine the shape of a bump on a part of the boundary that minimizes the viscous drag. By using the material derivative method and adjoint variables for a shape sensitivity analysis, we derive the shape gradient of the design functional for the model problem.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.829-834
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• 2003

Many types of omnidirectional wheels with passive rollers have gaps between rollers. Since these gaps cause a wheel to make discontinuous contact with the ground, they lead to vertical and/or horizontal vibrations during wheel operation. In addition, the radii of passive rollers are related to the height of a bump an omnidirectional wheel can surmount. In this research a new design of the alternate wheel is proposed. Because this wheel makes continuous contact with the ground and has alternating large and small rollers around the wheel, it is termed a continuous alternate wheel (CAW). In this paper a design procedure is also presented to determine the optimum number of rollers, the radii of rollers and the inside inclination angle of an outer roller for given design specifications. The CAW based on this design is compared to the existing alternate wheels in terms of design. Finally, an actual continuous alternate wheel is constructed to verify validity of the design guidelines.

• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.73-78
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• 2016

집적회로(Integrated Circuit) 소자의 트랜지스터(transistor) 밀도 증가는 소자에서 발생하는 열 방출(heat dissipation)의 급격한 상승을 초래하여 열 문제를 발생시키고, 이는 소자의 성능과 열적 신뢰성에 영향을 크게 미친다. 열문제의 해결방안 중 본 연구에서는 냉매를 이용한 액체 냉각방법을 연구하였으며, 실리콘 웨이퍼에 관통실리콘비아(through Si via)와 마이크로 채널(microchannel)을 딥 반응성 이온 애칭(deep reactive ion etching)로 구현한 후 유리기판과 어노딕본딩을 통하여 액체 냉각 구조를 제작하였다. 제작된 마이크로 채널 위에 Ag, Cu 또는 Cr/Au/Cu bump를 스크린프린팅(screen printing) 방법으로 형성하였고, 범프의 유무를 통해 액체 냉각 전후의 냉각 모듈의 실리콘 표면온도의 변화를 적외선현미경으로 분석하였다. Cr/Au/Cu bump가 탑재된 액체 냉각 모듈의 경우 가열온도 $200^{\circ}C$에서 냉각 전후의 실리콘 표면 온도 차이는 약 $45.2^{\circ}C$이고, 전력밀도 감소는 약 $2.8W/cm^2$ 이었다.

• 한국자동차공학회논문집
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• 제11권5호
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• pp.201-209
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• 2003

Virtual human models are widely used to save time and expense in vehicle safety studies. A human model is an essential tool to visualize and simulate a vehicle driver in virtual environments. This research is focused on creation and application of a human model fer virtual reality. The Korean anthropometric data published are selected to determine basic human model dimensions. These data are applied to GEBOD, a human body data generation program, which computes the body segment geometry, mass properties, joints locations and mechanical properties. The human model was constituted using MADYMO based on data from GEBOD. Frontal crash and bump passing test were simulated and the driver's motion data calculated were transmitted into the virtual environment. The human model was organized into scene graphs and its motion was visualized by virtual reality techniques including OpenGL Performer. The human model can be controlled by an arm master to test driver's behavior in the virtual environment.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2001년도 유체기계 연구개발 발표회 논문집
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• pp.475-481
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• 2001

Foil bearings have been successfully used for small high speed rotors, such as ACM(Air Cycle Machine), turbo charger, turbo compressor, high speed motor, etc. Recently advanced researches are concentrated on the high load capacity and the extreme temperature foil bearings to extend the application boundary. Some bearings are already adopted into cryogenic machines and micro gas turbines. In this paper, a foil journal bearing designed for high load capacity, which is under development, is introduced. The bearing is for the turbo refrigerator which has a rotor of 18${\~}$25 kgf rotating at 23,000${\~}$38,000 rpm. This application is well beyond conventional spectrum of foil bearings because the rotor is relatively heavy and the rotational speed is low. Therefore, the development is challenging. The foil bearing is a bump type, the size is 60mm in diameter and 50mm in length, the operating fluid is air and rotational speed is 26,000 rpm. In-house software was developed and used for bearing design. Tested maximum load capacity is 80kgf, 0.62 in terms of load capacity coefficient, and testing is being continued.

• ETRI Journal
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• 제34권5호
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Journal of Welding and Joining
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• 제29권1호
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• pp.52-58
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• 2011

In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

• ETRI Journal
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• 제35권4호
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced