Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.12a
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- Pages.127-154
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- 1999
High Integration Packaging Technology for RF Application
- Lee, Young-Min (Compound Semiconductor Department Micro-Electronics Technology Lab. Electrics and Telecommunications Research Institute)
- Published : 1999.12.01
Abstract
Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package->
Keywords