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http://dx.doi.org/10.6117/kmeps.2016.23.2.073

IC Thermal Management Using Microchannel Liquid Cooling Structure with Various Metal Bumps  

Won, Yonghyun (Graduate School of Nano-IT-Design, Seoul National Univ. of Science and Technology)
Kim, Sungdong (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
Kim, Sarah Eunkyung (Graduate School of Nano-IT-Design, Seoul National Univ. of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.2, 2016 , pp. 73-78 More about this Journal
Abstract
An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.
Keywords
Liquid cooling; Thermal management; Microchannel; On-chip cooling;
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Times Cited By KSCI : 3  (Citation Analysis)
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1 J. H. Lau and T. G. Yue, "Effects of TSVs (through-silicon vias) on thermal performance of 3D IC integration system-inpackage (SiP)", Microelectron. Reliab., 52, 2660 (2012).   DOI
2 C. S. Shrma, S. Zimmermann, M. K. Tiwari, B. Michel and D. Poulikakos, "Optimal thermal operation of liquid-cooled electronic chips", Int. J. Heat Mass Transf., 55, 1957 (2012).   DOI
3 T. G. Yue, T. S. Pin, N. Khan, D. Pinjala, J. H. Lau, Y. A. Bin, K. Vaidyanathan and T. K. Chuan, "Fluidic interconnects in integrated liquid cooling systems for 3-D stacked TSV modules", IEEE 10th Electronics Package. Technol. Conf., 552-558 (2008).
4 A. J. McNamara, Y. Joshi and Z. M. Zhang, "Characterization of nanostructured thermal interface materials: A review", Int. J. Therm. Sci., 62, 2 (2011).
5 J. L. Ayala, A. Sridhar, V. Pangracious, D. Atienza and Y. Leblebici, "Through silicon vias-based grid for thermal control in 3D chips", Proc. 4th Int. ICST Conf. Nano-Networks, 1(1), 90 (2009).
6 B. Goplen and S. Sapatnekar, "Thermal via placement in 3D ICs", Proc. International Symposium on Physical Design (ISPD), New York, 167 (2005).
7 N. Khan, L. H. Yu, T. S. Pin, S. W. Ho, V. Kripesh, D. Pinjala J. H. Lau and T. K. Chuan, "3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections", IEEE Trans. Comp., Packag., and Manuf. Tech., 3(2), 221 (2013).   DOI
8 B. Dang, M. S. Bakir and J. D. Meindl, "Integrated thermalfluidic I/O interconnects for an on-chip microchannel heat sink", IEEE EDL, 27, 117 (2006).   DOI
9 M. Park, S. Kim and S. E. Kim, "TSV liquid cooling system for 3D integrated circuits", J. Microelectron. Package. Soc., 20(3), 1 (2013).
10 M. Park, S. Kim and S. E. Kim, "Study of chip-level liquid cooling for high-heat-flux devices", J. Microelectron. Package. Soc., 22(2), 27 (2015).
11 N. Khan, L. H. Yu, S. P. Tan, S. W. Ho, V. Kripesh and D. Pinjala, "3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections", IEEE Trans. Comp. Packag. Manuf. Technol., 3, 221 (2013).   DOI
12 S. Mohapatra and D. Loikits, IEEE SEMI-THERM, 354 (2005).
13 M. S. Bakir, C. King, D. Sekar, H. Thacker, B. Dang, G. Huang, A. Naeemi and J. D. Meindl, "3D heterogeneous integrated systems: liquid cooling, power delivery, and implementation", IEEE CICC, 663 (2008).
14 Y. Won, S. Kim and S. E. Kim, "Study of on-chip liquid cooling in relation to micro-channel design", J. Microelectron. Packag. Soc., 22(4), 31 (2015).   DOI
15 T. Harirchian and S. V. Garimella, "Microchannel size effects on local flow boiling heat transfer to a dielectric fluid", Int. J. Heat and Mass Transfer, 51, 3724 (2008).   DOI
16 F. P. Incropera, D. P. Dewitt, T. L. Bergman and A. S. Lavine, Principles of Heat and Mass Transfer, John Wiley & Sons, Inc., 9 (2014).
17 The Engineering Toolbox "Convection heat transfer" (http://www.engineeringtoolbox.com/convective-heat-transferd_430.html)
18 B. Sopori, W. Chen, J. Madjdpour and N. M. Ravindra, "Calculation of emissivity of Si wafers", J. Electron. Mater., 28(12), 1385 (1999).   DOI
19 Wikipedea, "List of thermal conductivity", (https://en.wikipedia.org/wiki/List_of_thermal_conductivities)
20 The Engineering Toolbox, "Metals-Specific heats" (http://www.engineeringtoolbox.com/specific-heat-metals-d_152.html