1 |
J. H. Lau and T. G. Yue, "Effects of TSVs (through-silicon vias) on thermal performance of 3D IC integration system-inpackage (SiP)", Microelectron. Reliab., 52, 2660 (2012).
DOI
|
2 |
C. S. Shrma, S. Zimmermann, M. K. Tiwari, B. Michel and D. Poulikakos, "Optimal thermal operation of liquid-cooled electronic chips", Int. J. Heat Mass Transf., 55, 1957 (2012).
DOI
|
3 |
T. G. Yue, T. S. Pin, N. Khan, D. Pinjala, J. H. Lau, Y. A. Bin, K. Vaidyanathan and T. K. Chuan, "Fluidic interconnects in integrated liquid cooling systems for 3-D stacked TSV modules", IEEE 10th Electronics Package. Technol. Conf., 552-558 (2008).
|
4 |
A. J. McNamara, Y. Joshi and Z. M. Zhang, "Characterization of nanostructured thermal interface materials: A review", Int. J. Therm. Sci., 62, 2 (2011).
|
5 |
J. L. Ayala, A. Sridhar, V. Pangracious, D. Atienza and Y. Leblebici, "Through silicon vias-based grid for thermal control in 3D chips", Proc. 4th Int. ICST Conf. Nano-Networks, 1(1), 90 (2009).
|
6 |
B. Goplen and S. Sapatnekar, "Thermal via placement in 3D ICs", Proc. International Symposium on Physical Design (ISPD), New York, 167 (2005).
|
7 |
N. Khan, L. H. Yu, T. S. Pin, S. W. Ho, V. Kripesh, D. Pinjala J. H. Lau and T. K. Chuan, "3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections", IEEE Trans. Comp., Packag., and Manuf. Tech., 3(2), 221 (2013).
DOI
|
8 |
B. Dang, M. S. Bakir and J. D. Meindl, "Integrated thermalfluidic I/O interconnects for an on-chip microchannel heat sink", IEEE EDL, 27, 117 (2006).
DOI
|
9 |
M. Park, S. Kim and S. E. Kim, "TSV liquid cooling system for 3D integrated circuits", J. Microelectron. Package. Soc., 20(3), 1 (2013).
|
10 |
M. Park, S. Kim and S. E. Kim, "Study of chip-level liquid cooling for high-heat-flux devices", J. Microelectron. Package. Soc., 22(2), 27 (2015).
|
11 |
N. Khan, L. H. Yu, S. P. Tan, S. W. Ho, V. Kripesh and D. Pinjala, "3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections", IEEE Trans. Comp. Packag. Manuf. Technol., 3, 221 (2013).
DOI
|
12 |
S. Mohapatra and D. Loikits, IEEE SEMI-THERM, 354 (2005).
|
13 |
M. S. Bakir, C. King, D. Sekar, H. Thacker, B. Dang, G. Huang, A. Naeemi and J. D. Meindl, "3D heterogeneous integrated systems: liquid cooling, power delivery, and implementation", IEEE CICC, 663 (2008).
|
14 |
Y. Won, S. Kim and S. E. Kim, "Study of on-chip liquid cooling in relation to micro-channel design", J. Microelectron. Packag. Soc., 22(4), 31 (2015).
DOI
|
15 |
T. Harirchian and S. V. Garimella, "Microchannel size effects on local flow boiling heat transfer to a dielectric fluid", Int. J. Heat and Mass Transfer, 51, 3724 (2008).
DOI
|
16 |
F. P. Incropera, D. P. Dewitt, T. L. Bergman and A. S. Lavine, Principles of Heat and Mass Transfer, John Wiley & Sons, Inc., 9 (2014).
|
17 |
The Engineering Toolbox "Convection heat transfer" (http://www.engineeringtoolbox.com/convective-heat-transferd_430.html)
|
18 |
B. Sopori, W. Chen, J. Madjdpour and N. M. Ravindra, "Calculation of emissivity of Si wafers", J. Electron. Mater., 28(12), 1385 (1999).
DOI
|
19 |
Wikipedea, "List of thermal conductivity", (https://en.wikipedia.org/wiki/List_of_thermal_conductivities)
|
20 |
The Engineering Toolbox, "Metals-Specific heats" (http://www.engineeringtoolbox.com/specific-heat-metals-d_152.html
|