• 한국전기전자재료학회논문지
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• 제27권3호
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• pp.167-171
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• 2014

This paper examines the destruction behavior of NPN BJT (bipolar junction transistor) by repetition pulse. The injected pulse has a rise time of 1 ns and the maximum peak voltage of 2 kV. Pulse was injected into the base of transistor. Transistor was destroyed, current flows even when the base power is turned off. Cause the destruction of the transistor is damaged by heat. Breakdown voltage of the transistor is 975 V at single pulse, and repetition pulse is 525~575 V. Pulse repetition rate increases, the DT (destruction threshold) is reduced. Pulse Repetition rate is high, level of transistor destruction is more serious.

• 대한전자공학회논문지
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• 제21권1호
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• pp.7-12
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• 1984

본 논문에서는 저잡음 BJT를 만들기 위하여 HCI gettering oxidation 방법을 적용하였다. HCI 양의 변화에 따른 플리키 잡음 spectral intensity의 변화를 측정한 결과 BJT의 플리키 잡음이 표면 상태에 의존하고 있음과 저잡음 BJT를 만들기 위한 oxidation 공정의 gettering 조건은 HCI 양이 2%일 때 최적임을 알 수 있었다. 또 에미터 광산 공정에서 형성된 PSG층의 gettering 효과는 HCI gettering 결과에 비해 미약함도 알게 되었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권3호
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• pp.339-344
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• 2014

This paper presents a novel bipolar junction transistor (BJT) based electrostatic discharge (ESD) protection device. This protection device was designed for 20V power clamps and fabricated by a process with Bipolar-CMOS-DMOS (BCD) $0.18{\mu}m$. The current-voltage characteristics of this protection device was verified by the transmission line pulse (TLP) system and the DC BV characteristic was verified by using a semiconductor parameter analyzer. From the experimental results, the proposed device has a trigger voltage of 29.1V, holding voltage of 22.4V and low on-resistance of approximately $1.6{\Omega}$. In addition, the test of ESD robustness showed that the ESD successfully passed through human body model (HBM) 8kV. In this paper, the operational mechanism of this protection device was investigated by structural analysis of the proposed device. In addition, the proposed device were obtained as stack structures and verified.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권2호
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• pp.74-79
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• 2003

The method of the analysis of the base Gummel number of the BJT(Bipolar Junction Transistor) for integrated circuits based upon the semiconductor physics is proposed and the method of calculating the doping profile of the base region using process conditions is presented. The transistor saturation current obtained from the proposed method of NPN BJT using 20V and 30V process shows an averaged relative error of 6.7% compared with the measured data and the transistor saturation current of PNP BJT shows an averaged relative error of 9.2% compared with the measured data

• 한국정보통신학회논문지
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• 제20권4호
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• pp.793-798
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• 2016

본 연구에서는 1T-DRAM 응용을 위해 Bipolar Junction Transistor 모드 (BJT mode)에서 비대칭 소스/드레인 수직형 나노와이어 소자의 순방향 및 역방향 메모리 윈도우 특성을 분석하였다. 사용된 소자는 드레인 농도가 소스 농도보다 높으며 소스 면적이 드레인 면적보다 큰 사다리꼴의 수직형 gate-all-around (GAA) MOSFET 이다. BJT모드의 순방향 및 역방향 이력곡선 특성으로부터 순방향의 메모리 윈도우는 1.08V이고 역방향의 메모리 윈도우는 0.16V이었다. 또 래치-업 포인트는 순방향이 역방향보다 0.34V 큰 것을 알 수 있었다. 측정 결과를 검증하기 위해 소자 시뮬레이션을 수행하였으며 시뮬레이션 결과는 측정 결과와 일치하는 것을 알 수 있었다. 1T-DRAM에서 BJT 모드를 이용하여 쓰기 동작을 할 때는 드레인 농도가 높은 것이 바람직함을 알 수 있었다.

• Journal of Radiation Protection and Research
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• 제48권3호
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• pp.124-130
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• 2023

Background: When bipolar junction transistors (BJTs) are used as switches, their switching characteristics can be deteriorated because the recombination time of the minority carriers is long during turn-off transient. When BJTs operate as low frequency switches, the power dissipation in the on-state is large. However, when BJTs operate as high frequency switches, the power dissipation during switching transients increases rapidly. Materials and Methods: When silicon (Si) BJTs are irradiated by fast neutrons, defects occur in the Si bulk, shortening the lifetime of the minority carriers. Fast neutron irradiation mainly creates displacement damage in the Si bulk rather than a total ionization dose effect. Defects caused by fast neutron irradiation shorten the lifetime of minority carriers of BJTs. Furthermore, these defects change the switching characteristics of BJTs. Results and Discussion: In this study, experimental results on the switching characteristics of a pnp Si BJT before and after fast neutron irradiation are presented. The results show that the switching characteristics are improved by fast neutron irradiation, but power dissipation in the on-state is large when the fast neutrons are irradiated excessively. Conclusion: The switching characteristics of a pnp Si BJT were improved by fast neutron irradiation.

• Nuclear Engineering and Technology
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• 제54권2호
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• pp.501-506
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• 2022

Long turn-off time limits high frequency operation of Bipolar Junction Transistors (BJTs). Turn-off time decreases with increases in the recombination rate of minority carriers at switching transients. Fast neutron irradiation on a Si BJT incurs lattice damages owing to the displacement of silicon atoms. The lattice damages increase the recombination rate of injected holes with electrons, and decrease the hole lifetime in the base region of pnp Si BJT. Fast neutrons generated from a beryllium target with 30 MeV protons by an MC-50 cyclotron were irradiated onto pnp Si BJTs in experiment. The experimental results show that the turn-off time, including the storage time and fall time, decreases with increases in fast neutron fluence. Additionally, it is confirmed that the base current increases, and the collector current and base-to-collector current amplification ratio decrease due to fast neutron irradiation.

• 한국위성정보통신학회논문지
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• 제8권2호
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• pp.36-43
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• 2013

본 논문에서는 고전압에서 동작하는 DDIC(display driver IC) 칩의 정전기 보호소자로 사용되는 GG_EDNMOS 소자의 고전류 특성 및 더블 스냅백 메커니즘이 분석되었다. 이온주입 조건을 달리하는 매트릭스 조합에 의한 수차례의 2차원 시뮬레이션 및 TLP 특성 데이타를 비교한 결과, BJT 트리거링 후에 더블 스냅백 현상이 나타났으나 웰(well) 및 드리프트(drift) 이온주입 조건을 적절히 조절함으로써 안정적인 ESD 보호성능을 얻을 수 있었다. 즉, 최적의 백그라운드 캐리어 밀도를 얻는 것이 고전압 동작용 정전기보호소자의 고전류 특성에 매우 중요한 영향을 주는 임계인자(critical factor)임을 알 수 있었다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.2287-2290
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• 2003

The electrical characteristics of power devices such as BJT (Bipolar Junction Transistor), and MOSFET (Metal Oxide Field Effect Transistor), etc, are altered due to impinging photon radiation and temperature in the nuclear or the space environment. In this paper, BJT and MOSFET are the two devices subjected to ${\gamma}$ radiation. In the case of BJT, the current gain (${\beta}$) and the collector to Emiter breakdown voltage ($V_{CEO}$) are the two main parameters considered. When it was subjected to ${\gamma}$ rays, the ${\beta}$ decreases as the dose level increases, whereas, $V_{CEO}$ gradually increases as the dose level increases. In the case of MOSFET, the threshold voltage is decreasing as the dose level increases. Here it has been observed the decent rate is an increasing function of the threshold voltage. The on-resistance does not change with respect to the dose. Both the devices recover back the original specification after the annealing is finished. No permanent damage has been occurred.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.141-144
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• 2002

The method of the analysis of the base Gummel number of the PNP BJT(Bipolar Junction Transistor) for integrated circuits based upon the semiconductor physics is proposed and the method of calculating the doping profile of the base region using process conditions is presented. The transistor saturation current obtained from the proposed method of PNP BJT using 20V and 30V process shows an averaged relative error of 6.7% compared with the measured data.