• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권1호
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• pp.1-7
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• 2000

The SNOSFET memory devices with ultrathin ONO(tunnel oxide-nitride-blocking oxide) gate dielectric were fabricated using n-well CMOS process and investigated its characteristics. The thicknesses of tunnel oxide, nitride and blocking oxide were $23{\AA},\; 53{\AA}\; and\; 33{\AA}$, respectively. Auger analysis shows that the ONO layer is made up of $SiO_2(upper layer of blocking oxide)/O-rich\; SiO_x\N\_y$. It clearly shows that the converting layer with $SiO_x\N\_y(lower layer of blocking oxide)/N-rich SiO_x\N\_y(nitride)/O-rich SiO_x\N\_y(tunnel oxide)$. It clearly shows that the converting layer with $SiO_x\N\_y$ phase exists near the interface between the blocking oxide and nitride. The programming condition of +8 V, 20 ms, -8 V, 50 ms is determined and data retention over 10 years is obtained. Under the condition of 8 V programming, it was confirmed that the modified Fowler-Nordheim tunneling id dominant charge transport mechanism. The programmed threshold voltage is distributed less than 0.1 V so that the reading error of memory stated can be minimized. An $8\times8$ NAND type flash EEPROM with SONOSFET memory cell was designed and simulated with the extracted SPICE parameters. The sufficient read cell current was obtained and the upper limit of $V_{TH}$ for write state was over 2V.

• Transactions on Electrical and Electronic Materials
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• 제4권3호
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• pp.34-37
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• 2003

[ $HfO_2$ ] and $HfO_xN_y$ films were deposited by plasma-enhanced chemical vapor deposition using $Hf[OC(CH_3)_3]_4$ as the precursor in the absence of $O_2$. The crystallization temperature of the $HfO_xN_y$ films is higher than that of the $HfO_2$ film. Nitrogen incorporation in $HfO_xN_y$ was confirmed by auger electron spectroscopy analysis. After post deposition annealing (PDA) at 800$\Box$, the EOT increased from 1.34 to 1.6 nm in the $HfO_2$ thin films, whereas the increase of EOT was suppressed to less than 0.02 nm in the $HfO_xN_y$. The leakage current density decreased from 0.18 to 0.012 $A/cm^2$ with increasing PDA temperature in the $HfO_2$ films. But the leakage current density of $HfO_xN_y$ does not vary with increasing PDA temperature because an amorphous $HfO_xN_y$ films suppresses the diffusion of oxygen through the gate dielectric.

• Nuclear Engineering and Technology
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• 제35권6호
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• pp.507-514
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• 2003

Recently dry decontamination/surface-cleaning technology using plasma etching has been focused in the nuclear industry. In this study, the applicability of this new dry processing technique are experimentally investigated by examining the etching reaction of $UO_2$, Co, and Mo in r.f. plasma with the etchant gas of $CF_4/O_2$ mixture. $UO_2$ is chosen as a representing material for uranium and TRU (TRans-Uranic) compounds while metallic Co and Mo are selected because they are the principal contaminants in the used metallic nuclear components such as valves and pipes made of stainless steel or inconel. Results show that in all cases maximum etching rate is achieved when the mole fraction of $UO_2\;in\;CF_4/O_2$ mixture gas is $20\%$, regardless of temperature and r.f. power. In case of $UO_2$, the highest etching reaction rate is greater than 1000 monolayers/min. at $370^{\circ}C$ under 150 W r.f. power which is equivalent to $0.4{\mu}m/min$. As for Co, etching reaction begins to take place significantly when the temperature exceeds $350^{\circ}C$. Maximum etching rate achieved at $380^{\circ}C\;is\;0.06{\mu}m/min$. Mo etching reaction takes place vigorously even at relatively low temperature and the reaction rate increases drastically with increasing temperature. Highest etching rate at $380^{\circ}C\;is\;1.9{\mu}m/min$. According to OES (Optical Emission Spectroscopy) and AES (Auger Electron Spectroscopy) analysis, primary reaction seems to be a fluorination reaction, but carbonyl compound formation reaction may assist the dominant reaction, especially in case of Co and Mo. Through this basic study, the feasibility and the applicability of plasma decontamination technique are demonstrated.

• Nuclear Engineering and Technology
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• 제24권1호
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• pp.63-74
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• 1992

뮤온 촉매 핵융합에서 뮤온 분자이온 dt$\mu$의 공명 형성율을 수소밀도와 온도의 함수로서 계산하였다. 부분파 방법을 도입하여 t$\mu$와 중양자 사이의 탄성산란 단면적을 구하였고, 충격근사를 써서 여기상태의 [(dt$\mu$)dee]＊의 천이를 구속상태 형성인자로 도출하였다. 여기상태 dt$\mu$의 탈여기 기작으로는 방사선 방출, 오오져, 그리고 충돌 탈여기를 고려하였고 이들에 대한 탈여기폭과 역붕괴폭을 계산하였다. 계산된 반응폭들로부터 공명 상태 dt$\mu$의 형성단면적을 구하고 이것을 써서 수소의 밀도와 온도의 함수로서 dt$\mu$-d, dt$\mu$-t 공명 형성율을 계산하였다. 계산결과로 부터 공명형성율은 수소의 밀도와 더불어 증가하고, 상대충돌 에너지가 공명에너지와 같아지는 온도에서 최대값을 갖는다는 것을 알았다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.50-50
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• 1994

Half-metallic Heusler alloys (NiMnSb, ppdMnSb, pptMnSb) have attracted much attention due to their unique electronic and magnetic structures. Sppin-ppolarized band structure calculation ppredicts metallic behavior for the majority sppin states and semiconductor behavior for the minority sppin states. We have studied the electronic structures of these half-metallic Heusler alloys by core-level pphotoemission sppectroscoppy of Mn 2pp and 3s XppS sppectra. We found large intensities of Mn 2pp satellites and 3s exchange spplitting comppared with other metal Mn-alloys. These satellite structure can be understood by applying Anderson imppurity model. This fact supports the calculated sppin pprojected ppartial density of states which suggests that the valence electrons be highly sppin ppolarized near Fermi level and that the electrons involved with charge-transfer be mainly minority sppin ones which have semiconducting band structure. The trend of charge transfer energies Δ from ligands (Sb 5pp) to Mn 3d, obtained from our model fitting, is consistent with that calculated from sppin pprojected ppartial density of state. Also the trend of d-d electron correlation energies U calculated from Mn Auger line L3 VV by Mg $K\alpha$ source is comppatible with that resulted from our model fitting. We fitted the Mn 3s curve in the same way as for insulating Mn comppounds by using the same pparameters calculated from Mn 2pp curve fitting exceppt for the Coulomb interaction energy Q between core hole and d-electrons. The 3s sppectra were analyzed by combing the charge transfer model and a simpple model taking into account the configuration mixing effect due to the intra-shell correlation. We found that the exchange interaction between 3s hole and 3d electrons is mainly respponsible for the satellite of Mn 3s sppectra. This is consistent with the neutron scattering data, which suggests local 3d magnetic moment. We find that the XppS analysis results of Mn 2pp and 3s satellite structures of half-metallic Heusler alloys are very similar to those of insulating transition metal comppounds.

• 한국재료학회지
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• 제12권6호
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• pp.493-498
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• 2002

$Al_2O_3$ is a promising gate dielectric because of its high dielectric constant, high resistivity and low leakage current. Since $OH^-$ radical in $Al_2O_3$ films deposited by ALD using TMA and $H_2O$ degrades the good properties of $Al_2O_3$, TMA and $O_3$ were used to deposite $Al_2O_3$ films and the effects of $O_3$ on the properties of the $Al_2O_3$ films were investigated. The growth rate of the $Al_2O_3$ film under the optimum condition was 0.85 $\AA$/cycle. According to the XPS analysis results the $OH^-$ concentration in the $Al_2O_3$ film deposited using $O_3$ is lower than that using $H_2O$. RBS analysis results indicate the chemical formula of the film is $Al_{2.2}O_{2.8}$. The carbon concentration in the film detected by AES is under 1 at%. SEM observation confirms that the step coverage of the $Al_2O_3$ film deposited by ALD using $O_3$ is nearly 100%.

• 한국결정성장학회지
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• 제7권2호
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• pp.207-215
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• 1997

Ionized Cluster Beam Deposition(ICBD)방법을 이용하여 Si(100)기판과 TiN(60 nm)/Si(100)기판위에 Al 박막을 증착하였다. 증착된 Al 박막의 증착특성은 $\alpha$-step, four-point-probe, XRD, SEM, AES 측정장치를 가지고 조사해 보았다. 도가니 온도가 증가함에 따라 Al 박막의 증착속도는 증가하였고 비저항 값은 감소하였다. 도가니 온도가 $1800^{\circ}C$인 경우 가속전압이 증가함에 따라 연속적이며 평평한 박막이 형성되고 비저항이 감소되었다. 최소의 비저항 값은 Si 기판에서는 가속전압이 4 kV일 때 3.4 $\mu \Omega \textrm {cm}$, TiN 기판에서는 가속전압이 2kV일 때 3.6 $\mu \Omega \textrm {cm}$. AES 분석결과 형성된 박막내에서는 불순물이 존재하지 않는 것을 알 수 있었다. 따라서 Al 박막의 비저항은 박막충의 미세구조에 의해 영향을 받는다.

• 한국전기전자재료학회논문지
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• 제18권12호
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• pp.1080-1086
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• 2005

We have studied the Ge redistribution after dry oxidation and the oxide growth rate of $Si_{1-x}Ge_x$ epitaxial layer. Oxidation were performed at 700, 800, 900, and $1,000\;^{\circ}C$. After the oxidation, the results of RBS (Rutherford Back Scattering) & AES(Auger Electron Spectroscopy) showed that Ge was completely rejected out of the oxide and pile up at $Si_{1-x}Ge_x$ interface. It is shown that the presence of Ge at the $Si_{1-x}Ge_x$ interface changes the dry oxidation rate. The dry oxidation rate was equal to that of pure Si regardless of Ge mole fraction at 700 and 800$^{\circ}C$, while it was decreased at both 900 and $1,000^{\circ}C$ as the Ge mole fraction was increased. The dry of idation rates were reduced for heavy Ge concentration, and large oxiidation time. In the parabolic growth region of $Si_{1-x}Ge_x$ oxidation, the parabolic rate constant are decreased due to the presence of Ge-rich layer. After the longer oxidation at the $1,000^{\circ}C$, AES showed that Ge peak distribution at the $Si_{1-x}Ge_x$ interface reduced by interdiffusion of silicon and germanium.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1023-1028
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• 2004

RF magnetron sputtering을 이용하여 증착한 투명전도성 ZnO 박막의 F 도핑량에 따른 전기, 구조, 광학적 특성에 대해 고찰하였다. 순수 ZnO와 ZnO : $ZnF_2$(1.3 wt%) 그리고 ZnO : $ZnF_2$(10 wt%) 3개의 타겟들을 2개씩 조합 각각의 rf 파워를 조절하여 co-sputtering 방법으로 $ZnF_2$ wt%를 변화시켜 박막내의 F 도핑량을 조절하였다. 증착된 박막들은 열처리에 따른 물성 변화를 분석하기 위해 $5{\times}10^{-7}$ torr 이하의 진공 분위기에서 $300^{\circ}C$에서 2 시간 동안 열처리하였다. XRD 분석 결과 제작된 모든 ZnO 박막은 (002) 우선 방위 특성을 보였고 F 도핑량 증가에 따라 (101), (110), (100) 방향의 약한 피크들이 나타났으며, 이러한 구조적 특성 변화는 이동도의 변화와 밀접한 관계가 있는 것으로 나타났다. Auger로 박막 내의 F 량을 분석한 결과 최대 5.9 at%의 F이 포함되어 있었으며, 열처리 후 캐리어 농도와 이동도는 증가하였고 최고 $37cm^2/Vs$의 이동도를 나타내었으며, 모든 박막들은 가시광 영역에서 81 % 이상의 투과도를 가졌다.

• 마이크로전자및패키징학회지
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• 제12권3호
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• pp.207-212
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• 2005

Al, Ti, Ta 및 Cr 박막을 DC 마그네트론 스퍼터링방법으로 0 - 800 W의 RF 바이어스로 폴리이미드 기판에 가하면서 증착한 후 금속박막의 접착성을 연구하였다. 접착력은 $90^{\circ}$ 필 테스트로 평가하였다. 필 테스트 결과 모든 시편에서 기판에 RF 바이어스를 가하면 접착력이 향상되었다. RF바이어스를 가한 시편은 필링 도중 계면근처의 폴리이미드 내에서 파괴가 일어나면서 소성변형이 심하게 발생하였다. 단면 투과전자현미경 관찰에 의하면 금속/폴리이미드 계면은 분명하지 않고 복잡한 형상을 띄고 있었다. 이런 복잡한 계면은 RF 바이어스의 영향으로 생겼으며 접착력 향상의 주요 요인이었다.