• Bulletin of the Korean Chemical Society
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• v.28 no.8
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• pp.1285-1288
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• 2007

Au was electrolessly deposited on polycarbonate (PC) membranes (0.1 μm pores) at the air/water interface. It was found that the Au nanotube dimension can be controlled by adjusting the plating temperature and the solution composition. Interfacial deposition of Au at relatively low temperatures (4℃) produced long nanotubes, which run through the whole membrane thickness with small openings. Increase of plating temperatures resulted in the decrease of nanotube lengths and Au film thicknesses. It was also disclosed that the inside-diameter of Au nanotubes can be controlled with negligible variations in length by changing the composition of a plating solution.

• Analytical Science and Technology
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• v.6 no.2
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• pp.217-223
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• 1993

Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

• Carbon letters
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• v.13 no.1
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• pp.56-59
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• 2012

The defect sites on chemical vapor deposition grown graphene are investigated through the selective electrochemical deposition (SED) of Au nanoparticles. For SED of Au nanoparticles, an engineered potential pulse is applied to the working electrode versus the reference electrode, thereby highlighting the defect sites, which are more reactive relative to the pristine surface. Most defect sites decorated by Au nanoparticles are situated along the Cu grain boundaries, implying that the origin of the defects lies in the synthesis of uneven graphene layers on the rough Cu surface.

• Journal of Electrochemical Science and Technology
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• v.10 no.2
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• pp.206-213
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• 2019

The development of simple methods for As detection has received great attention because As is a toxic chemical element causing environmental and health-related issues. In this work, the effect of nanostructures of Au electrodes on their electroanalytical performance during As detection was investigated. Different Au nanostructures with various surface morphologies such as nanoplate Au, nanospike Au, and dendritic Au structures were prepared, and their electrochemical behaviors toward square-wave anodic stripping voltammetric As detection were examined. The difference in intrinsic efficiency for As detection between nanostructured and flat Au electrodes was explained based on the crystallographic orientations of Au surfaces, as examined by the underpotential deposition of Pb. The most efficient As detection performance was obtained with nanoplate Au electrodes, and the effects of the pre-deposition time and interference on As detection of the nanoplate Au electrodes were also investigated.

• Journal of the Korean institute of surface engineering
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• v.55 no.5
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.49-57
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• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• Journal of Electrochemical Science and Technology
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• v.3 no.2
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• pp.57-62
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• 2012

In this report, we demonstrate that the longitudinal localized surface plasmon resonance mode can be suppressed when the nanorods were in dumbbell shape. The seed nanorods were synthesized by electrochemical deposition of metals into the pores of anodic aluminum oxide templates. The dumbbell-like nanorods were grown from seed Au-Ni-Au nanorods by a rate-controlled seed-mediated growth strategy. The selective deposition of Au atoms onto Au blocks of Au-Ni-Au nanorods produced larger diameter of Au nanorods with bumpy surface resulting in dumbbell-like nanorods. The morphology of nanorods depended on the reduction rate of $AuCl_4^-$, slow rate producing smooth surface of Au nanorods, but high reduction rate producing bumpy surface morphology. Through systematic investigation into the UV-Vis-NIR spectroscopy, we found that the multiple localized surface plasmon resonance (LSPR) modes were available from single-component Au nanorods. And, their LSPR modes of Au NRs with bumpy surface, compared to the smooth seed Au NRs, were red-shifted, which was obviously attributed to the increased electron oscillation pathways. While the longitudinal LSPR modes of smoothly grown Au NRs were blue-shifted except for a dipole transverse LSPR mode, which can be interpreted by decreased aspect ratio. In addition, dumbbell-like nanorods showed an almost disappeared longitudinal LSPR mode. It reflects that the plasmonic properties can be engineered using complex nanorods structure.

• Journal of the Korean Electrochemical Society
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• v.18 no.3
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• pp.107-114
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• 2015

Electrochemical fabrication of nanostructured Au surfaces has received increased attention. In the present work, electrochemical modification of Au surfaces for fabricating nanostructured Au surfaces in the absence of externally added precursors is presented, which is different to the previous methods utilizing electrochemical deposition of externally added precursors. Application of anodic potential at Au surfaces in phosphate buffers containing $Br^-$ resulted in the anodic dissolution of Au, which produced Au precursors at the electrode surfaces. The resulting Au precursors were further reduced at the surface to produce nanostructured Au structures. The effects of applied potential and time on the morphology of Au nanostructures were systematically examined, from which a unique backbone type Au nanostructures was produced. The backbone type Au nanostructures exhibited high surface-enhanced Raman activity. The present work would give insights into the formation of electrochemical fabrication of nanostructured Au surfaces.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.89-89
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• 2011

a-GIZO(비정질 Ga-In-Zn-O)박막은 유연하며 광학적으로 투명하고 높은 전자의 이동도를 갖는 반도체적 특성을 갖기 때문에 차세대 display분야에서 TFT(Thin-Film-Transistor)의 high speed active-matrix layer로써 각광을 받고 있다. 이 물질의 표면은 환경 및 표면처리에 매우 민감하며 [1,2], 이 표면에 metal이 증착되는 경우에도, 선행 연구에 의하면, 다양한 chemical state가 나타남을 알 수 있었다. 이것은 metal의 증착에 따라 metal과 a-GIZO 사이의 contact 저항이 달라짐을 의미한다. 우리는 a-GIZO 박막 위에 Au를 단계적으로 증착시키면서, Au coverage 증가에 따른 core-level과 valence에서의 x-ray photoelectron spectra의 변화를 살펴봄으로써 a-GIZO박막과 Au의 계면에서 일어나는 chemical state의 변화를 알 수 있었다. 특히, Au deposition의 전 처리과정으로써 Ne ion sputtering을 두 단계로 다르게 하여 a-GIZO의 표면환경에 따른 Au 증착의 영향을 살펴보았다.