Browse > Article
http://dx.doi.org/10.5012/bkcs.2007.28.8.1285

Simultaneous Control of Au Nanotube Lengths and Pore Sizes with a Single Kind of Polycarbonate Membrane via Interfacial Deposition at the Air/Water Interface  

Pyo, Myoung-Ho (Department of Chemistry, Sunchon National University)
Joo, Jung-Sook (Department of Chemistry, Sunchon National University)
Jung, Youn-Su (Department of Chemistry, Sunchon National University)
Publication Information
Abstract
Au was electrolessly deposited on polycarbonate (PC) membranes (0.1 μm pores) at the air/water interface. It was found that the Au nanotube dimension can be controlled by adjusting the plating temperature and the solution composition. Interfacial deposition of Au at relatively low temperatures (4℃) produced long nanotubes, which run through the whole membrane thickness with small openings. Increase of plating temperatures resulted in the decrease of nanotube lengths and Au film thicknesses. It was also disclosed that the inside-diameter of Au nanotubes can be controlled with negligible variations in length by changing the composition of a plating solution.
Keywords
PC membrane; Au nanotube; Electroless deposition; Interfacial deposition;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By Web Of Science : 0  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
연도 인용수 순위
1 Sung, D. D.; Choo, M. S.; Noh, J. S.; Chin, W. B.; Yang, W. S. Bull. Korean Chem. Soc. 2006, 27, 1159   DOI   ScienceOn
2 Hoa, M. L. K.; Lu, M.; Zhang, Y. Adv. Colloid Interface Sci. 2006, 121, 9   DOI   ScienceOn
3 Diaz, D. J.; Williamson, T. L.; Gua, X.; Sood, A.; Bohn, P. W. Thin Solid Films 2006, 514, 120   DOI   ScienceOn
4 Apel, P. Yu.; Blonskaya, I. V.; Dmitriev, S. N.; Orelovitch, O. L.; Sartowska, B. J. Membr. Sci. 2006, 282, 393   DOI   ScienceOn
5 Li, C. Bull. Korean Chem. Soc. 2006, 27, 991   DOI   ScienceOn
6 Hernandez-Velez, M. Thin Solid Films 2006, 495, 51   DOI   ScienceOn
7 Harrell, C. C.; Lee, S. B.; Martin, C. R. Anal. Chem. 2003, 75, 6861   DOI   ScienceOn
8 Zhao, S.; Roberge, H.; Yelon, A.; Veres, T. J. Am. Chem. Soc. 2006, 128, 12352   DOI   ScienceOn
9 Yang, Z.; Xia, Y.; Sun, X.; Mokaya, R. J. Phys. Chem. B 2006, 110, 18424   DOI   ScienceOn
10 Nishizawa, M.; Menon, V. P.; Martin, C. R. Science 1995, 268, 700   DOI   ScienceOn
11 Martin, C. R.; Nishizawa, M.; Jirage, K.; Kang, M. J. Phys. Chem. B 2001, 105, 1925   DOI   ScienceOn
12 Gasparac, R.; Mitchell, D. T.; Martin, C. R. Electrochim. Acta 2004, 49, 847   DOI   ScienceOn
13 Reynes, O.; Demoustier-Champagne, S. J. Electrochem. Soc. 2005, 152, D130   DOI   ScienceOn
14 Hoa, M. L. K.; Lu, M.; Zhang, Y. Adv. Coll. Interf. Sci. 2006, 121, 9   DOI   ScienceOn
15 Zhang, B. J.; Davis, S. A.; Mendelson, N. H.; Mann, S. Chem. Commun. 2000, 9, 781
16 Park, S.; Lim, J.-H.; Chung, S.-W.; Mirkin, C. A. Science 2004, 303, 348   DOI   ScienceOn
17 Menon, V. P.; Martin, C. R. Anal. Chem. 1995, 67, 1920   DOI
18 Yamada, K.; Gasparac, R.; Martin, C. R. J. Electrochem. Soc. 2004, 151, E14   DOI   ScienceOn