• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1008-1011
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• 2001

The purpose of this paper is to evaluate the chip breakability during turning using the experimental equation, which is developed by an orthogonal array method. The chip breaking index(CB), non-dimensional parameter is used in the evaluation of chip breakability. The analysis of variance(ANOVA)-test has been used to check the significance of cutting parameters. And using the result of ANOVA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.4
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• pp.133-136
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• 2004

This research aims to develop a DNA chip array without an indicator. We fabricated a microelectrode array through photolithography technology. Several DNA probes were immobilized on an electrode. Then, target DNA was hybridized and measured electrochemically. Cyclic-voltammograms (CVs) showed a difference between the DNA probe and mismatched DNA in an anodic peak. This indicator-free DNA chip resulted in a sequence-specific detection of the target DNA.

• 한국생물공학회:학술대회논문집
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• 2005.04a
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• pp.47-47
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• 2005

There are many different surface technologies currently applied for preparation of protein chips. However, it requires innovative surface chemistry for capture proteins to be immobilized on chip surface keeping their conformation and activity intact and their orientation right, while they bind tightly and densely in a given array spot. Proteogen has developed 'ProteoChip BP' coated with novel proprietary linker molecules $(ProLinker^{TM})$ for efficient and robust immobilizations of capture proteins by improving surface properties of molecular captures. It was demonstrated that $ProLinker^{TM}$ gave the best surface performance in preparation of protein microarray chip base plates among others currently available on the market. In particular, the $ProLinker^{TM}-based$ surface chemistry has demonstrated to provide excellent performance in preparation of 'Antibody Chip' for analysis of biomarkers as well as proteome expression profiles. The linker molecule has also shown to be well applicable for development of biosensors and micro-beads as well as protein microarray and nano-array. ProteoChip BP can be used either for preparation of high-density array by using a microarrayer or for preparation of 'Well-on-a-Chip' with low density array, which is better applicable for quantitative analysis of biomarkers or protein-protein interactions. The biomarker assay can be performed either by direct or sandwich methods of fluorescence immunoassay. Application of ProteoChip BP has been well demonstrated by the extensive studies of 1) tumor-marker assays, 2) new drug screening by using 'Integrin Chip' and 3) protein expression profile analysis. Some of experimental results will be presented.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of Sensor Science and Technology
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• v.4 no.4
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• pp.55-61
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• 1995

A new ISFET array chip, based on detection of the threshold voltages of ISFETs by using an adjustable input, was designed. The chip includes 240 pH-ISFETs and circuitry such as comparators, a decoder and register. The chip has increased reliability, improved accuracy, digital output capability and the possibility of multi sensor implementation. To fabricate the chip, an extended CMOS process was devised and implemented.

• ETRI Journal
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• v.42 no.6
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• pp.943-950
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• 2020

We propose 8.2-GHz band radar RFICs for an 8 × 8 phased-array frequency-modulated continuous-wave receiver developed using 65-nm CMOS technology. This receiver panel is constructed using a multichip solution comprising fabricated 2 × 2 low-noise amplifier phase-shifter (LNA-PS) chips and a 4ch RX front-end chip. The LNA-PS chip has a novel phase-shifter circuit for low-voltage operation, novel active single-to-differential/differential-to-single circuits, and a current-mode combiner to utilize a small area. The LNA-PS chip shows a power gain range of 5 dB to 20 dB per channel with gain control and a single-channel NF of 6.4 dB at maximum gain. The measured result of the chip shows 6-bit phase states with a 0.35° RMS phase error. The input P1 dB of the chip is approximately -27.5 dBm at high gain and is enough to cover the highest input power from the TX-to-RX leakage in the radar system. The gain range of the 4ch RX front-end chip is 9 dB to 30 dB per channel. The LNA-PS chip consumes 82 mA, and the 4ch RX front-end chip consumes 97 mA from a 1.2 V supply voltage. The chip sizes of the 2 × 2 LNA-PS and the 4ch RX front end are 2.39 mm × 1.3 mm and 2.42 mm × 1.62 mm, respectively.

• Bulletin of the Korean Chemical Society
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• v.26 no.3
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• pp.379-383
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• 2005

This research aims to develop DNA chip array without an indicator. We fabricated microelectrode array by photolithography technology. Several DNA probes were immobilized on an electrode. Then, indicator-free target DNA was hybridized by an electrical force and measured electrochemically. Cyclic-voltammograms (CVs) showed a difference between DNA probe and mismatched DNA in an anodic peak. Immobilization of probe DNA and hybridization of target DNA could be confirmed by fluorescent. This indicator-free DNA chip microarray resulted in the sequence-specific detection of the target DNA quantitatively ranging from $10^{-18}\;M\;to\;10^{-5}$ M in the buffer solution. This indicator-free DNA chip resulted in a sequence-specific detection of the target DNA.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.279-284
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• 2000

The object of this paper is to evaluate the chip breakability using the experimental equation of surface roughness, which is developed in turning by an orthogonal array method. L$\sub$9/(3$^4$) orthogonal array method, one of fractional factorial design has been used to study effects of main cutting parameters such as cutting speed, feed rate and depth of cut, on the surface roughness. The evaluation of chip breakability is used the chip breaking index(C$\sub$B/), non-dimensional parameter. And the analysis of variance (ANOYA)-test has been used to check the significance of cutting parameters. Using the result of ANOYA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed. The coefficient of determination of this equation is 0.866.

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.221-224
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• 2019

Based on the results of studies on acetone excretion in diabetic patients, a one - chip sensors array was fabricated by combining acetone-selective sensor materials and volatile-organic-compound sensitive sensor materials. An electonic-nose was implemented using a sensor array and confirmed selectivity for five gases. In this system, the excretion of diabetic patients and controls was sampled with solid phase microextraction fiber and transferred to the sensor array. Although the control and diabetic patients were distinct, several samples failed. In the control group, the results of blood tests were normal, but patients were highly obese. In addition, the gas chromatography mass spectrometry results for the subjects revealed chemicals that are external factors.