• Journal of Welding and Joining
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• 제20권6호
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• pp.106-106
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and Ti₃Ag and titanium oxide, TiO₂were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of 900℃ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about 30㎛, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• 한국재료학회지
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• 제17권8호
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• Journal of Welding and Joining
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• 제20권6호
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• pp.830-837
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• Journal of Welding and Joining
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• 제20권1호
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Advances in nano research
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• 제5권4호
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• pp.373-392
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• 2017

Silver nanoparticles (AgNPs) were successfully synthesized through a simple green route using the Nelumbo nucifera leaf, stem and flower extracts. These nanoparticles showed characteristic UV-Vis absorption peaks between 410-450 nm which arises due to the plasmon resonance of silver nanoparticles. The Fourier transform infrared spectroscopy (FT-IR) confirmed the presence of amides and which acted as the stabilizing agent. X-ray diffraction spectrum of the nanoparticles confirmed the Face centered cubic (FCC) structure of the formed AgNPs. Dynamic light scattering technique was used to measure hydrodynamic diameter (68.6 nm to 88.1 nm) and zeta potential (-55.4 mV, -57.9 mV and 98.9 mV) of prepared AgNPs. The scanning electron micrographs of dislodged nanoparticles in aqueous solution showed the production of reasonably monodispersed silver nanoparticles (1-100 nm). The antimicrobial activity of prepared AgNPs was evaluated against fungi, Gram-positive and Gram-negative bacteria using disc diffusion method. Anti-corrosion studies were carried out using coupon method (mild steel and iron) and dye degradation studies were carried out by assessing photo-catalytic activity of Nelumbo nucifera extracts mediated AgNPs.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.237.2-237.2
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• 2013

ReRAM cell, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of conductive filament in a solid electrolyte [1,2]. Especially, Chalcogenide-based ReRAM have become a promising candidate due to the simple structure, high density and low power operation than other types of ReRAM but the uniformity of switching parameter is undesirable. It is because diffusion of ions from anode to cathode in solid electrolyte layer is random [3]. That is to say, the formation of conductive filament is not go through the same paths in each switching cycle which is one of the major obstacles for performance improvement of ReRAM devices. Therefore, to control of nonuniform conductive filament formation is a key point to achieve a high performance ReRAM. In this paper, we demonstrated the enhanced repeatable bipolar resistive switching memory characteristics by spreading the Ag nanocrystals (Ag NCs) on amorphous GeSe layer compared to the conventional Ag/GeSe/Pt structure without Ag NCs. The Ag NCs and Ag top electrode act as a metal supply source of our devices. Excellent resistive switching memory characteristics were obtained and improvement of voltage distribution was achieved from the Al/Ag NCs/GeSe/Pt structure. At the same time, a stable DC endurance (>100 cycles) and an excellent data retention (>104 sec) properties was found from the Al/Ag NCs/GeSe/ Pt structured ReRAMs.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.130-132
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• 1994

We fabricated Ag ion exchange glass waveguide. Generally, ion-exchange glass waveguide. are suitable for passive integrated optical components such as directional and star couplers. Its advantages include low loss, ease of fabrication, and low material cost. So, we faricated Ag ion-exchange glass waveguides in AgNO$_3$ melt solution from 2 mole %. And we used Sodalime glass as a substrate in the fabrication process. As the results, we observed multivalent ion-exchange in a typical sodalime glass. Diffusion coefficient and depth are predicted by actual experimental data of Stewart. The exchange rate in silver-ion-exchanged waveguides are compared to the exchange time of waveguide fabrication.

• 한국세라믹학회지
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• 제53권6호
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• pp.682-688
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• 2016

In $TiO_2$-CuO systems, low-temperature sinterability was investigated by a conventional sintering method. Sintering temperatures were set at under $950^{\circ}C$, at which the volume diffusion is inactive. The temperatures are less than the melting point of Ag ($961^{\circ}C$), which is often used as an internal conductor in low-temperature co-fired ceramic technology. To optimize the amount of CuO dopant, various dopant contents were added. The optimum level for enhanced densification was 2 wt% CuO. Excess dopants were segregated to the grain boundaries. The segregated dopants supplied a high diffusion path, by which grain boundary diffusion improved. At lower temperatures in the solid state region, grain boundary diffusion was the principal mass transport mechanism for densification. The enhanced grain boundary diffusion, therefore, improved densification. In this regard, the results of this study prove that the sintering mechanism was the same as that of activated sintering.

• 한국자기학회지
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• 제22권2호
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• pp.37-41
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• 2012

DC 스퍼터를 이용하여 은(Ag) 나노입자를 입도 0.2~3 ${\mu}m$ 크기를 갖는 페롭스카이트(Perovskite) $La_{0.7}Sr_{0.3}Co_{0.3}Fe_{0.7}O_{3-{\delta}}$(LSCF) 입자 표면에 코팅하여 복합재를 제조하였다. 제조된 LSCF/Ag 복합재에서 Ag 나노입자는 수 나노입자 크기로 형성되었으며 Ar가스 분위기에서 $800^{\circ}C$ 열처리 후에도 Ag입자가 응집되는 현상이 없어 안정적으로 증착되었음을 확인하였다. LSCF 표면에 Ag나노입자 코팅양이 2.11 wt.%까지 증가함에 따라 Fourier Transform Infrared Spectroscopy(FT-IR) 분광기의 파수가 크게 변하여 강한 결합이 형성되어 있으며, Ag 코팅 전후 결정 구조의 변화는 없으나 M$\ddot{o}$ssbauer 분광 분석으로 확인한 결과 $Fe^{4+}$ 이온이 감소하면서 $Fe^{3+}$ 이온이 증가하여 LSCF의 전자 가에 변화가 생김을 확인 할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 센서 박막재료
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• pp.6-10
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• 2001

We synthesized polypyrrole (PPy) nanotubules by oxidative polymerization of the pyrrole monomer on the pore of a polycarbonate membrane. The electrochemical behavior was investigated using cyclic voltammetry and AC impedance. The redox potential was about -0.5 V vs. Ag/AgCl reference electrode, while the potential was about 0 V for electro-synthesized PPy film. It is considered as the backbone grows according to the pore wall. Therefore, it is possible to be arranged regularly. That leads to improvement in the electron hopping. The AC impedance plot gave a hint of betterment of mass transport. PPy nanotubules have improved in mass transport, or diffusion. That is because the diffusion occurs through a thin pore wall of PPy nanotubules. The kinetic parameter of PPy nanotubules enzyme electrode with glucose solution was evaluated. The formal Michaelis constant and maximum current calculated by computer were about 23.8 mmol $dm^{-3}$ and $440\;{\mu}A$ respectively. Obviously, an affinity for the substrate and current response of the PPy nanotubules enzyme electrode are rather good, comparing with that of PPy film. What is more, the enzyme electrode is sensitive to blood sugar of a diabetic serum despite an obstruction of ascorbic acid, oxygen, some protein and/or hormone.