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http://dx.doi.org/10.3740/MRSK.2007.17.8.402

Activation Energy and Interface Reaction of Sn-40Pb/Cu & Sn-3.0Ag-0.5Cu/Cu  

Kim, Whee-Sung (Department of Materials Engineering, Korea Aerospace University)
Hong, Won-Sik (Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Park, Sung-Hun (Department of Materials Engineering, Korea Aerospace University)
Kim, Kwang-Bae (Department of Materials Engineering, Korea Aerospace University)
Publication Information
Korean Journal of Materials Research / v.17, no.8, 2007 , pp. 402-407 More about this Journal
Abstract
In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.
Keywords
Pb free; SnAgCu; Intermetallic Compound; Diffusion; Activation Energy;
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