Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Growth Kinetics of Intermetallic Compound on Sn-3.5Ag/Cu, Ni Pad Solder Joint with Isothermal Aging

등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구

  • 이인영 (성균관대학교 신소재공학과) ;
  • 이창배 (성균관대학교 신소재공학과) ;
  • 정승부 (성균관대학교 신소재공학과) ;
  • 서창제 (성균관대학교 신소재공학과)
  • Published : 2002.02.01
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Abstract

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

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References

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