• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.101-106
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• 2014

This paper presents a wide dynamic range radio-frequency (RF) root-mean-square (RMS) power detector using an automatic gain control (AGC) loop. The AGC loop consists of a variable gain amplifier (VGA), RMS conversion block and gain control block. The VGA exploits dB-linear gain characteristic of the cascade VGA. The proposed circuit utilizes full-wave squaring and generates a DC voltage proportional to the RMS of an input RF signal. The proposed RMS power detector operates from 500MHz to 5GHz. The detecting input signal range is from 0 dBm to -70 dBm or more with a conversion gain of -4.53 mV/dBm. The proposed RMS power detector is designed in a 65-nm 1.2-V CMOS process, and dissipates a power of 5 mW. The total active area is $0.0097mm^2$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.8
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• pp.959-965
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• 2019

In this paper, we design a low noise amplifier to support ka-band satellite communication systems using 65-nm RFCMOS process. The proposed low noise amplifier is designed with high-gain mode and low-gain mode, and is designed to control the gain according to the magnitude of the input signal. In order to reduce the power consumption, the supply voltage of the entire circuit is limited to 1 V or less. We proposed the gain control circuit that consists of the inverter structure. The 3D EM simulator is used to reduce the size of the circuit. The size of the designed amplifier including pad is $0.33mm^2$. The fabricated amplifier has a -7 dB gain control range in 3 dB bandwidth and the reflection coefficient is less than -6 dB in high gain mode and less than -15 dB in low gain mode.

• Journal of IKEEE
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• v.24 no.4
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• pp.1058-1063
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• 2020

This paper proposes a 12-bit SAR A/D(Successive Approximation Register Analog-to-Digital) converter that operates at low power for bio-signal and sensor signal processing. The conventional SAR A/D converter utilized the reduction of the dynamic current, which resulted in reducing total power consumption. In order to solve the limitation of the sampling time due to charging/discharging of the capacitor for reducing dynamic current, the different sampling time on the C-DAC bit switch operation was applied to reduce the dynamic current. In addition, lowering the supply voltage of the digital block to 0.6V led to 70% reduction of the total power consumption of the proposed ADC. The proposed SAR A/D was implemented with CMOS 65nm process 1-poly 6-metal, operates with a supply voltage of 1.2V. The simulation results demonstrate that ENOB, DNL/INL, power consumption and FoM are 10.4 bits, ±0.5LSB./±1.2LSB, 31.2uW and 2.8fJ/step, respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.280-285
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• 2015

A fully integrated high-efficiency linear CMOS power amplifier (PA) is developed for 802.11n WLAN applications using the 65-nm standard CMOS technology. The transformer topology is investigated to obtain a high-efficiency and high-linearity performance. By adopting a 2:2 output transformer, an optimum impedance is provided to the PA core. Besides, a LC harmonic control block is added to reduce the AM-to-AM/AM-to-PM distortions. The CMOS PA produces a saturated power of 26.1 dBm with a peak power-added efficiency (PAE) of 38.2%. The PA is tested using an 802.11n signal, and it satisfies the stringent error vector magnitude (EVM) and mask requirements. It achieves -28-dB EVM at an output power of 18.6 dBm with a PAE of 14.7%.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.96-99
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• 2006

In this research, a wafer-level transfer method of cantilever away on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.6 s.348
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• pp.9-17
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• 2006

We proposed a new High-speed CMOS Level Up/Down Shifter circuits that can be used with Dynamic Voltage and Frequency Scaling(DVFS) algorithm, for low power system in the SoC(System-on-Chip). This circuit used to interface between the other voltage levels in each CMOS circuit boundary, or between multiple core voltage levels in a system bus. Proposed circuit have advantage that decrease speed attenuation and duty ratio distortion problems for interface. The level up/down shifter of the proposed circuit designed that operated from multi core voltages$(0.6\sim1.6V)$ to used voltage level for each IP at the 500MHz input frequency The proposed circuit supports level up shifting from the input voltage levels, that are standard I/O voltages 1.8V, 2.5V, 3.3V, to multiple core voltage levels in between of $0.6V\sim1.6V$, that are used internally in the system. And level down shifter reverse operated at 1Ghz input frequency for same condition. Simulations results are shown to verify the proposed function by Hspice simulation, with $0.6V\sim1.6V$ CMOS Process, $0.13{\mu}m$ IBM CMOS Process and $0.65{\mu}m$ CMOS model parameters. Moreover, it is researched delay time, power dissipation and duty ration distortion of the output voltage witch is proportional to the operating frequency for the proposed circuit.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.4
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• pp.534-542
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• 2017

This paper presents a fast locking technique for a fractional-N PLL frequency synthesizer. The technique directly measures $K_{VCO}$ on a chip, computes the VCO's target tuning voltage for a given target frequency, and directly sets the loop filter voltage to the target voltage before the PLL begins the normal closed-loop locking process. The closed-loop lock time is significantly minimized because the initial frequency of the VCO are put very close to the desired final target value. The proposed technique is realized and designed for a 4.3-5.3 GHz fractional-N synthesizer in 65 nm CMOS and successfully verified through extensive simulations. The lock time is less than $12.8{\mu}s$ over the entire tuning range. Simulation verifications demonstrate that the proposed method is very effective in reducing the synthesizer lock time.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.5
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• pp.423-429
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• 2013

A 6-Gb/s differential voltage mode driver is presented whose output impedance and pre-emphasis level can be controlled independently. The voltage mode driver consists of five binary-weighted slices each of which has four sub-drivers. The output impedance is controlled by the number of enabled slices while the pre-emphasis level is determined by how many sub-drivers in the enabled slices are driven by post-cursor input. A prototype transmitter with a voltage-mode driver implemented in a 65-nm CMOS logic process consumes 34.8-mW from a 1.2-V power supply and its pre-emphasized output signal shows 165-mVpp,diff and 0.56-UI eye opening at the end of a cable with 10-dB loss at 3-GHz.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.61-66
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• 2009

We have investigated the noise sensitivity of low noise amplifier (LNA) at different frequency. This noise sensitivity analysis provides insights about noise parameters and it is very beneficial for making appropriate design trade-offs. From this work, the circuit designer can choose the adequate noise parameters tolerances.

• International journal of advanced smart convergence
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• v.10 no.3
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• pp.81-88
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• 2021

This paper proposes two types of subharmonic RF receiver front-end (called LMV) where, in a single stage, quadrature voltage-controlled oscillator (QVCO) is stacked on top of a low noise amplifier. Since the QVCO itself plays the role of the single-balanced subharmonic mixer with the dc current reuse technique by stacking, the proposed topology can remove the RF mixer component in the RF front-end and thus reduce the chip size and the power consumption. Another advantage of the proposed topologies is that many challenges of the direct conversion receiver can be easily evaded with the subharmonic mixing in the QVCO itself. The intermediate frequency signal can be directly extracted at the center taps of the two inductors of the QVCO. Using a 65 nm complementary metal oxide semiconductor (CMOS) technology, the proposed subharmonic RF front-ends are designed. Oscillating at around 2.4 GHz band, the proposed subharmonic LMVs are compared in terms of phase noise, voltage conversion gain and double sideband noise figure. The subharmonic LMVs consume about 330 ㎼ dc power from a 1-V supply.