• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.11
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• pp.117-123
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• 2013

By exploiting the regular read and write access patterns of embedded SRAM memories inside Viterbi decoder, the memory architecture can be efficiently modified to reduce the power consumption of write operation. According to the experimental results with 65nm CMOS process, the proposed embedded memory used for Viterbi decoder achieves 30.84% of power savings with 8.92% of area overhead compared to the conventional embedded SRAM approaches.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.8
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• pp.1891-1898
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• 2013

To efficiently execute 3D graphic APIs, such as OpenGL and Direct3D, special purpose arithmetic unit(SFU) which supports floating-point sine, cosine, reciprocal, inverse square root, base-two exponential, and logarithmic operations is designed. The SFU uses second order minimax approximation method and lookup table method to satisfy both error less than 2 ulp(unit in the last place) and high speed operation. The designed circuit has about 2.3-ns delay time under 65nm CMOS standard cell library and consists of about 23,300 gates. Due to its maximum performance of 400 MFLOPS and high accuracy, it can be efficiently applicable to mobile 3D graphics application.

• Journal of IKEEE
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• v.22 no.4
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• pp.1158-1162
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• 2018

A fast-lock multiplying delay-locked loop (MDLL)-based digital clock frequency multiplier with an anti-harmonic lock capability is presented. The proposed digital frequency multiplier utilizes a new most-significant bit (MSB)-interval search algorithm to achieve fast-locking time without harmonic lock problems. The proposed digital MDLL frequency multiplier is designed in a 65nm CMOS process, and the operating output frequency range is from 1 GHz to 3 GHz. The digital MDLL provides a programmable fractional-ratio frequency multiplication ratios of N/M, where N = 1, 4, 5, 8, 10 and M = 1, 2, 3, respectively. The proposed MDLL consumes 3.52 mW at 1GHz and achieves a peak-to-peak (p-p) output clock jitter of 14.07 ps.

• ETRI Journal
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• v.42 no.6
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• pp.943-950
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• 2020

We propose 8.2-GHz band radar RFICs for an 8 × 8 phased-array frequency-modulated continuous-wave receiver developed using 65-nm CMOS technology. This receiver panel is constructed using a multichip solution comprising fabricated 2 × 2 low-noise amplifier phase-shifter (LNA-PS) chips and a 4ch RX front-end chip. The LNA-PS chip has a novel phase-shifter circuit for low-voltage operation, novel active single-to-differential/differential-to-single circuits, and a current-mode combiner to utilize a small area. The LNA-PS chip shows a power gain range of 5 dB to 20 dB per channel with gain control and a single-channel NF of 6.4 dB at maximum gain. The measured result of the chip shows 6-bit phase states with a 0.35° RMS phase error. The input P1 dB of the chip is approximately -27.5 dBm at high gain and is enough to cover the highest input power from the TX-to-RX leakage in the radar system. The gain range of the 4ch RX front-end chip is 9 dB to 30 dB per channel. The LNA-PS chip consumes 82 mA, and the 4ch RX front-end chip consumes 97 mA from a 1.2 V supply voltage. The chip sizes of the 2 × 2 LNA-PS and the 4ch RX front end are 2.39 mm × 1.3 mm and 2.42 mm × 1.62 mm, respectively.

• Journal of IKEEE
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• v.24 no.4
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• pp.1172-1175
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• 2020

Automotive ECU integrates CPU core, IVN controller, memory interface, sensor interface, I/O interface, and so on. Current automotive ECUs are often developed with proprietary processor architectures. However, demends for standard processors such as ARM and RISC-V increase rapidly for saftware compatibility in autonomous vehicles and connected cars. In this paper, an automotive ECU is designed for parking assist system based on RISC-V with open instruction set architecture. It includes 32b RISC-V CPU core, IVN controllers such as CAN and LIN, memory interfaces such as ROM and SRAM, and I/O interfaces such as SPI, UART, and I2C. Fabricated in 65nm CMOS technology, its operating frequency, area, and gate count are 50MHz, 0.37㎟, and 55,310 gates, respectively.

• Transactions on Semiconductor Engineering
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• v.1 no.1
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• pp.14-22
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• 2023

This paper presents a low-power flip-flop(FF) circuit that minimizes the transition of internal nodes by using a dual change-sensing method. The proposed dual change-sensing FF(DCSFF) shows the lowest dynamic power consumption among conventional FFs, when there is no input data transition. From the measured results with 65nm CMOS process, the power consumption has been reduced by 98% and 32%, when the data activity is 0% and 100%, respectively, compared to conventional transmission gate FF(TGFF). Further, compared to change-sensing FF(CSFF), the power consumption of proposed DCSFF is smaller by 30%.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.73-80
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• 2007

For the sub-65 nm CMOS process, it is necessary to develop a new silicide material and an accompanying process that allows the silicide to maintain a low sheet resistance and to have an enhanced thermal stability, thus providing for a wider process window. In this study, we have evaluated the property and unit process compatibility of newly proposed composite silicides. We fabricated composite silicide layers on single crystal silicon from $10nm-Ni_{1-x}Co_x/single-crystalline-Si(100),\;10nm-Ni_{1-x}Co_x/poly-crystalline-\;Si(100)$ wafers (x=0.2, 0.5, and 0.8) with the purpose of mimicking the silicides on source and drain actives and gates. Both the film structures were prepared by thermal evaporation and silicidized by rapid thermal annealing (RTA) from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 seconds. The sheet resistance, cross-sectional microstructure, surface composition, were investigated using a four-point probe, a field emission scanning probe microscope, a field ion beam, an X-ray diffractometer, and an Auger electron depth profi1ing spectroscopy, respectively. Finally, our newly proposed composite silicides had a stable resistance up to $1100^{\circ}C$ and maintained it below $20{\Omega}/Sg$., while the conventional NiSi was limited to $700^{\circ}C$. All our results imply that the composite silicide made from NiCo alloy films may be a possible candidate for 65 nm-CMOS devices.

• Journal of electromagnetic engineering and science
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• v.16 no.4
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• pp.229-231
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• 2016

A 180-GHz signal source based on a 65-nm CMOS technology has been developed in this study. The 180-GHz signal source consists of a 90-GHz fundamental-mode Colpitts oscillator and a 180-GHz frequency doubler. A coupled-line is employed to couple two oscillator cores for generating a differential signal, which is delivered to the input of the differential-mode doubler. The fabricated signal source operates from 181.2 to 182.4 GHz with output power varying from -15.3 to -10.8 dBm. The peak output power was -10.53 dBm at 181.3 GHz with a DC power consumption of 42 mW, and the associated phase noise was -71 dBc/Hz at 1 MHz offset.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.3
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• pp.148-152
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• 2009

Recent CMOS technology scaling has seriously eroded the bit-line noise immunity of register files due to the consequent increase in active bit-line leakage currents. To restore its noise immunity while maintaining performance, we propose and evaluate a $256{\times}40$-bit register file incorporating dual-$V_t$ bit-lines with a boosted gate overdrive voltage in 65 nm bulk CMOS technology. Simulation results show that the proposed bootsrapping scheme lowers leakage current by a factor of 450 without its performance penalty.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.10
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• pp.87-95
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• 2014

This paper describes a dual channel receiver design for CIS interfaces. Each channel includes CTLE(Continuous Time Linear Equalizer), sampler, deserializer and clocking circuit. The clocking circuit is composed of PLL, PI and CDR. Fast lock acquisition time, short latency and better jitter tolerance are achieved by adding OSPD(Over Sampling Phase Detector) and FSM(Finite State Machine) to PI-based CDR. The CTLE removes ISI caused by channel with -6 dB attenuation and the lock acquisition time of the CDR is below 1 baud period in frequency offset under 8000ppm. The voltage margin is 368 mV and the timing margin is 0.93 UI in eye diagram using 65 nm CMOS technology.