• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.1324-1333
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• 2010

This paper is used in a recent civil engineering field in three-dimensional laser-meter tiles using thermal imaging cameras for the weathered rock slopes precisely measured indirectly, to the degree that began in the will. In the field is difficult to access the degree of weathering of the rock slope to the existing direct way to compensate for the shortcomings of 3D Terrestrial Laser Scanner and weathering characteristics of rocks using thermal imaging cameras to get the information to analyze the degree of rock weathering is. Intensity of 3D TLS and the thermal camera with image analysis to analyze the degree of weathering of bedrock in the field of core drilling targeting indoor laboratory tests were analyzed through the study. Granite, gneiss, sandstone, much of the cancerous samples, each experiment has a 40 per category, each of which 30 were used to analyze the data collected. That degree of rock weathering, the rock, depending on the strength of the Intensity values can change, depending on the level of thermal imaging camera, also weathered the changes in temperature could see. Intensity is the strength of weak rocks, the more value decrease, the temperature of the thermal imaging camera through the swell Intensity and notice that the temperature had an inverse relationship. Intensity value of the low strength of weak rock, but the value came out of the rocks have been proved to be largely dependent on the contrast. The contrast of the surface rocks are weathered dark Intensity values lower temperature to swell the contrary, the degree of weathering can be distinguished.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.39-48
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• 2016

In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

• Journal of the Korea Society of Computer and Information
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• v.3 no.4
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• pp.78-85
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• 1998

In this paper, we analyzed the performances for FH/CPFSK system with limiter - discriminator detection and integrate-and-dump post-detection filtering under thermal noise and partial-band jamming noise. And, we considered intersymbol interference - related SNR and differential phase parameters for all eight of the possible adjacent bit data patterns, FM noise clicks for evaluating FH/CPFSK and CPFSK systems. In result, the optimum modulation index h was 0.7 and the optimum value of bandwidth-time product D was 1.0. Next, when we considered the thermal noise under the partial-band jamming, the thermal noise significantly influenced the error probability of system below 20dB approximately but could ignore above 20dB.

• Journal of information and communication convergence engineering
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• v.15 no.2
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• pp.117-122
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• 2017

Three-dimensional integrated circuits (3D ICs), starting with memory cubes, have entered the mainstream recently. The benefits many predicted in the past are indeed delivered, including higher memory bandwidth, smaller form factor, and lower energy. However, 3D ICs have yet to find their deployment in aerospace applications. In this paper we first present key design tools and methodologies for high performance, low power, and reliable 3D ICs that mainly target terrestrial applications. Next, we discuss research needs to extend their capabilities to ensure reliable operations under the harsh space environments. We first present a design methodology that performs fine-grained partitioning of functional modules in 3D ICs for power reduction. Next, we discuss our multi-physics reliability analysis tool that identifies thermal and mechanical reliability trouble spots in the given 3D IC layouts. Our tools will help aerospace electronics designers to improve the reliability of these 3D IC components while not degrading their energy benefits.

• Journal of the Korea Society of Computer and Information
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• v.17 no.6
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• pp.1-11
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• 2012

As the process technology scales down, multi-core processors cause serious problems such as increased interconnection delay, high power consumption and thermal problems. To solve the problems in 2D multi-core processors, researchers have focused on the 3D multi-core processor architecture. Compared to the 2D multi-core processor, the 3D multi-core processor decreases interconnection delay by reducing wire length significantly, since each core on different layers is connected using vertical through-silicon via(TSV). However, the power density in the 3D multi-core processor is increased dramatically compared to that in the 2D multi-core processor, because multiple cores are stacked vertically. Unfortunately, increased power density causes thermal problems, resulting in high cooling cost, negative impact on the reliability. Therefore, temperature should be considered together with performance in designing 3D multi-core processors. In this work, we analyze the temperature of the cache in quad-core processors varying cache organization. Then, we propose the low-temperature cache organization to overcome the thermal problems. Our evaluation shows that peak temperature of the instruction cache is lower than threshold. The peak temperature of the data cache is higher than threshold when the cache is composed of many ways. According to the results, our proposed cache organization not only efficiently reduces the peak temperature but also reduces the performance degradation for 3D quad-core processors.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.664-670
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• 2018

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1742-1745
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• 2019

Hidden flame detection after allegedly extinguishing a fire cannot be emphasized enough. There are a few commercial hidden fire detection equipments which are imported, but the cost is relatively high. In this contribution, we propose a development of a low-cost, high-performance hidden flame detector using open-source hardware/software. We use Raspberry-pi based hardware board equipped with a TFT touch-screen LCD, a 3G modem, and an attachable battery device altogether integrated in a plastic case fabricated with a 3D printer. The proposed hidden flame detector shows the same performance of a commercial product FLIR E5 while consuming less than a half of the cost.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.7
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• pp.94-101
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• 1998

To form 0.2 .mu.m p$^{+}$-n junctions, BF$_{2}$ ions with the energy of 20keV and the dose of 2*10$^{15}$ cm$^{-2}$ were implanted into the crystalline and preamorphized silicon substrates. Th epreamorphization was performed using 45keV, 3*10$^{14}$ cm$^{-2}$ As or Ge ions. Th efurnace annealing and rapid thermal annealing were empolyed to annihilate the implanted damage and to activate the implanted boron ions.The junction properties were analyzed with the measured values of the junction depth, sheet resistances, residual defects, and leakage currents. The thermal cycle of furnace annela followed by rapid thermal annela shows better characteristics than the annealing sequence of rapid thermal anneal and furnace annela.Among the premorphization species, Ge ion exhibited the better characteristics than the As ion.n.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.18-23
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• 2012

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.39 no.4
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• pp.223-233
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• 2021

Systematic and continuous monitoring and management of the energy consumption of buildings are important for estimating building energy efficiency, and ultimately aim to cope with climate change and establish effective policies for environment, and energy supply and demand policies. Globally, buildings consume 36% of total energy and account for 39% of carbon dioxide emissions. The purpose of this study is to generate three-dimensional thermo-spatial building models with photogrammetric technique using drone TIR (Thermal Infrared) images to measure the temperature emitted from a building, that is essential for the building energy rating system. The aerial triangulation was performed with both optical and TIR images taken from the sensor mounted on the drone, and the accuracy of the models was analyzed. In addition, the thermo-spatial models of temperature distribution of the buildings in three-dimension were visualized. Although shape of the objects 3D building modeling is relatively inaccurate as the spatial and radiometric resolution of the TIR images are lower than that of optical images, TIR imagery could be used effectively to measure the thermal energy of the buildings based on spatial information. This paper could be meaningful to present extension of photogrammetry to various application. The energy consumption could be quantitatively estimated using the temperature emitted from the individual buildings that eventually would be uses as essential information for building energy efficiency rating system.