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http://dx.doi.org/10.6109/jicce.2017.15.2.117

Bringing 3D ICs to Aerospace: Needs for Design Tools and Methodologies  

Lim, Sung Kyu (School of Electrical and Computer Engineering, Georgia Institute of Technology)
Publication Information
Journal of information and communication convergence engineering / v.15, no.2, 2017 , pp. 117-122 More about this Journal
Abstract
Three-dimensional integrated circuits (3D ICs), starting with memory cubes, have entered the mainstream recently. The benefits many predicted in the past are indeed delivered, including higher memory bandwidth, smaller form factor, and lower energy. However, 3D ICs have yet to find their deployment in aerospace applications. In this paper we first present key design tools and methodologies for high performance, low power, and reliable 3D ICs that mainly target terrestrial applications. Next, we discuss research needs to extend their capabilities to ensure reliable operations under the harsh space environments. We first present a design methodology that performs fine-grained partitioning of functional modules in 3D ICs for power reduction. Next, we discuss our multi-physics reliability analysis tool that identifies thermal and mechanical reliability trouble spots in the given 3D IC layouts. Our tools will help aerospace electronics designers to improve the reliability of these 3D IC components while not degrading their energy benefits.
Keywords
3D ICs; Aerospace applications; Design tools;
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