• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Journal of the Ergonomics Society of Korea
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• v.25 no.2
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• pp.85-94
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• 2006

The purpose of this study is to extract typical body shapes of Korean adults based on the three-dimensional Korean anthropometric data measured through 5th national anthropometric survey and to examine the suitability of the 3-D human shape data for the interior packaging. 36 three-dimensional anthropometric variables related to the design of vehicle interior were considered for the appraisal of typical body shapes. Four major factors were extracted by the factor analysis and factor scores were calculated for all subjects. Typical or standard drivers of Korean adults were selected by the minimum deviation criteria for the four factor scores with respect to 5th, 50th, and 95th percentiles, respectively. Typical drivers of Korean adults were visualized by the CATIA-HUMAN program due to the absence of proper application software for three-dimensionally scanned human body data. There are considerable differences between the anthropometric data of Korean adults and those provided by CATIA-HUMAN program, which shows that the modeling data provided by CATIA-HUMAN should not be directly applied to the ergonomic evaluation for the vehicle design. This suggests the necessity for the development of suitable software for scanned human shape data. It is also expected that the anthropometric data of typical drivers extracted from this study help design package layouts and improve the suitability of ergonomic evaluation for Korean customers.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.96-99
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• 2000

We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.1
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• pp.57-63
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• 2015

Recently, LED is widely used in the kinds of display devices or lighting. In this paper, we fabricated LED chamber light for naval vessels to replace to conventional chamber light using incandescent lamp. The LED package of chamber light was designed with luminous intensity of 5.5 cd, color temperature of $6,000{\pm}500K$, forward voltage of 3~3.2 V and input current of 60 mA. A LED module was composed of 36 LED packages and metal PCB. The VF and luminous intensity of LED package were getting down when temperature increased. The temperature of LED chamber light was measured by changing the number of LED package and applied current for one hour when an electric current flow. The heat transfer capability have been improved by using metal PCB. The power consumption of LED chamber light reduced by 86% compared to the conventional chamber light using incandescent lamp.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.71-72
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• 2012

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• Journal of Integrative Natural Science
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• v.15 no.1
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• pp.9-18
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• 2022

This research examines the power of bootstrap two-sample test, and compares it with the powers of two-sample t-test and Wilcoxon rank sum test, through simulation. For simulation work, a positively skewed and heavy tailed distribution was selected as a population distribution, the chi-square distributions with three degrees of freedom, χ²₃. For two independent samples, the fist sample was selected from χ²₃. The second sample was selected independently from the same χ²₃ as the first sample, and calculated d+ax for each sampled value x, a randomly selected value from χ²₃. The d in d+ax has from 0 to 5 by 0.5 interval, and the a has from 1.0 to 1.5 by 0.1 interval. The powers of three methods were evaluated for the sample sizes 10,20,30,40,50. The null hypothesis was the two population medians being equal for Bootstrap two-sample test and Wilcoxon rank sum test, and the two population means being equal for the two-sample t-test. The powers were obtained using r program language; wilcox.test() in r base package for Wilcoxon rank sum test, t.test() in r base package for the two-sample t-test, boot.two.bca() in r wBoot pacakge for the bootstrap two-sample test. Simulation results show that the power of Wilcoxon rank sum test is the best for all 330 (n,a,d) combinations and the power of two-sample t-test comes next, and the power of bootstrap two-sample comes last. As the results, it can be recommended to use the classic inference methods if there are widely accepted and used methods, in terms of time, costs, sometimes power.

• Nuclear Engineering and Technology
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• v.53 no.11
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• pp.3543-3562
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• 2021

The methods and performance of a 3D pin-by-pin neutronics code based on the 2D/1D decoupling method are presented. The code was newly developed as an effort to achieve enhanced accuracy and high calculation performance that are sufficient for the use in practical nuclear design analyses. From the 3D diffusion-based finite difference method (FDM) formulation, decoupled planar formulations are established by treating pre-determined axial leakage as a source term. The decoupled axial problems are formulated with the radial leakage source term. To accelerate the pin-by-pin calculation, the two-level coarse mesh finite difference (CMFD) formulation, which consists of the multigroup node-wise CMFD and the two-group assembly-wise CMFD is implemented. To enhance the accuracy, both the discontinuity factor method and the super-homogenization (SPH) factor method are examined for pin-wise cross-section homogenization. The parallelization is achieved with the OpenMP package. The accuracy and performance of the pin-by-pin calculations are assessed with the VERA and APR1400 benchmark problems. It is demonstrated that pin-by-pin 2D/1D alternating calculations within the two-level 3D CMFD framework yield accurate solutions in about 30 s for the typical commercial core problems, on a parallel platform employing 32 threads.

• International Journal of Air-Conditioning and Refrigeration
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• v.12 no.3
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• pp.141-147
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• 2004

Cogeneration has been widely introduced in many countries for use m industrial, commercial and residential applications. However, there have been few models with an output of less than 100kW. In the present study, a spark ignited gas engine with electric generation output of 10kW was developed for micro cogeneration package. Developed gas engine achieved following performance characteristics such as $26.7\%$ of electric generation efficiency, NOx emission less than 10 ppm at $13\%$ oxygen, 82 dB of noise level, and about 3 seconds of switching time from idling to nominal power.