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http://dx.doi.org/10.7234/composres.2021.34.1.047

Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package  

Park, Seong Yeon (Department of Mechanical Engineering, KAIST)
On, Seung Yoon (Department of Mechanical Engineering, KAIST)
Kim, Seong Su (Department of Mechanical Engineering, KAIST)
Publication Information
Composites Research / v.34, no.1, 2021 , pp. 47-50 More about this Journal
Abstract
In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.
Keywords
EMC/Cu Bi-layer Package; CNT Heater; Hot Press; Void; Warpage;
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  • Reference
1 Lu, D., and Wong, C.P. (Eds.), "Materials for Advanced Packaging", Vol. 181, New York: Springer, 2009.
2 Li, Y., and Goyal, D. (Eds.), "3D Microelectronic Packaging: from Fundamentals to Applications", Vol. 57, Springer, 2017.
3 Centea, T., and Nutt, S.R., "Manufacturing Cost Relationships for Vacuum Bag-only Prepreg Processing", Journal of Composite Materials, Vol. 50, No. 17, 2016, pp. 2305-2321.   DOI
4 Witik, R.A., Gaille, F., Teuscher, R., Ringwald, H., Michaud, V., and Manson, J.-A.E., "Economic and Environmental Assessment of Alternative Production Methods for Composite Aircraft Components", Journal of Cleaner Production, Vol. 29, 2012, pp. 91-102.   DOI
5 Lee, J., Ni, X., Daso, F., Xiao, X., King, D., Gomez, J.S., Varela, T.B., Kessler, S.S., and Wardle, B.L., "Advanced Carbon Fiber Composite Out-of-autoclave Laminate Manufacture via Nano-structured Out-of-oven Conductive Curing", Composites Science and Technology, Vol. 166, 2018, pp. 150-159.   DOI
6 Monaghan, P.F., and Brogan, M.T., "An Overview of Heat Transfer for Processing Thermoplastic Composites in Autoclaves", Proc Flow Processes in Composites Materials Conference. 1991.
7 Chien, A.T., Cho, S., Joshi, Y., and Kumar, S., "Electrical Conductivity and Joule heating of Polyacrylonitrile/Carbon Nano-tube Composite Fibers", Polymer, Vol. 55, No. 26, 2014, pp. 6896-6905.   DOI
8 Mohiuddin, M., and Hoa, S.V., "Temperature Dependent Electrical Conductivity of CNT-PEEK Composites", Composites Science and Technology, Vol. 72, No. 1, 2011, pp. 21-27.   DOI
9 Tsai, M.Y., Ting, C.W., Huang, C.Y., and Lai, Y.S., "Determination of Residual Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes", Microelectronics Reliability, Vol. 51, No. 3, 2011, pp. 642-648.   DOI