• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.277-282
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• 2008

A fully integrated inductorless CMOS impulse radio ultra-wideband (IR-UWB) receiver is implemented using $0.18\;{\mu}m$ CMOS technology for 3-5 GHz application. The UWB receiver adopts the non-coherent architecture, which removes the complexity of RF architecture and reduces power consumption. The receiver consists of inductorless differential three stage LNA, envelope detector, variable gain amplifier (VGA), and comparator. The measured sensitivity is -70 dBm in the condition of 5 Mbps and BER of $10^{-3}$. The receiver chip size is only $1.8\;mm\;{\times}\;0.9\;mm$. The consumed current is 15 mA with 1.8 V supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.754-759
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• 2016

A transformer feedback low-noise amplifier (LNA) is implemented in a standard $0.18{\mu}m$ CMOS process, which exploits drain-to-gate transformer feedback technique for wideband input matching and operates across entire 3~5 GHz ultra-wideband (UWB). The proposed LNA achieves power gain above 9.5 dB, input return loss less than 15.0 dB, and noise figure below 4.8 dB, while consuming 8.1 mW from a 1.8-V supply. To the authors' knowledge, drain-to-gate transformer feedback for wideband input matching cascode LNA is the first adopted technique for UWB application.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.457-458
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• 2008

This paper presents an output common mode current compensation method to achieve both constant Gm and constant gain. A conventional rail-to-rail CMOS op-amp with constant Gm was designed by using complementary differential input stage and current compensation skills. But it doesn't operate constant gain, because of output resistance variation. With $0.18{\mu}m$ CMOS process, the simulation results show that the differential gain variation can achieve less than 1.3dB. And a 60dB gain, a 13.5MHz unity gain-frequency, and 1mW power consumption, when operating at 1.8V and 10pF load.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.283-288
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• 2008

A post-linearization technique for the differrential CMOS LNA is presented. The proposed method uses an additional cross-coupled common-source FET pair to cancel out the third-order intermodulation ($IM_3$) current of the main differential amplifier. This technique is applied to enhance the linearity of CMOS LNA using $0.18-{\mu}m$ technology. The LNA achieved +10.2 dBm IIP3 with 13.7 dB gain and 1.68 dB NF at 2 GHz consuming 11.8 mA from a 1.8-V supply. It shows IIP3 improvement by 6.6 dB over the conventional cascode LNA without the linearizing circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.185-185
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• 2008

This paper describes the broadband SDC (Single-ended to Differential Converter) for Digital Video Broadcasting-Satellite $2^{nd}$ edition (DVB-S2) receiver tuner IC. It is fabricated by using $0.18{\mu}m$ CMOS process. In order to obtain high linearity and low phase mismatch, the broadband SDC (Single-ended to Differential Converter) is designed with current mirror structure and cross-coupled capacitor and current source binding differential structure at VDD. The simulation result of SDC shows IIP3 of 11.9 dBm and IIP2 of 38 dBm. It consumes 5mA current with 2.7V supply voltage.

• ETRI Journal
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• v.37 no.5
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• pp.972-978
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• 2015

This paper proposes an accurate tunable-gain 1/x circuit. The output voltage of the 1/x circuit is generated by using a capacitor charging time that is inversely proportional to the input voltage. The output voltage is independent of the process parameters, because the output voltage depends on the ratios of the capacitors, resistors, and current mirrors. The voltage gain of the 1/x circuit is tuned by a 10-bit digital code. The 1/x circuit was fabricated using a $0.18{\mu}m$ CMOS process. Its core area is $0.011mm^2$ ($144{\mu}m{\times}78{\mu}m$), and it consumes $278{\mu}W$ at $V_{DD}=1.8V$ and $f_{CLK}=1MHz$. Its error is within 1.7% at $V_{IN}=0.05V$ to 1 V.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.106-109
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• 2004

A high-density 3-transistor cell one-time programmable (OTP) ROM array using standard CMOS Gate-Oxide antifuse (AF) is proposed, fabricated, and characterized with $0.18{\mu}m$ CMOS process. The proposed non-volatile high-density OTP ROM is composed of an array of 3-T OTP cells with the 3-T consisting of an nMOS AF, a high voltage (HV) blocking transistor, and a cell access transistor, all compatible with standard CMOS technology.

• 전자공학회논문지 IE
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• v.48 no.4
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• pp.13-18
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• 2011

In this paper, we have examined electrical characteristics of LDO regulator according to the process variation using a 1 ${\mu}m$ 20 V high voltage CMOS process. The electrical analysis of LDO regulator have been performed with three kind of SPICE parameter sets (Typ : typical, FF : fast, SS : slow) by process variation which cause change of SPICE parameter such as threshold voltage and effective channel length of MOS devices. From simulation results, we confirmed that in case of SS type SPICE parameter set, the LDO regulator has 3.6 mV/V line regulation, 0.4 mV/mA load regulation and 0.86 ${\mu}s$ output voltage settling time. And in case of Typ type SPICE parameter set, the LDO regulatorhas 4.2 mV/V line regulation, 0.44 mV/mA load regulation and 0.62 ${\mu}s$ output voltage settling time. Finally, in the FF type SPICE parameter set, the LDO regulator has 7.0 mV/V line regulation, 0.56 mV/mA load regulation and 0.27 ${\mu}s$ output voltage settling time.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.6247-6253
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• 2015

This paper presents the transient-response improved LDO regulator based on parallel error amplifiers. The proposed LDO regulator consists of an error amplifier (E/A1) which has a high gain and narrow bandwidth and a second amplifier (E/A2) which has low gain and wide bandwidth. These amplifiers are in parallel structure. Also, to improve the transient-response properties and slew-rate, some circuit block is added. Using pole-splitting technique, an external capacitor is reduced in a small on-chip size which is suitable for mobile devices. The proposed LDO has been designed and simulated using a Megna/Hynix $0.18{\mu}m$ CMOS parameters. Chip layout size is $500{\mu}m{\times}150{\mu}m$. Simulation results show 2.5 V output voltage and 100 mA load current in an input condition of 2.7 V ~ 3.3 V. Regulation Characteristic presents voltage variation of 26.1 mV and settling time of 510 ns from 100mA to 0 mA. Also, the proposed circuit has been shown voltage variation of 42.8 mV and settling time of 408 ns from 0 mA to 100 mA.

• Journal of IKEEE
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• v.20 no.2
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• pp.192-195
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• 2016

In this paper, we present a nanopower CMOS bandgap voltage reference working in sub-threshold region without resisters and bipolar junction transistors (BJT). Complimentary to absolute temperature (CTAT) voltage generator was realized by using two n-MOSFET pair with body bias circuit to make a sufficient amount of CTAT voltage. Proportional to absolute temperature (PTAT) voltage was generated from differential amplifier by using different aspect ratio of input MOSFET pair. The proposed circuits eliminate the use of resisters and BJTs for the operation in a sub-1V low supply voltage and for small die area. The circuits are implemented in 0.18um standard CMOS process. The simulation results show that the proposed sub-BGR generates a reference voltage of 290mV, obtaining temperature coefficient of 92 ppm/$^{\circ}C$ in -20 to $120^{\circ}C$ temperature range. The circuits consume 15.7nW at 0.63V supply.