• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.8 s.338
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• pp.53-60
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• 2005

Recently, sub-micron CMOS technologies have taken the place of III-V materials in a number of areas in integrated circuit designs, in particular even for the applications of gjgabit optical communication applications due to its low cost, high integration level, low power dissipation, and short turn-around time characteristics. In this paper, a four-channel transimpedance amplifier (TIA) array is realized in a standard 0.35mm CMOS technology Each channel includes an optical PIN photodiode and a TIA incorporating the fully differential regulated cascode (RGC) input configuration to achieve effectively enhanced transconductance(gm) and also exploiting the inductive peaking technique to extend the bandwidth. Post-layout simulations show that each TIA demonstrates the mid-band transimpedance gain of 59.3dBW, the -3dB bandwidth of 2.45GHz for 0.5pF photodiode capacitance, and the average noise current spectral density of 18.4pA/sqrt(Hz). The TIA array dissipates 92mw p in total from a single 3.3V supply The four-channel RGC TIA array is suitable for low-power, high-speed optical interconnect applications.

• Journal of information and communication convergence engineering
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• v.10 no.2
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• pp.187-193
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• 2012

A 1 GHz CMOS fast-lock phase-locked loop (PLL) is proposed to support the quick wake-up time of mobile consumer electronic devices. The proposed fast-lock PLL consists of a conventional charge-pump PLL, a frequency-to-digital converter (FDC) to measure the frequency of the input reference clock, and a digital-to-analog converter (DAC) to generate the initial control voltage of a voltage-controlled oscillator (VCO). The initial control voltage of the VCO is driven toward a reference voltage that is determined by the frequency of the input reference clock in the initial mode. For the speedy measurement of the frequency of the reference clock, an FDC with a parallel architecture is proposed, and its architecture is similar to that of a flash analog-to-digital converter. In addition, the frequency-to-voltage converter used in the FDC is designed simply by utilizing current integrators. The circuits for the proposed fast-lock scheme are disabled in the normal operation mode except in the initial mode to reduce the power consumption. The proposed PLL was fabricated by using a 0.18-${\mu}m$ 1-poly 6-metal complementary metal-oxide semiconductor (CMOS) process with a 1.8 V supply. This PLL multiplies the frequency of the reference clock by 10 and generates the four-phase clock. The simulation results show a reduction of up to 40% in the worstcase PLL lock time over the device operating conditions. The root-mean-square (rms) jitter of the proposed PLL was measured as 2.94 ps at 1 GHz. The area and power consumption of the implemented PLL are $400{\times}450{\mu}m^2$ and 6 mW, respectively.

• IEIE Transactions on Smart Processing and Computing
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• v.5 no.2
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• pp.71-76
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• 2016

A controller area network (CAN) receiver measures differential voltage on a bus to determine the bus level. Since 3.3V transceivers generate the same differential voltage as 5V transceivers (usually ${\geq}1.5V$), all transceivers on the bus (regardless of supply voltage) can decipher the message. In fact, the other transceivers cannot even determine or show that there is anything different about the differential voltage levels. A new CMOS RC oscillator insensitive supply voltage for clock generation in a CAN transceiver was fabricated and tested to compensate for this drawback in CAN communication. The system consists of a symmetrical circuit for voltage and current switches, two capacitors, two comparators, and an RS flip-flop. The operational principle is similar to a bistable multivibrator but the oscillation frequency can also be controlled via a bias current and reference voltage. The chip test experimental results show that oscillation frequency and power dissipation are 500 kHz and 5.48 mW, respectively at a supply voltage of 3.3 V. The chip, chip area is $0.021mm^2$, is fabricated with $0.18{\mu}m$ CMOS technology from SK hynix.

• ETRI Journal
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• v.29 no.4
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• pp.421-429
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• 2007

This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.6
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• pp.69-77
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• 2002

In this paper, we present the CDMA2000 1x compliant mobile station modem chip (SCom5010) implemented in a 0.18${\mu}{\textrm}{m}$ CMOS technology.[1] ARM940T cached processor. TeakLite DSP core, and other peripheral blocks are integrated with the baseband modem chip. Also we show novel verification methodologies and explain how this chip can be used as an emulation processor.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.693-695
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• 2016

A random and systematic jitter suppressed DLL is presented. The AC averages the delay time of successive delay stages and equalizes the delay time of all delay stages. Measurement results of the DLL-based clock generator fabricated in a one-poly six-metal $0.18{\mu}m$ CMOS process shows 13.4-ps rms jitter.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.627-628
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• 2006

A low-voltage switched-capacitor $2^{nd}$-order $\Sigma\Delta$ modulator using full feed-forward is introduced. It has two advantages: the unity signal transfer function and reduced signal swings inside the $\Sigma\Delta$ loop. These features greatly relax the DC gain and output swing requirements for Op-Amp in the low-voltage $\Sigma\Delta$ modulator. Implemented by a 0.18-${\mu}m$ CMOS technology, the $\Sigma\Delta$ modulator satisfies performance requirements for WCDMA and CDMA2000 standards.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.842-846
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• 2016

This paper presents a DC-DC buck converter which uses a sleep control to improve the power efficiency in a few mW light load condition. The sleep control turns off analog controller building blocks to reduce the static power losses during the off-duty period of pulse width modulation. For verification, a buck converter has been implemented in a $0.18{\mu}m$ CMOS process. The power efficiency has been improved from 76.7% to 82.5% with a 1.2 mW load. The maximum power efficiency is 95% with a 9 mW load.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.2
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• pp.320-324
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• 2011

A digital technique is adopted to calibrate the current mismatch of the charge pump (CP) in phase-locked loops. A 2 GHz charge pump PLL (CPPLL) is used to justify the proposed calibration technique. The proposed digital calibration technique is implemented simply using a counter. The proposed calibration technique reduces the calibration time by up to a maximum of 50% compared other with techniques. Also by using a dual-mode CP, good current matching characteristics can be achieved to compensate $0.5{\mu}A$ current mismatch in CP. It was designed in a standard $0.13{\mu}m$ CMOS technology. The maximum calibration time is $33.6{\mu}s$ and the average power is 18.38mW with 1.5V power supply and effective area is $0.1804mm^2$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.1
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• pp.82-89
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• 2014

Recently, inertial sensors are popularly used for the location and position recognition of small devices for M2M/IoT. In this paper, we designed low power, low noise, small sized 6-axis inertial sensor IC for mobile applications, which uses a 3-axis piezo-electric gyroscope sensor and a 3-axis piezo-resistive accelerometer sensor. Proposed IC is composed of 3-axis gyroscope readout circuit, two gyroscope sensor driving circuits, 3-axis accelerometer readout circuit, 16bit sigma-delta ADC, digital filter and control circuit and memory. TSMC $0.18{\mu}m$ mixed signal CMOS process was used. Proposed IC reduces 27% of the current consumption of LSM330.