• Journal of IKEEE
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• v.14 no.4
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• pp.257-262
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• 2010

We design a CMOS front-end with wide variable gain and low power consumption for 5.25 GHz band. To obtain wide variable gain range, a p-type metal-oxide-semiconductor field-effect transistor (PMOS FET) in the low noise amplifier (LNA) section is connected in parallel. For a mixer, single balanced and folded structure is employed for low power consumption. Using this structure, the bias currents of the transconductance and switching stages in the mixer can be separated without using current bleeding path. The proposed front-end has a maximum gain of 33.2 dB with a variable gain range of 17 dB. The noise figure and third-order input intercept point (IIP3) are 4.8 dB and -8.5 dBm, respectively. For this operation, the proposed front-end consumes 7.1 mW at high gain mode, and 2.6 mW at low gain mode. The simulation results are performed using Cadence RF spectre with the Taiwan Semiconductor Manufacturing Company (TSMC) $0.18\;{\mu}m$ CMOS technology.)

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.28-35
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• 2007

In this paper, an ultra low voltage SRAM design method based on dual-boosted cell bias technique is described. For each read/write cycle, the wordline and cell power node of the selected SRAM cells are boosted into two different voltage levels. This enhances SNM(Static Noise Margin) to a sufficient amount without an increase of the cell size, even at sub 1-V supply voltage. It also improves the SRAM circuit speed owing to increase of the cell read-out current. The proposed design technique has been demonstrated through 0.8-V, 32K-byte SRAM macro design in a $0.18-{\mu}m$ CMOS technology. Compared to the conventional cell bias technique, the simulation confirms an 135 % enhancement of the cell SNM and a 31 % faster speed at 0.8-V supply voltage. This prototype chip shows an access time of 23 ns and a power dissipation of $125\;{\mu}W/Hz$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.8
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• pp.31-40
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• 2009

This paper presents a design of a high performance DC-DC boost converter as a power module for SOC designs. It applied to this chip that reduced inductor and capacitor for integrating on a chip, and it operates with a switching frequency of 100MHz. It has reliability and stability in high switching frequency. The controller of DC-DC boost converter is designed by voltage-mode control method and compensated properly. The designed DC-DC converter is fabricated with the 0.18${\mu}m$ standard CMOS technology with a thick-gate oxide option. The overall die size is 8.14$mm^2$, and controller size is 1.15$mm^2$. The converter has the maximum efficiency over 76% for the output voltage of 4V and load current larger 300mA. The load regulation is 0.012% (0.5mV) for the load current change of 100mA.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.509-510
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• 2008

본 논문은 $0.18{\mu}m$ CMOS 공정을 사용하여 2.5Gb/s CMOS CDR을 설계하였다. CML type의 논리게이트를 이용하여 보다 높은 주파수의 대역의 데이터를 복원하기 위한 위상비교기(PD)와 PD의 up과 down신호를 지연없이 루프필터(LF)에 공급하기 위한 전하점프(CP) 그리고 외부 스위치를 통해 VCO이득을 조절할 수 있는 링 타입의 VCO로 구성되었다. 또한 VCO의 부담을 줄이기 위하여 half-rate 클럭 테크닉을 사용하였다. Cadence tool을 사용하여 모의실험 및 layout을 하였다. VCO이득은 100MHz/V이고, 클릭 jitter는 rising일 때 27ps, falling일 때 32ps로 우수한 결과를 얻을 수 있었다. 테스트칩 제작은 매그나침 $0.18{\um}$ CMOS 공정을 이용하였다. 칩 사이즈는 PAD를 포함하여 $850um{\times}750um$이다.

• Journal of electromagnetic engineering and science
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• v.9 no.1
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• pp.7-11
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• 2009

An Ultra-WideBand(UWB) Low-Noise Amplifier(LNA) is proposed and is implemented in a $0.18-{\mu}m$ CMOS technology. The proposed UWB LNA provides excellent wideband characteristics by combining a High-Pass Filter (HPF) with a conventional resistive-loaded LNA topology. In the proposed UWB LNA, the bell-shaped gain curve of the overall amplifier is much less dependent on the frequency response of the HPF embedded in the input stage. In addition, the adoption of fewer on-chip inductors in the input matching network permits a lower noise figure and a smaller chip area. Measurement results show a power gain of + 10 dB and an input return loss of more than - 9 dB over 2.7 to 6.2 GHz, a noise figure of 3.1 dB at 3.6 GHz and 7.8 dB at 6.2 GHz, an input PldB of - 12 dBm, and an IIP3 of - 0.2 dBm, while dissipating only 4.6 mA from a 1.8-V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.77-84
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• 2007

In this parer, a wideband low-noise amplifier (LNA) has been realized in a 0.18mm CMOS technology for the applications of subsampling direct-conversion RF receivers. By exploiting the inverter-type transimpedance input stage with a 3rd-order Chebyshev matching network, the wideband LNA demonstrates the measured results of the -3dB bandwidth of 5.35GHz, the power gain (S21) of $12\sim18dB$, the noise figure (NF) of $6.9\sim10.8dB$, and the broadband input/output impedance matching of less than -10dB/-24dB within the bandwidth, respectively. The chip dissipates 32.4mW from a single 1.8V supply, and occupies the area of $0.56\times1.0mm^2$.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.503-504
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• 2006

This paper presents the design and fabrication of a LC voltage-controlled oscillator (VCO) using 1-poly 6-metal mixed signal CMOS process. To obtain the high-quality factor inductor in LC resonator, patterned-ground shields (PGS) is placed under the symmetric inductor to reduce the effect from image current of resistive Si substrate. Moreover, due to the incapability of using thick top metal layer of which the thickness is over $2{\mu}m$, as used in many RF CMOS process, the structure of dual-metal layer in which we make electrically short circuit between the top metal and the next metal below it by a great number of via materials along the metal traces is adopted. The circuit operated from 2.63 GHz to 3.09 GHz tuned by accumulation-mode MOS varactor. The corresponding tuning range was 460 MHz. The measured phase noise was -115 dBc/Hz @ 1MHz offset at 2.63 GHz carrier frequency and the current consumption and the corresponding power consumption were about 2.6 mA and 4.68 mW respectively.

• Journal of Electrical Engineering and information Science
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• v.2 no.4
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• pp.14-18
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• 1997

A design methodology of the analog current-mode and width programmable integrator for a low voltage (3V) and low power application is developed and the integrator designed by this method is successfully fabricated by the 0.8$\mu\textrm{m}$ CMOS n-well single poly/double metal standard digital process. The integrator occupies the active chip area of 0.3$\textrm{mm}^2$. The experimental result illustrates a low power dissipation (1.0mW∼3.55 mW), 65dB of the dynamic range, and digitally and width programmability (10MHz∼30MHz) with an external digital 4 bit.

• Journal of IKEEE
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• v.14 no.1
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• pp.65-74
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• 2010

The Digital TV(DTV) standard has ushered in a new era in TV broadcasting and raised a great demand for DTV tuners. There are many challenges in designing a DTV tuner, of which the most difficult part is the frequency synthesizer. This paper presents the design of a frequency synthesizer for DTV Tuners in a $0.18{\mu}m$ CMOS process. It satisfies the DTV(ATSC) frequency band(54~806MHz). A scheme is proposed to cover the full band using only one VCO. The VCO has been designed to operate at 1.6~3.6GHz band such that the LO pulling effect is minimized, and reliable broadband characteristics have been achieved by reducing the variations of VCO gain and frequency step. The simulation results show that the designed VCO has gains of 59~94MHz(${\pm}$17.7MHz/V,${\pm}$23%) and frequency steps of 26~42.5MHz(${\pm}$8.25MHz/V,${\pm}$24%), and a very wide tuning range of 76.9%. The designed frequency synthesizer has a phase noise of -106dBc/Hz at 100kHz offset, and the lock time is less than $10{\mu}$sec. It consumes 20~23mA from a 1.8V supply, and the chip size including PADs is 2.0mm${\times}$1.8mm.

• Journal of IKEEE
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• v.18 no.2
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• pp.192-197
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• 2014

In this paper, $3^{rd}$ SDM with FDPA(Feedback Delay Pass Addition) technique to improve the input range is proposed. Conventional architecture with $3^{rd}$ transfer function is just made as adding a digital delay path in $2^{nd}$ SDM architecture. But the input range is very small because feedback path into the first integrator is increased. But, proposed architecture change feedback path into the first integrator to the second integrator, so input range could be improved about 9dB. The $3^{rd}$ SC SDM with only one operational amplifier was implemented using double-sampling technique. Simulation results for the proposed SDM designed in $0.18{\mu}m$ CMOS technology with power supply voltage 1.8V, signal bandwidth 20KHz and audible sampling frequency 2.8224MHz show SNR(Signal to Noise Ratio) of 83.8dB, the power consumption of $700{\mu}W$ and Dynamic Range of 82.8dB.